NEWSLETTER OF
THE
AUGUST 2009
The web site for the
https://www.ieee.org/baltimore
The web site for the
https://www.ieee.org/baltimore/WattsNew/IndexWattsNew.html
IN THIS ISSUE:
1. IEEE 125th Anniversary
Dinner and Talk
2. Continuing
Education Course for October
3. Continuing
Education Course for November
4. Baltimore
Region Conferences
1. IEEE 125th Anniversary Dinner and Talk
The IEEE Baltimore Section is planning a dinner and talk to celebrate the 125th anniversary of the IEEE. The event will be held at the University of Maryland Baltimore County (UMBC) on Saturday October 24. The schedule is as follows:
5:00 PM – Light Reception
6:00 PM – Dinner
7:30 PM – Speaker
Our speaker will be Dr. Herwig Kogelnik. His bio is given below. We anticipate the cost per person to be between $25 and $30. A cash bar will be provided. Wine is $4 per glass and beer is $3 to $4 per bottle.
More information will be provided in the coming weeks.
Biography of Dr. Herwig Kogelnik:
Herwig Kogelnik’s groundbreaking work in photonics and optical communications has revolutionized modern lightwave communications technology. Dr. Kogelnik is credited with helping to revolutionize global information movement and management.
Since 1961, Dr. Kogelnik has been with Bell Laboratories,
In 1971, Dr. Kogelnik, along with Dr. C.V. Shank, pioneered the distributed-feedback (DFB) laser. Additionally, his leadership in the development of practical wavelength division multiplexing (WDM) led to a groundbreaking dense WDM system, further revolutionizing lightwave communications by expanding capacity and lowering costs.
In the area of photonic switching, Dr. Kogelnik’s research with Dr. R.V. Schmidt led to the development of the reversal directional coupler wavelength switch, a mainstay of experimental photonic switching systems, and a necessary component in ultra high-speed optical networks. Under his leadership, the Photonics Research Laboratory developed many other fundamental components of optical communications, including high-speed avalanche photodiodes, tunable semiconductor lasers, photonic integrated circuits, and high-capacity amplified transmission systems.
Herwig Kogelnik
was born in Graz, Austria, in 1932. He received his Dipl. Ing. degree
from the Technische Hochschule Wien,
Dr. Kogelnik has earned 34 patents through his career and is the author of 85 articles. He is a Fellow of both the IEEE and the Optical Society of America, which he served as Vice President in 1987 and President in 1989, and is an Honorary Fellow of St. Peter’s College at OxfordUniversity. He has received numerous awards, including the Optical Society of America’s Frederic Ives Medal in 1984, the IEEE David Sarnoff Award in 1989, the Joseph Johann Ritter von Prechtl Medal from the Technical University of Vienna, Austria in 1990, and the 1991 IEEE Lasers and Electro Optics Society Quantum Electronics Award. He was elected to the National Academy of Engineering in 1978 and the National Academy of Science in 1994.
2. Continuing Education Course for October
Oct 3, 2009 (Sat), 9 am – 1 pm
Speaker: Edward R. (Ted) Byrne
Catching up with Computer Software
Abstract
During the past 25 years we have been invaded by computers, big, small and smaller. Today, computers sneak into almost every aspect of our lives.
During that same time, software design and programming have also completely changed, but not because the computers needed some new kind of instructions. Rather, software generation has changed because we humans haven't changed and so we need more help to keep up.
In this lecture we will review the steps leading up to the Object-Oriented software concept, which is the heart of almost any programming language today. We will cover in detail what Object- Oriented programming is, using, as examples, the evolution from C to C++, Java and C#.
Software programming has also evolved from an artistic craft to an outsourced commodity, making specification methods valuable capabilities. The specification of software projects has evolved along with the languages and we will describe the standard Object-Oriented Universal Modeling Language (UML). UML and its supporting software tools, allow us to model and specify what software projects are to do in a way both clients and developers can understand.
