NEWSLETTER OF
THE
OCTOBER 2009
The web site for the
The web site for the
http://www.ieee.org/baltimore/WattsNew/IndexWattsNew.html
IN THIS ISSUE:
1. IEEE 125th Anniversary
Dinner and Talk
2. Communications
Society Meeting
4. Continuing
Education Course for October
5. Continuing
Education Course for November
7. Washington
STEM Enterprise Event
9. Baltimore
Region Conferences
1. IEEE 125th Anniversary Dinner and Talk
The IEEE Baltimore Section is planning a dinner and talk to celebrate the 125th anniversary of the IEEE. The event will be held at the University of Maryland Baltimore County (UMBC) on Saturday October 24. The schedule is as follows:
5:00 PM – Light Reception
6:00 PM – Dinner
7:30 PM – Speaker
Our speaker will be Dr. Herwig Kogelnik. His bio and an abstract of his talk are given below. The cost per person is $28. The cost for students (grade school, high school, undergraduate and graduate) is $14. Kids 5 and under will be free. A cash bar will be provided. Wine is $4 per glass and beer is $3 to $4 per bottle.
In order to register for the event, send an email to Walt Willing (our treasurer) at:
waltwilling@ieee.org or walter.willing@ngc.com.
Also cc me at:
In the email, provide your name, address, phone number, and email address. Also provide the names of the people in your party. Checks need to be made out to IEEE. Send the checks to:
Walt Willing
Attention: IEEE Dinner
Checks must be in Walt’s hands by Thursday October 8. Directions to UMBC and the room location will be provided in a future email.
Speaker:
Dr. Herwig Kogelnik
herwig@alcatel-lucent.com
Biography:
Herwig Kogelnik’s groundbreaking work in photonics and optical communications has revolutionized modern lightwave communications technology. Dr. Kogelnik is credited with helping to revolutionize global information movement and management.
Since 1961, Dr. Kogelnik has been with Bell Laboratories,
In 1971, Dr. Kogelnik, along with Dr. C.V. Shank, pioneered the distributed-feedback (DFB) laser. Additionally, his leadership in the development of practical wavelength division multiplexing (WDM) led to a groundbreaking dense WDM system, further revolutionizing lightwave communications by expanding capacity and lowering costs.
In the area of photonic switching, Dr. Kogelnik’s research with Dr. R.V. Schmidt led to the development of the reversal directional coupler wavelength switch, a mainstay of experimental photonic switching systems, and a necessary component in ultra high-speed optical networks. Under his leadership, the Photonics Research Laboratory developed many other fundamental components of optical communications, including high-speed avalanche photodiodes, tunable semiconductor lasers, photonic integrated circuits, and high-capacity amplified transmission systems.
Herwig Kogelnik
was born in Graz, Austria, in 1932. He received his Dipl. Ing. Degree
from the Technische Hochschule Wien,
Dr. Kogelnik has earned 34 patents through his career and is the author of 85 articles. He is a Fellow of both the IEEE and the Optical Society of America, which he served as Vice President in 1987 and President in 1989, and is an Honorary Fellow of St. Peter’s College at OxfordUniversity. He has received numerous awards, including the Optical Society of America’s Frederic Ives Medal in 1984, the IEEE David Sarnoff Award in 1989, the Joseph Johann Ritter von Prechtl Medal from the Technical University of Vienna, Austria in 1990, and the 1991 IEEE Lasers and Electro Optics Society Quantum Electronics Award. He was elected to the National Academy of Engineering in 1978 and the National Academy of Science in 1994.
Title:
Perspectives on Optical Communications
Abstract:
The idea of communicating via light beam has been around for millennia, but progress of this technology in the last two decades is truly astonishing. Nearly one terameter (1000 million kilometers) of optical fiber are now deployed around the globe, providing a high-capacity network infrastructure for the world’s now dominant data traffic continuing to double its volume every year. The customers of this fiber network include the over one billion internet users who continue in their demands for newer and broader bandwidth services. In response, lightwave R&D has advanced the capacity of long-haul fiber transmission systems by a factor of 100 since the WDM revolution that started a little more than ten years ago, and continues to explore the increased networking flexibility of WDM.
