NEWSLETTER OF THE BALTIMORE SECTION OF THE IEEE
MAY 2004
The web site for the Baltimore section of the IEEE is:
http://www.ewh.ieee.org/r2/baltimore
IN THIS ISSUE:
3. IEEE-WIE
2004 Spring Symposium
1. COMSOC Meeting
The next COMSOC meeting for Baltimore will be on Monday May 3rd at 6 PM (Note: Monday due to speaker availability) in the Historical Electronics Museum in Linthicum. (directions below)
Food will be available at 5:30PM.
Title: 3G Wireless and Wireless LAN -
- Compete or Complement?
Speaker: Vijay K. Varma
Telcordia Technologies
Red Bank, NJ
Abstract:
After several years of research and standards activities, third generation (3G) wireless systems are beginning to be deployed. 3G wireless systems are expected to deliver wireless services with better performance, greater cost-effectiveness and significantly more content. In order to support these capabilities, 3G wireless systems have been designed from the outset to offer significantly higher data rates than do the current cellular mobile systems. 3G wireless is going through an evolution to all-IP core networks. Meanwhile, wireless LAN (WLAN) technology is becoming increasingly popular for providing IP connectivity in corporate, campus, and other hotspot environments and is seen by some as a potential platform for 4G wireless. WLAN technology is relatively cheap and quick to deploy, and provides high data rates. On the other hand, 3G technology can provide wide-area coverage. Do WLANs and 3G networks have to compete, or can they be complementary?
The talk addresses the competing and complementary characteristics of 3G wireless systems and WLANs and how the two technologies can be integrated to make wireless multimedia and other high data rate services a reality to a large population. This topic has attracted much attention in the industry as well as in academia.
Biography:
Vijay K. Varma is a Senior Scientist of the Wireless Systems Department at Telcordia Technologies. He has 17 years experience in wireless communications as a researcher and systems engineer. His current research interest includes 3G wireless network architectures, wireless-to-IP network interworking, the 3GPP IM subsystem protocols and 3G/WLAN integration. He has published several papers in the area of wireless communications and has given tutorials, organized workshops and sessions at various IEEE conferences. Dr. Varma received his Ph. D from Southern Methodist University, Dallas, TX in 1986 and M. Tech from Indian Institute of Technology, Kanpur, India in Electrical Engineering. Dr. Varma is a Senior Member of the IEEE and a member of Tau Beta Pi. Dr. Varma is a recipient of the Frederick E. Terman award from the School of Engineering and Applied Science, Southern Methodist University.
The meeting will be held at Historical Electronics Museum, Nursery Rd, Linthicum, MD.
Directions:
From Interstate 95, exit onto I-195 East to 295 North (Baltimore-Washington Parkway).
Take next exit, West Nursery Road exit, stay right on ramp.
Go through three stoplights.
Museum is on the left, just past the Marriott Hotel facing the hotel.
If you come to Elkridge Landing Rd you went 100 yards to far.
The Electronics Museum web site is located at:
Check the Baltimore Communication Society web site:
http://ewh.ieee.org/r2/baltimore/Chapter/Comm
2. EMC, AP, MTT Meeting
The IEEE Baltimore Section EMC, AP and MTT Societies invite you to a Presentation on EMI/EMC Computational Modelling for Real-World Engineering Problems by Dr. Bruce Archambeault Senior Member Technical Staff, IBM, NC.
Tuesday May 4, 2004
Northrop Grumman, Electronics Systems facility at BWI, Conference Room 603
See directions below.
Reception, Refreshments and Chapter
Business: 5:45 - 6:30 pm
Lecture and Discussion: 6:30 - 8:30 pm
http://ewh.ieee.org/r2/baltimore
Note: There will be no admission charge, however RSVPs would be appreciated by Monday 3, May 2004 in order to estimate the quantity of refreshments.
RSVP to:
EMC
Chair: Robert Berkovits,
410-993-5403,
rberkovits@northropgrumman.com
Vice
Chair: John Anderson, 410-573-7502,
janderson@alionscience.com
APS/MTT Chair: Dr. Thomas M. Walsh, 410-765-0403,
tmwalsh@northropgrumman.com
Vice
Chair: Doug Kremer,
410-993-3434,
dkremer@northropgrumman.com
Abstract:
The world of EMI/EMC compliance has become
more important than ever before, due to the higher speed electronics in lower
cost packages. The ‘old ways’ of best-guess design practices, and then fix the
EMI problems after the product is built are not acceptable in today’s market
place. Designs must be cost effective, and must pass regulatory requirements
the first time through the design cycle.
The old rules-of-thumb cannot be relied
upon to ensure success. A new set of tools is available to the EMI/EMC engineer,
which allow a more accurate estimation of the EMI/EMC effects of a system,
before that system is ever built. While the technology is not available today
to completely analyse the entire system with a single model, separate parts of
the system can be successfully modelled and accurate results be obtained.
