WATT’S   NEW

 

NEWSLETTER   OF   THE   BALTIMORE   SECTION   OF   THE   IEEE

 

AUGUST   2009

 

 


The web site for the Baltimore section of the IEEE is:

 

http://www.ieee.org/baltimore

 

The web site for the Baltimore section newsletters is:

 

http://www.ieee.org/baltimore/WattsNew/IndexWattsNew.html

 

 


IN THIS ISSUE:

 

1.     IEEE 125th Anniversary Dinner and Talk

2.     Continuing Education Course for October

3.     Continuing Education Course for November

4.     Baltimore Region Conferences

 

 


1.             IEEE 125th Anniversary Dinner and Talk

 

The IEEE Baltimore Section is planning a dinner and talk to celebrate the 125th anniversary of the IEEE. The event will be held at the University of Maryland Baltimore County (UMBC) on Saturday October 24. The schedule is as follows:

 

5:00 PM – Light Reception

6:00 PM – Dinner

7:30 PM – Speaker

 

Our speaker will be Dr. Herwig Kogelnik. His bio is given below. We anticipate the cost per person to be between $25 and $30. A cash bar will be provided. Wine is $4 per glass and beer is $3 to $4 per bottle.

 

More information will be provided in the coming weeks.

 

 

Biography of Dr. Herwig Kogelnik:

 

Herwig Kogelnik’s groundbreaking work in photonics and optical communications has revolutionized modern lightwave communications technology. Dr. Kogelnik is credited with helping to revolutionize global information movement and management.

 

Since 1961, Dr. Kogelnik has been with Bell Laboratories, Holmdel, New Jersey, where he has served as Director of both the Electronics Research Laboratory and the Photonics Research Laboratory. His research has focused on optics, electronics, and communications, including work on holography, photonics, laser resonators, and Gaussian beams.

 

In 1971, Dr. Kogelnik, along with Dr. C.V. Shank, pioneered the distributed-feedback (DFB) laser. Additionally, his leadership in the development of practical wavelength division multiplexing (WDM) led to a groundbreaking dense WDM system, further revolutionizing lightwave communications by expanding capacity and lowering costs.

 

In the area of photonic switching, Dr. Kogelnik’s research with Dr. R.V. Schmidt led to the development of the reversal directional coupler wavelength switch, a mainstay of experimental photonic switching systems, and a necessary component in ultra high-speed optical networks. Under his leadership, the Photonics Research Laboratory developed many other fundamental components of optical communications, including high-speed avalanche photodiodes, tunable semiconductor lasers, photonic integrated circuits, and high-capacity amplified transmission systems.

 

Herwig Kogelnik was born in Graz, Austria, in 1932. He received his Dipl. Ing. degree from the Technische Hochschule Wien, Vienna, Austria in 1955, and a Doctorate in 1958, also from the Technische Hochschule. In 1960, he received a Ph.D. from OxfordUniversity.

 

Dr. Kogelnik has earned 34 patents through his career and is the author of 85 articles. He is a Fellow of both the IEEE and the Optical Society of America, which he served as Vice President in 1987 and President in 1989, and is an Honorary Fellow of St. Peter’s College at OxfordUniversity. He has received numerous awards, including the Optical Society of America’s Frederic Ives Medal in 1984, the IEEE David Sarnoff Award in 1989, the Joseph Johann Ritter von Prechtl Medal from the Technical University of Vienna, Austria in 1990, and the 1991 IEEE Lasers and Electro Optics Society Quantum Electronics Award.  He was elected to the National Academy of Engineering in 1978 and the National Academy of Science in 1994.

 

 


2.             Continuing Education Course for October

 

Oct 3, 2009 (Sat),   9 am – 1 pm

National Electronics Museum,

1745 W Nursery Rd, Linthicum Heights, MD 21090

 

Speaker:  Edward R. (Ted) Byrne

 

Catching up with Computer Software

 

Abstract

 

During the past 25 years we have been invaded by computers, big, small and smaller.  Today, computers sneak into almost every aspect of our lives.

 

During that same time, software design and programming have also completely changed, but not because the computers needed some new kind of instructions. Rather, software generation has changed because we humans haven't changed and so we need more help to keep up.

     

In this lecture we will review the steps leading up to the Object-Oriented software concept, which is the heart of almost any programming language today. We will cover in detail what Object- Oriented programming is, using, as examples, the evolution from C to C++, Java and C#.

     

Software programming has also evolved from an artistic craft to an outsourced commodity, making specification methods valuable capabilities. The specification of software projects has evolved along with the languages and we will describe the standard Object-Oriented Universal Modeling Language (UML). UML and its supporting software tools, allow us to model and specify what software projects are to do in a way both clients and developers can understand.

 

 

Edward R. (Ted) Byrne

Speaker Bio

 

Ted Byrne received his BS and MS in Electrical Engineering from Notre Dame University and his PhD in Systems Science from Polytechnic Institute of New York. After serving two years in the US Air Force as an engineer, he was discharged as a Captain, and began a 35 year career creating computer software for the telephone company laboratories. He holds one of the first US patents for software.