There is strong technological progress in the technology of components and optical integrated circuitry that promise to further reduce networking cost and enable transmission and switching at higher data rates. Examples include monolithic transceivers that are widely tunable and operate at 40 Gb/s rates, optically integrated wavelength selective switches enabling multi-degree mesh- ROADMs, and field-tested PICS with 10 WDM channels operating at 10 Gb/s each. There are also highly promising advances in the use of sophisticated modulation formats such as multi-level DPSK with sampled self-coherent optical receivers using direct detection and digital signal post-processing. System research experiments using polarization-multiplexed DQPSK have demonstrated long-haul transmission at a record capacity of 25 Terabits/sec per fiber, and are exploring the cost-effective transmission of 10 WDM channels each carrying 100 GbEthernet traffic.
In the market we note the strong resurgence of construction of undersea fiber systems in the Pacific, and the large-scale deployment of fiber to the premise, FTTP, now reaching millions of users and providing the potential for broadband services such as GbEthernet to the home and business.
2. Communications Society Meeting
Title:
Random key graphs and the pre-distribution scheme of Eschenauer and Gligor
Speaker:
Armand M. Makowski
Department of Electrical and Computer Engineering
Institute for Systems Research
Date:
Monday, Oct. 12
Time:
5:30 PM – social, sandwiches, pretzels/chips, and water/soft drinks
6:00 PM – talk begins
Location:
Directions to the Museum may be found at the web site:
Abstract:
Random key graphs, also known as uniform random intersection graphs, appear in application areas as diverse as clustering analysis, collaborative filtering in recommender systems and key distribution in wireless sensor networks (WSNs). In this last context random key graphs are naturally associated with a random key predistribution scheme proposed by Eschenauer and Gligor.
In this talk we present some recent results concerning the structure of random key graphs. Similarities and differences with Erdos-Renyi graphs are given. We also discuss performance implications for the scheme of Eschenauer and Gligor. Highlights include:
(i) A zero-one law for graph connectivity (and its critical scaling) as the number of nodes becomes unboundedly large; (ii) A zero-one law (and its critical scaling) for the appearance of triangles; and (iii) Clustering coefficients and the "small world" property of random key graphs.
This is joint work with Ph.D. student Osman Yagan.
Biography:
Armand M. Makowski received the Licence en Sciences
Math\'ematiques from the Universit\'e Libre de Bruxelles in 1975, the M.S.
degree in Engineering-Systems Science from U.C.L.A. in 1976 and the Ph.D. degree
in Applied Mathematics from the
Armand Makowski was a C.R.B. Fellow of the Belgian-American Educational Foundation (BAEF) for the academic year 1975-76; he is also a 1984 recipient of the NSF Presidential Young Investigator Award and became an IEEE Fellow in 2006.
His research interests lie in applying advanced methods from the theory of stochastic processes to the modeling, design and performance evaluation of engineering systems, with particular emphasis on communication systems and networks.
3. IMS/AP Chapter Meeting
The IMS/AP chapter will be hosting Nicholas Buris on Oct
1st, 7PM at the
Title:
Advanced Wireless Product Design from Components to Smart Antenna Systems
Speaker:
Nicholas E. Buris, president
NEBENS
Abstract:
The ultimate objective of this talk is to propose research and development activities toward the achievement of the more advanced electromagnetic design capabilities required to address future industrial and consumer electronics products, particularly wireless products. In order to elucidate the need for better design capabilities, the talk starts with the description of some advanced antenna concepts for wireless handsets. The examples are chosen so that they span the key fundamental electromagnetic principles from electrically small to Multiple Input Multiple Output (MIMO) antennas. Recently, the number of papers on "antenna miniaturization" has dramatically increased. The performance trade-offs involved with miniaturization of antennas and key principles for robust comparisons will be briefly reviewed. Then, a new antenna design concept, the "exotenna" will be described. Miniaturization design concepts for consumer electronics try to minimize the antenna volume. This miniaturization often causes highly concentrated currents on the antenna and/or induced currents on the components and subsystems next to the antenna. Very careful design with "packaging" principles has to be applied for the successful implementation of such small antennas in wireless products. Typically, if one wants to capture and predict the antenna behavior well, CAD tools capable of dealing with geometric complexity are required. The exotenna, on the other hand, tries to achieve the maximum possible volume in the product by being distributed over its housing. Even though this often brings the antenna in contact with lossy mechanisms, detuning it and degrading its radiation efficiency, a distributed antenna system over the largest possible surface achieves remarkably good performance. The exotenna points toward engineering co-design and multidisciplinary optimization more than ever before. Moreover, in MIMO systems, the antenna is used to provide additional design degrees of freedom to accommodate more advanced communications systems. Some of the peculiarities of MIMO antenna performance are described, especially as they relate to the propagation environments that they operate in. System performance metrics are typically more robust when they pertain to higher layer attributes such as Bit Error Rate. Yet, the mapping of those metrics down to the antenna performance is not as straightforward, or unique. MIMO systems point to the direction of cross-layer design and optimization as never before. Now that the challenges of future antenna design have been clarified, the talk continues with a proposed framework for Multidisciplinary Optimization and Cross-Layered Design and Modeling. The framework outlines a structure and requirements for the participating software tools. Additionally, requirements on electromagnetic solvers are described so that they can handle these new complex tasks. In particular, the exciting new field of domain decomposition is mentioned and extensions that could simultaneously address geometric complexity and full wave solution of large antenna arrays encountered in MIMO systems.