Several vendors with software simulation tools
do not always have an understanding of which techniques will really work best
for a given set of problems. This talk provides a summary of the various
modelling techniques available today, and more importantly, the strengths and
weaknesses of each technique. Validation of modelling techniques and modelling
codes are discussed, as well as standard modelling problems to allow engineers
a more complete evaluation against potential vendor software packages.
Biography:
Dr. Bruce
Archambeault received his B.S.E.E degree from the University of New Hampshire
in 1977 and his M.S.E.E degree from Northeastern University in 1981. He
received his Ph. D. from the University of New Hampshire in 1997. His doctoral
research was in the area of computational electromagnetics applied to
real-world EMC problems. In 1981 he joined Digital Equipment Corporation and
through 1994 he had assignments ranging from EMC/TEMPEST product design and
testing to developing computational electromagnetic EMC-related software tools.
In 1994 he joined SETH Corporation where he continued to develop computational
electromagnetic EMC-related software tools and used them as a consulting engineer
in a variety of different industries. He recently joined IBM in Raleigh, N.C.
where he is a Senior member of Technical Staff, and a lead EMC engineer,
responsible for EMC tool development and use on a variety of products. During
his career in the U.S. Air Force he was responsible for in-house communications
security and TEMPEST/EMC related research and development projects.
Dr.
Archambeault has authored or co-authored a number of papers in computational
electromagnetics, mostly applied to real-world EMC applications. He is
currently a member of the Board of Directors on the IEEE EMC Society and a
member of the Board of Directors of the Applied Computational Electromagnetics
Society (ACES). He is the author of the book titled “PCB Design for Real-World
EMI Control” and the lead author of the book titled “EMI/EMC Computational
Modeling Handbook”. Dr. Archambeault is currently a Distinguished Lecturer for
the IEEE EMC Society.
Directions:
From Washington DC and the Capital Beltway (I-495):
Take either 295 (Baltimore Washington Parkway) or I-95 north toward Baltimore. Turn off on I-195 towards BWI (east) – turn south onto MD 170. NGC ES will be on your left. Proceed to the fourth traffic light (just past the entrance to Amtrak Way, on the right) and turn left into the parking lot at the end of the building
From the Annapolis area:
From the intersection of Routes 50 and 97, take Rt. 97 north to Rt.100 West. Exit at the next exit, MD 170 North (Aviation Blvd.). Take MD 170 north past lights at Dorsey Rd. and Stoney Run Rd. At the next light turn right into the parking lot at the west end of the Northrop Grumman building.
At the Facility:
Park anywhere at the west end of the building and go into the lobby next to the gate. Sign in with the guard; he will give you a visitor's badge. Room 603 is on the left.
3. IEEE-WIE 2004 Spring Symposium
The IEEE-WIE (Women In Engineering) Washington Area Affinity Group presents their 2004 Spring Symposium on “Developing Winning Proposals” at the University of Maryland College Park campus on Saturday, May 8, from 9:00 AM to 3:00 PM. The symposium is open to professionals as well as students. This should be an informative day of proposal writing and networking opportunities.
Topics include how to:
Read requests for proposals
Write a successful proposal
Identify mistakes in proposal writing
Follow up on a proposal with the customer
The web site for the IEEE-WIE is:
To register for this event online, go to the following site:
http://www.isr.umd.edu/ISR/wie
Location:
University of Maryland
Computer Science Instruction Center
(CSIC) Bldg #406
1st Floor Lecture Hall #1115
College Park, MD 20742
Contact:
Jennifer Lambert
Voice: 732-562-3870
Fax: 732-465-6447
4. IEEE-USA Careers Fly-In
On May 18 and 19, IEEE-USA will sponsor a conference in Washington, DC to discuss the following topics:
Jobs
Unemployment
Competitiveness
L-1 visa
H-1 visa
Offshore outsourcing
This is a chance to discuss career issues affecting engineers with members of Congress.
The IEEE-USA Fly-In will begin at 4:00 PM on Tuesday, May 18 with training sessions and briefings. Dinner will be provided. Visits to Congressional offices will be scheduled on Wednesday, May 19 between 8:00 AM and 4:00 PM.
Attendees should register for the Fly-In at the following:
http://www.ieeeusa.org/policy/Careerflyin
Please direct all questions regarding the Fly-In to:
202-785-0017
5. H-1B and L-1 Visas
To read about the IEEE-USA position on the H-1B and L-1 Visa programs, go to the following site:
http://www.ieeeusa.org/forum/POSITIONS
6. IEEE-USA Salary Calculator
IEEE-USA provides a salary comparison system for electrotechnology professionals. For more information, go to the following site:
http://www.ieeeusa.org/careers/salarycalculator