Edward R. (Ted)
Byrne
Speaker Bio
Ted Byrne
received his BS and MS in Electrical Engineering from
In 1992 he began another career as a teacher and consultant in software
development practices and programming. He has taught for New Jersey Institute
of Technology,
Over the past several years he has begun a third career concentrating on
computer-controlled medical information and diagnostic systems.
He is a senior life member of IEEE where his particular interest is Software
Engineering. He recently retired from the Management Board of the IEEE Software
Engineering Standards Committee and was chairperson of the Software Requirements
Standard, ANSI/IEEE 830.
He lives in
Course applicants please contact Dr. Boris Gramatikov, Director for Continuing EE Education for the Baltimore Section, at:
The website for continuing education for the Baltimore Section is:
https://ewh.ieee.org/r2/baltimore/continuing_education/CEEE.htm
3.
Continuing Education Course for November
Nov 21, 2009 (Sat), 9 am – 1 pm
Speaker: Happy Holden
A PROGRAM of ADVANCED PRINTED CIRCUIT DESIGN:
COST, PERFORMANCE and MINIATURIZATION
Introduction To Advanced PWB Design
Abstract
DESCRIPTION: As finer pitch devices all come into common use, for higher and higher speed logic, the need for advanced printed wiring boards (PWB) is essential - - both as the board and as the package. The presentation will define how to select breakout patterns, circuit routing guidelines, manufacturing process features, microvia-HDI routing issues and techniques for widely accepted fine pitch and BGA components. 1.0 mm, 0.8 mm, 0.65 and 0.5 mm fine-pitch components are the focus of design rules and layer assignments, as well as FPGAs and ASIC to 3200 pins. Some HDI design techniques will emphasize the improved electrical performance and signal integrity. The overview of HDI technology is particularly useful for those not familiar with this technology. Participants are encouraged to bring along their technical questions for discussion.
Content
* The Need for Miniaturization in Design
* IPC Standards for Advanced Interconnects and HDI.
* IPC-2226 Design standards
* The Advantages of blind-vias & HDI with cost comparisons
* Fine-pitch and High-I/O BGA design rules, layer assignment, routing and signal-integrity issues
* Creating Boulevards to Increase Routing Density
* HDI analysis methodology
The Signal and Power Integrity (SI/PI) Performance of Adv. PWBs
DESCRIPTION: High Density Interconnects (HDI) and microvias have benefits for more than just high-density and fine-pitch BGAs. The high-frequency performance of HDI is superior to through-holes (TH) because of its lower inductance / capacitance and elimination of stubs. This presentation highlights the electrical performance benefits of HDI-microvias for not only improvements in signal integrity but reduction in power-supply impedance, resonances, current-density, decoupling capacitors and noise (power integrity). EMI/RFI improvements are also documented in examples for OEM tests.
Content
* HDI Signal Integrity Benefits: Circuit Noise Management
* HDI Power Integrity Benefits: Power Distribution Network (PDN)
* HDI Circuit Card Assembly Benefits: Eliminate 90% of Decoupling Capacitors
* HDI Circuit Card Performance Benefits: Reduce EMI/RFI
Design Features of Higher Density PWBs
DESCRIPTION: This short Seminar looks at advanced wiring technologies for high-density PWBs. Increased density is a factor of line widths, spacings, via diameter and its land, the via architecture and new thin materials that allow for the proper impedances and crosstalk. This Seminar will show how the stackup is determined and show the six (6) design features that allow wiring density of 4X what you would expect from a high-density through-hole PWB. Seven (7) of the most common HDI stackups with their advantages and disadvantages are also highlighted.
Content
* Introduction To High-Density Design Metrics
What determines the ‘best’ high-density stackups
* Via Architectures
Various blind / buried via stackups
* HDI Stackups
Seven of the most used HDI stackups
Case Studies of Design Conversion to Higher Density PWBs
DESCRIPTION: A number of successful multilayer redesigns have been accomplished where advanced technology was employed to reduce the layers, size, and costs by reducing the COMPLEXITY of the former designs. This is a talk to relate the successful Programs used by a number of large Aero/Military and Telecom OEMs to successfully implement High-Density Technologies in their Printed Circuit Board programs. The talk will outline the process and provide several examples as Case Studies.:
Content:
* Critical New HDI Design Technologies
New principles in HDI design that make multilayer simplification possible
* Overview of The Process
How is it possible to reduce layers and/or size?