4. Continuing Education Course for October
Oct 3, 2009 (Sat), 9 am – 1 pm
Speaker: Edward R. (Ted) Byrne
Title: Catching up with Computer Software
Abstract
During the past 25 years we have been invaded by computers, big, small and smaller. Today, computers sneak into almost every aspect of our lives.
During that same time, software design and programming have also completely changed, but not because the computers needed some new kind of instructions. Rather, software generation has changed because we humans haven't changed and so we need more help to keep up.
In this lecture we will review the steps leading up to the Object-Oriented software concept, which is the heart of almost any programming language today. We will cover in detail what Object- Oriented programming is, using, as examples, the evolution from C to C++, Java and C#.
Software programming has also evolved from an artistic craft to an outsourced commodity, making specification methods valuable capabilities. The specification of software projects has evolved along with the languages and we will describe the standard Object-Oriented Universal Modeling Language (UML). UML and its supporting software tools, allow us to model and specify what software projects are to do in a way both clients and developers can understand.
Edward R. (Ted) Byrne
Speaker Bio
Ted Byrne
received his BS and MS in Electrical Engineering from
In 1992 he began another career as a teacher and consultant in software
development practices and programming. He has taught for New Jersey Institute
of Technology,
Over the past several years he has begun a third career concentrating on
computer-controlled medical information and diagnostic systems.
He is a senior life member of IEEE where his particular interest is Software
Engineering. He recently retired from the Management Board of the IEEE Software
Engineering Standards Committee and was chairperson of the Software
Requirements Standard, ANSI/IEEE 830.
He lives in
Course applicants please contact Dr. Boris Gramatikov, Director for Continuing EE Education for the Baltimore Section, at:
The website for continuing education for the Baltimore Section is:
http://ewh.ieee.org/r2/baltimore/continuing_education/CEEE.htm
5. Continuing Education Course for November
Nov 21, 2009 (Sat), 9 am – 1 pm
Author: Happy Holden
Presenter: Dan Smith
Title:
A PROGRAM of ADVANCED PRINTED CIRCUIT DESIGN:
COST, PERFORMANCE and MINIATURIZATION
Introduction To Advanced PWB Design
Abstract
DESCRIPTION: As finer pitch devices all come into common use, for higher and higher speed logic, the need for advanced printed wiring boards (PWB) is essential - - both as the board and as the package. The presentation will define how to select breakout patterns, circuit routing guidelines, manufacturing process features, microvia-HDI routing issues and techniques for widely accepted fine pitch and BGA components. 1.0 mm, 0.8 mm, 0.65 and 0.5 mm fine-pitch components are the focus of design rules and layer assignments, as well as FPGAs and ASIC to 3200 pins. Some HDI design techniques will emphasize the improved electrical performance and signal integrity. The overview of HDI technology is particularly useful for those not familiar with this technology. Participants are encouraged to bring along their technical questions for discussion.
Content
* The Need for Miniaturization in Design
* IPC Standards for Advanced Interconnects and HDI.
* IPC-2226 Design standards
* The Advantages of blind-vias & HDI with cost comparisons
* Fine-pitch and High-I/O BGA design rules, layer assignment, routing and signal-integrity issues
* Creating Boulevards to Increase Routing Density
* HDI analysis methodology
The Signal and Power Integrity (SI/PI) Performance of Adv. PWBs
DESCRIPTION: High Density Interconnects (HDI) and microvias have benefits for more than just high-density and fine-pitch BGAs. The high-frequency performance of HDI is superior to through-holes (TH) because of its lower inductance / capacitance and elimination of stubs. This presentation highlights the electrical performance benefits of HDI-microvias for not only improvements in signal integrity but reduction in power-supply impedance, resonances, current-density, decoupling capacitors and noise (power integrity). EMI/RFI improvements are also documented in examples for OEM tests.