In 1992 he began another career as a teacher and consultant in software development practices and programming. He has taught for New Jersey Institute of Technology, Drew University, and the IEEE itself. He specializes in C, C++, Windows programming and Object-Oriented Design, to adult working programmers, often employees of defense industries.


Over the past several years he has begun a third career concentrating on computer-controlled medical information and diagnostic systems.


He is a senior life member of IEEE where his particular interest is Software Engineering. He recently retired from the Management Board of the IEEE Software Engineering Standards Committee and was chairperson of the Software Requirements Standard, ANSI/IEEE 830.


He lives in Chestertown, Maryland, He is married and has four children and six grandchildren. One of his sons is a doctor in the Baltimore area and a son-in-law is one of the delegates representing district 36, the eastern shore, in the Maryland legislature. He writes a column for a model train magazine.

 

 

Course applicants please contact Dr. Boris Gramatikov, Director for Continuing EE Education for the Baltimore Section, at:

bgramat@jhmi.edu

 

The website for continuing education for the Baltimore Section is:

http://ewh.ieee.org/r2/baltimore/continuing_education/CEEE.htm

 

 

3.             Continuing Education Course for November

 

Nov 21, 2009 (Sat),   9 am – 1 pm

National Electronics Museum,

1745 W Nursery Rd, Linthicum Heights, MD 21090

 

Speaker: Happy Holden

 

A PROGRAM of ADVANCED PRINTED CIRCUIT DESIGN:

COST, PERFORMANCE and MINIATURIZATION

Introduction To Advanced PWB Design

 

Abstract

 

DESCRIPTION:  As finer pitch devices all come into common use, for higher and higher speed logic, the need for advanced printed wiring boards (PWB) is essential - - both as the board and as the package.  The presentation will define how to select breakout patterns, circuit routing guidelines, manufacturing process features, microvia-HDI routing issues and techniques for widely accepted fine pitch and BGA components. 1.0 mm, 0.8 mm, 0.65 and 0.5 mm fine-pitch components are the focus of design rules and layer assignments, as well as FPGAs and ASIC to 3200 pins.  Some HDI design techniques will emphasize the improved electrical performance and signal integrity.  The overview of HDI technology is particularly useful for those not familiar with this technology. Participants are encouraged to bring along their technical questions for discussion.

 

Content

* The Need for Miniaturization in Design

* IPC Standards for Advanced Interconnects and HDI.

* IPC-2226 Design standards

* The Advantages of blind-vias & HDI with cost comparisons

* Fine-pitch and High-I/O BGA design rules, layer assignment, routing and signal-integrity issues

* Creating Boulevards to Increase Routing Density

* HDI analysis methodology

 

The Signal and Power Integrity (SI/PI) Performance of Adv. PWBs

 

DESCRIPTION:  High Density Interconnects (HDI) and microvias have benefits for more than just high-density and fine-pitch BGAs.  The high-frequency performance of HDI is superior to through-holes (TH) because of its lower inductance / capacitance and elimination of stubs. This presentation highlights the electrical performance benefits of HDI-microvias for not only improvements in signal integrity but reduction in power-supply impedance, resonances, current-density, decoupling capacitors and noise (power integrity).  EMI/RFI improvements are also documented in examples for OEM tests.

 

Content

* HDI Signal Integrity Benefits:  Circuit Noise Management   

* HDI Power Integrity Benefits:  Power Distribution Network (PDN)

* HDI Circuit Card Assembly Benefits:  Eliminate 90% of Decoupling Capacitors

* HDI Circuit Card Performance Benefits:  Reduce EMI/RFI

 

Design Features of Higher Density PWBs

 

DESCRIPTION: This short Seminar looks at advanced wiring technologies for high-density PWBs.  Increased density is a factor of line widths, spacings, via diameter and its land, the via architecture and new thin materials that allow for the proper impedances and crosstalk.   This Seminar will show how the stackup is determined and show the six (6) design features that allow wiring density of 4X what you would expect from a high-density through-hole PWB.  Seven (7) of the most common HDI stackups with their advantages and disadvantages are also highlighted.

 

Content

* Introduction To High-Density Design Metrics

What determines the ‘best’ high-density stackups

* Via Architectures

Various blind / buried via stackups

* HDI Stackups

Seven of the most used HDI stackups

 

 

Case Studies of Design Conversion to Higher Density PWBs

 

DESCRIPTION: A number of successful multilayer redesigns have been accomplished where advanced technology was employed to reduce the layers, size, and costs by reducing the COMPLEXITY of the former designs.  This is a talk to relate the successful Programs used by a number of large Aero/Military and Telecom OEMs to successfully implement High-Density Technologies in their Printed Circuit Board programs.  The talk will outline the process and provide several examples as Case Studies.:

 

Content:

* Critical New HDI Design Technologies

New principles in HDI design that make multilayer simplification possible

* Overview of The Process 

 How is it possible to reduce layers and/or size?