* Case Studies of Successful TH To HDI Redesigns
Three examples of the successful application of this New Design Process
* Putting It All Together- "Next Step"
How to learn more about “Advanced HDI Technology”
Happy Holden
Speaker Bio
Happy Holden is the Senior PCB Technologist for Mentor
Graphic’s System Design Division in
Course applicants please contact Dr. Boris Gramatikov, Director for Continuing EE Education for the Baltimore Section, at:
The website for continuing education for the Baltimore Section is:
https://ewh.ieee.org/r2/baltimore/continuing_education/CEEE.htm
4.
Baltimore
The following conferences are planned for
Conference: 2009 17th International Conference on Geoinformatics
Conference Dates: 12 Aug - 14 Aug 2009
Location:
Conference Web Site: https://www.geoinformatics2009.org
Conference: 2009 IEEE Workshop on Science, Technology,
Engineering and Mathematics
Conference Dates: 15 Sep - 18 Sep 2009
Location: TBD,
Conference: 2009 IEEE 59th Annual Broadcast Symposium (BTS)
Conference Dates: 14 Oct - 16 Oct 2009
Location: The Westin Hotel,
Conference Web Site: https://www.ieee.org/bts/symposium
Conference: 2009 IEEE Conference on Electrical Insulation and Dielectric Phenomena - (CEIDP 2009)
Conference Dates: 18 Oct - 21 Oct 2009
Location:
Conference Web Site: https://ewh.ieee.org/soc/dei/ceidp/
Conference: 2009 7th International Workshop on the Design of Reliable Communication Networks (DRCN)
Conference Dates: 25 Oct - 28 Oct 2009
Location:
Conference Web Site: https://www.drcn.us
Conference: 2009 Grand Challenges in Biomedical Engineering
Conference Dates: 05 Nov - 07 Nov 2009
Location:
Conference: 2009 IEEE 40th Semiconductor Interface Specialists Conference (SISC)
Conference Dates: 03 Dec - 05 Dec 2009
Location: Key Bridge Marriott Hotel,
Conference Web Site: https://www.ieeesisc.org/
Conference: 2009 IEEE International Electron Devices Meeting (IEDM)
Conference Dates: 07 Dec - 09 Dec 2009
Location: Hilton Baltimore,
Conference Web Site: https://www.ieee-iedm.org
Conference: 2009 International Semiconductor Device Research Symposium (ISDRS)
Conference Dates: 09 Dec - 11 Dec 2009
Location:
Conference Web Site: https://www.ece.umd.edu/isdrs/2009
Conference: 2010 11th Joint Magnetism and Magnetic Materials - INTERMAG Conference
Conference Dates: 17 Jan - 21 Jan 2010
Location:
Conference Web Site: https://www.magnetism.org
Conference: 2010 IEEE International Radar Conference
Conference Dates: 10 May - 14 May 2010
Location: Marriott Crystal Gateway,
Conference Web Site: https://www.radar2010.com/
Conference: 2010 IEEE 37th International Conference on Plasma Sciences (ICOPS)
Conference Dates: 20 Jun - 24 Jun 2010
Location: Marriott Norfolk Waterside,
Conference Web Site: https://www.eng.odu.edu/icops2010
Conference: 2010 American Control Conference - ACC 2010
Conference Dates: 30 Jun - 02 Jul 2010
Location:
Conference Web Site: https://www.a2c2.org/conferences/acc2010/
Conference: 2010 IEEE 60th Annual Broadcast Symposium (BTS)
Conference Dates: 20 Oct - 22 Oct 2010
Location: The Westin Alexandria,
Conference Web Site: https://www.ieee.org/bts/symposium
Conference: 2010 IEEE Frontiers in Education Conference (FIE)
Conference Dates: 25 Oct - 30 Oct 2010
Location: Crystal Gateway Marriott,
Conference Web Site: https://fie.engrng.pitt.edu/