Content
* HDI Signal Integrity Benefits: Circuit Noise Management
* HDI Power Integrity Benefits: Power Distribution Network (PDN)
* HDI Circuit Card Assembly Benefits: Eliminate 90% of Decoupling Capacitors
* HDI Circuit Card Performance Benefits: Reduce EMI/RFI
Design Features of Higher Density PWBs
DESCRIPTION: This short Seminar looks at advanced wiring technologies for high-density PWBs. Increased density is a factor of line widths, spacings, via diameter and its land, the via architecture and new thin materials that allow for the proper impedances and crosstalk. This Seminar will show how the stackup is determined and show the six (6) design features that allow wiring density of 4X what you would expect from a high-density through-hole PWB. Seven (7) of the most common HDI stackups with their advantages and disadvantages are also highlighted.
Content
* Introduction To High-Density Design Metrics
What determines the ‘best’ high-density stackups
* Via Architectures
Various blind / buried via stackups
* HDI Stackups
Seven of the most used HDI stackups
Case Studies of Design Conversion to Higher Density PWBs
DESCRIPTION: A number of successful multilayer redesigns have been accomplished where advanced technology was employed to reduce the layers, size, and costs by reducing the COMPLEXITY of the former designs. This is a talk to relate the successful Programs used by a number of large Aero/Military and Telecom OEMs to successfully implement High-Density Technologies in their Printed Circuit Board programs. The talk will outline the process and provide several examples as Case Studies.:
Content:
* Critical New HDI Design Technologies
New principles in HDI design that make multilayer simplification possible
* Overview of The Process
How is it possible to reduce layers and/or size?
* Case Studies of Successful TH To HDI Redesigns
Three examples of the successful application of this New Design Process
* Putting It All Together- "Next Step"
How to learn more about “Advanced HDI Technology”
Happy Holden
Author Bio
Happy Holden is the Senior PCB Technologist for Mentor
Graphic’s System Design Division in
Dan Smith
Presenter Bio
Dan Smith has been involved in all aspects of the PCB
design process for over 30 years (Concept through Manufacturing), and over 24
years experience using a variety of EDA tools to design PCBs, Flex, Thick film
and ICs . He has worked as a librarian, designer, and programmer at
Course applicants please contact Dr. Boris Gramatikov, Director for Continuing EE Education for the Baltimore Section, at:
The website for continuing education for the Baltimore Section is:
http://ewh.ieee.org/r2/baltimore/continuing_education/CEEE.htm
6. K-12 Education
The following is a note from Emily N. Devillier, Society of American Military Engineers.
“Over the past year, the SAME Baltimore Post has begun to
set goals and objectives for reaching out to the K-12 Community throughout the
entire state of
This school year, the Baltimore Post would like to organize a K-12 Committee. This Committee would be a combination of professional society members (not just from SAME Baltimore Post) and the Science, Technology, Engineering, and Mathematics (STEM) Coordinators. The main goal of this Committee will be to improve communication between the educational and professional worlds. What workplace skills do students need to succeed, and how they are learned? We are looking for willing volunteers to assist with this important effort. Studies are showing that students are deciding earlier and earlier what career paths are of interest to them, and we definitely want the fields of engineering, science, mathematics, and technology to be well known to them. These students want to be exposed to a wide range of disciplines within the engineering and construction community. We would like to invite other professional societies and school coordinators to participate, using any materials or approaches they have developed, with the understanding that they will receive full recognition.
Our first event will be the February Society of American Military Engineers monthly meeting. The topic is K-12 education. We will be determining what workshop topics need to be addressed at this meeting and choosing a dinner speaker for the event. Aside from this event, we will also be discussing other topics of interest to both the professional and educational worlds.
If you are interested, please contact me (emily.n.devillier@usace.army.mil or 410-962-6731) or Jim Durkay (associatesocietycouncilesb@verizon.net).
Sincerely,
Emily N. Devillier
K-12 Outreach Coordinator
SAME
7.
Washington
NEWS from IEEE-USA
Bush, Obama Science & Technology Advisers to Speak at
STEM
WASHINGTON (28 August 2009) -- Members of the Bush and Obama science teams probably don't get together too often, but senior officials from both administrations will share the stage at an IEEE-USA event in October.