* Case Studies of Successful TH To HDI Redesigns

Three examples of the successful application of this New Design Process

* Putting It All Together- "Next Step"

How to learn more about “Advanced HDI Technology”

 

 

Happy Holden

Speaker Bio

 

Happy Holden is the Senior PCB Technologist for Mentor Graphic’s System Design Division in Longmont, CO. He is responsible for advanced and next generation printed circuit technology consulting for Mentor’s customers and MGC engineering. Prior to joining Mentor, he was the Advanced Technology Manager at Westwood Associates and Merix Corporations.  He retired from Hewlett-Packard after over 28 years. Mr. Holden formally managed Hewlett-Packard's application organizations in Taiwan and Hong Kong. His prior assignments with HP had been as director of PCB R&D. He holds degrees in Chemical Engineering and Computer Science.   He is a member of the IPC, SMTA, IMAPS and the IEEE.

 

 

Course applicants please contact Dr. Boris Gramatikov, Director for Continuing EE Education for the Baltimore Section, at:

bgramat@jhmi.edu

 

The website for continuing education for the Baltimore Section is:

http://ewh.ieee.org/r2/baltimore/continuing_education/CEEE.htm

 

 


4.             Baltimore Region Conferences

 

The following conferences are planned for Maryland, Washington, DC, and Northern Virginia. This list can be used for planning purposes and also represents potential volunteering opportunities.

 

 

Conference: 2009 17th International Conference on Geoinformatics

Conference Dates: 12 Aug - 14 Aug 2009

Location: George Mason University, Fairfax, VA, USA

Conference Web Site: http://www.geoinformatics2009.org

 

Conference: 2009 IEEE Workshop on Science, Technology, Engineering and Mathematics Enterprise: Economics Measures and Indicators (STEM Measures)

Conference Dates: 15 Sep - 18 Sep 2009

Location: TBD, Washington, DC, USA

 

Conference: 2009 IEEE 59th Annual Broadcast Symposium (BTS)

Conference Dates: 14 Oct - 16 Oct 2009

Location: The Westin Hotel, Alexandria, VA, USA

Conference Web Site: http://www.ieee.org/bts/symposium

 

Conference: 2009 IEEE Conference on Electrical Insulation and Dielectric Phenomena - (CEIDP 2009)

Conference Dates: 18 Oct - 21 Oct 2009

Location: Virginia Beach Resort Hotel, Virginia Beach, VA, USA

Conference Web Site: http://ewh.ieee.org/soc/dei/ceidp/

 

Conference: 2009 7th International Workshop on the Design of Reliable Communication Networks (DRCN)

Conference Dates: 25 Oct - 28 Oct 2009

Location: Westin Alexandria, Washington, DC, USA

Conference Web Site: http://www.drcn.us

 

Conference: 2009 Grand Challenges in Biomedical Engineering

Conference Dates: 05 Nov - 07 Nov 2009

Location: Bethesda Marriott, Bethesda, MD, USA

 

Conference: 2009 IEEE 40th Semiconductor Interface Specialists Conference (SISC)

Conference Dates: 03 Dec - 05 Dec 2009

Location: Key Bridge Marriott Hotel, Arlington, VA, USA

Conference Web Site: http://www.ieeesisc.org/

 

Conference: 2009 IEEE International Electron Devices Meeting (IEDM)

Conference Dates: 07 Dec - 09 Dec 2009

Location: Hilton Baltimore, Baltimore, MD, USA

Conference Web Site: http://www.ieee-iedm.org

 

Conference: 2009 International Semiconductor Device Research Symposium (ISDRS)

Conference Dates: 09 Dec - 11 Dec 2009

Location: University of Maryland, College Park, MD, USA

Conference Web Site: http://www.ece.umd.edu/isdrs/2009

 

Conference: 2010 11th Joint Magnetism and Magnetic Materials - INTERMAG Conference

Conference Dates: 17 Jan - 21 Jan 2010

Location: Washington Marriott, Washington, DC, USA

Conference Web Site: http://www.magnetism.org

 

Conference: 2010 IEEE International Radar Conference

Conference Dates: 10 May - 14 May 2010

Location: Marriott Crystal Gateway, Arlington, VA, USA

Conference Web Site: http://www.radar2010.com/

 

Conference: 2010 IEEE 37th International Conference on Plasma Sciences (ICOPS)

Conference Dates: 20 Jun - 24 Jun 2010

Location: Marriott Norfolk Waterside, Norfolk, VA, USA

Conference Web Site: http://www.eng.odu.edu/icops2010

 

Conference: 2010 American Control Conference - ACC 2010

Conference Dates: 30 Jun - 02 Jul 2010

Location: Baltimore Marriott Waterfront, Baltimore, MD, USA

Conference Web Site: http://www.a2c2.org/conferences/acc2010/

 

Conference: 2010 IEEE 60th Annual Broadcast Symposium (BTS)

Conference Dates: 20 Oct - 22 Oct 2010

Location: The Westin Alexandria, Alexandria, VA, USA

Conference Web Site: http://www.ieee.org/bts/symposium

 

Conference: 2010 IEEE Frontiers in Education Conference (FIE)

Conference Dates: 25 Oct - 30 Oct 2010

Location: Crystal Gateway Marriott, Arlington, VA, USA

Conference Web Site: http://fie.engrng.pitt.edu/