Model Validation Papers
Shielding
"EMI from Shielding Enclosures—FDTD Modeling and Measurements", Min Li 
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"EMI from Airflow Aperture Arrays in Shielding Enclosures", Min Li
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PC Board Design
Plane Decoupling
"Technical Report --- Printed Circuit Board Decoupling Capacitor Performance For Optimum EMC Design", Bruce Archambeault, Doug White 
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"Power Bus Modeling Using a Circuit Extraction Approach Based on a Mixed-Potential  Integral Equation", Jun Fan, et.al
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Multiple Board Configurations
"EMI Associated with Inter-board Connecitons for Module-on-backplane and stacked-card Configuration", Xiaoning Ye
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General Coupling and Crosstalk
"EMI Modeling of Coupling From High-Speed Digital to I/O Lines", Wei Cui, et.al
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"Coupling between a Microstrip Trace Pair", Ted Zeeff, et.al
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Microstrip / Stripline
"Numerical Modeling of Segmented Signal Return Planes", Yun Ji
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"EMI Modeling of Coupling From High-Speed Digital to I/O Lines", Wei Cui, et.al
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"Coupling between a Microstrip Trace Pair", Ted Zeeff, et.al 
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Standard Modeling Problems
"A Proposed Set of Specific Standard EMC Problems To Help Engineers Evaluate EMC Modeling Tools ", Bruce Archambeault, Juan Chen, Satich Pratepeni, Lauren Zhang, David Wittwer
                PDF format     
 

"Comparison of Various Numerical Modeling Tools Against a Standard Problem Concerning Heat Sink Emissions - Standard Modeling Paper 3", Bruce Archambeault, Juan Chen, Satich Pratepeni, Lauren Zhang, David Wittwer

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Questions concerning this site should be addressed to the Joint EMC Model Validation Committee chairman, Bruce Archambeault at barch@us.ibm.com