Dr. John Marburger, who served as science adviser to
former President George W. Bush, will be the keynote speaker at "STEM
Enterprise: Measures for Innovation and Competitiveness," an event
designed to measure the impact and effectiveness of all federal, state, private
and academic money spent on research and development in the STEM -- science,
technology, engineering and math -- enterprise. Work in this area serves as the
driving force for economic and social advancement in the
Marburger will be followed by Kei Koizumi, assistant director for federal research and development at the White House Office of Science and Technology Policy. Koizumi has a long and distinguished record as an expert on federal R&D expenditures. Prior to joining the Obama administration, he was director of the American Association for the Advancement of Science Research and Development Budget and Policy Program.
The workshop will be at
http://www.ieeeusa.org/calendar/conferences/stem/default.asp
Other invited speakers include Dr. Ron Hira, assistant professor of public policy, Rochester Institute of Technology; Dr. Diana Hicks, chair, school of public policy, Georgia Institute of Technology; Dr. James Hosek, director, Forces and Resources Policy Center, RAND National Security Research Division; Richard Ellis, president, Ellis Research Services, Carlisle, Pa.; Dr. Katy Borner, Victor H. Yngve professor of information science, Indiana University; and Ann Kushmerick, manager, Global Sales Support (Research Evaluation and Bibliometric Data) at Thomson Reuters.
IEEE-USA advances the public good and promotes the careers
and public policy interests of more than 210,000 engineers, scientists and
allied professionals who are
Contact: Chris McManes
IEEE-USA Public Relations Manager
Phone: 1 202 530 8356
E-mail: c.mcmanes@ieee.org
8. Paid Advertisement
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9.
Baltimore
The following conferences are planned for
Conference: 2009 IEEE 59th Annual Broadcast Symposium (BTS)
Conference Dates: 14 Oct - 16 Oct 2009
Location: The Westin Hotel,
Conference Web Site: http://www.ieee.org/bts/symposium
Conference: 2009 IEEE Conference on Electrical Insulation and Dielectric Phenomena - (CEIDP 2009)
Conference Dates: 18 Oct - 21 Oct 2009
Location:
Conference Web Site: http://ewh.ieee.org/soc/dei/ceidp/
Conference: 2009 7th International Workshop on the Design of Reliable Communication Networks (DRCN)
Conference Dates: 25 Oct - 28 Oct 2009
Location:
Conference Web Site: http://www.drcn.us
Conference: 2009 Grand Challenges in Biomedical Engineering
Conference Dates: 05 Nov - 07 Nov 2009
Location:
Conference: 2009 IEEE 40th Semiconductor Interface Specialists Conference (SISC)
Conference Dates: 03 Dec - 05 Dec 2009
Location: Key Bridge Marriott Hotel,
Conference Web Site: http://www.ieeesisc.org/
Conference: 2009 IEEE International Electron Devices Meeting (IEDM)
Conference Dates: 07 Dec - 09 Dec 2009
Location: Hilton Baltimore,
Conference Web Site: http://www.ieee-iedm.org
Conference: 2009 International Semiconductor Device Research Symposium (ISDRS)
Conference Dates: 09 Dec - 11 Dec 2009
Location:
Conference Web Site: http://www.ece.umd.edu/isdrs/2009
Conference: 2010 11th Joint Magnetism and Magnetic Materials - INTERMAG Conference
Conference Dates: 17 Jan - 21 Jan 2010
Location:
Conference Web Site: http://www.magnetism.org
Conference: 2010 IEEE International Radar Conference
Conference Dates: 10 May - 14 May 2010
Location: Marriott Crystal Gateway,
Conference Web Site: http://www.radar2010.com/
Conference: 2010 IEEE 37th International Conference on Plasma Sciences (ICOPS)
Conference Dates: 20 Jun - 24 Jun 2010
Location: Marriott Norfolk Waterside,
Conference Web Site: http://www.eng.odu.edu/icops2010
Conference: 2010 American Control Conference - ACC 2010
Conference Dates: 30 Jun - 02 Jul 2010
Location:
Conference Web Site: http://www.a2c2.org/conferences/acc2010/
Conference: 2010 IEEE 60th Annual Broadcast Symposium (BTS)
Conference Dates: 20 Oct - 22 Oct 2010
Location: The Westin Alexandria,
Conference Web Site: http://www.ieee.org/bts/symposium
Conference: 2010 IEEE Frontiers in Education Conference (FIE)
Conference Dates: 25 Oct - 30 Oct 2010
Location: Crystal Gateway Marriott,
Conference Web Site: http://fie.engrng.pitt.edu/