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Meeting Notice

The Southeastern Michigan IEEE EMC Society presents:

Advances in EMI Gasketing Technology

Presented by: Joe Butler

Manager New Business Development
Chomerics Division of Parker Hannifin Co.

Date: October 19, 2005

Time: 5:30 PM

Tentative Location: Fairlane Campus - U of M Dearborn (Map Code FCN)

University of Michigan
School of Management
Fairlane Center North - Room 126
19000 Hubbard Drive
Dearborn, MI 48126

Driving Directions

 

Please pre-register for this free event online at: http://www.emcsociety.org/eventregistration.html then select "October" Registration Deadline: Noon on the day prior to the event.

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Schedule of Events 
 

5:30 6:00 Pizza and Refreshments Sponsored by CMP

6:00  7:00 Technical Presentation
 
 
The Chapter Presentation is a FREE event. IEEE Non-Members Welcome!

The IEEE Southeastern Michigan EMC Homepage is http://www.emcsociety.org

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Abstract

Recent advances in EMI gasketing for electronics have occurred in the areas of foam based gasketing, conductive form-in-place gasketing, and conductive overmolded gasketing. Foam based EMI gaskets continue to be chosen solution for indoor electronics EMI shielding applications due to their lower cost, optimum compression/deflection performance, coupled with excellent EMI shielding effectiveness characteristics. Conductive form-in-place EMI gasketing continues strong as a shielding solution for commercial telecommunication equipment, specifically handheld wireless equipment, e.g., cellular telephones housings. Overmolded conductive gasketing solutions, comprised of conductive elastomers with either metal cans or conductively plated thermoplastics, have evolved as a competitive alternative to soldered metal cans on printed circuit boards. The full range of EMI gasketing solutions available to designers and the salient aspects of each will also be addressed during this talk.

Joe Butler

Bio

Joseph Butler currently has the dual roles of New Business Development Manager and Conductive Elastomers and Compounds Product Development Manager for the Chomerics Division of the Parker Hannifin Corporation. His current responsibilities include providing marketing and business development support and new product development/R&D leadership for the conductive compounds and conductive elastomer business units at Chomerics. Joe has over 35 years experience as an electromagnetic compatibility engineer, having worked in both the military and commercial industry for Raytheon, GenRad, and RCA in addition to his past 18 years at Chomerics. He is a senior life member and Past-President of the Institute of Electrical and Electronic Engineers (IEEE) Electromagnetic Compatibility Society (EMCS). Joe is also a past member of the IEEE EMCS Standards Committee and has been involved with EMC standards development within the American National Standards Institute (ANSI), the American Society for Testing and Materials (ASTM), the Association for the Advancement for Medical Instrumentation (AAMI) and the SAE (Society of Automotive Engineers). He has also previously been involved with EMC standards work with the Radio Technical Commission for Aeronautics (RTCA), the Electronic Industries Alliance (EIA), and the Scientific Apparatus Makers Association (SAMA). He is a National Association of Radio and Telecommunications Engineers (NARTE) certified EMC engineer and is a past member of the Board of Directors of NARTE. Joe has a BS in Engineering Physics from Merrimack College, an MA in Physics from Williams College, and an MBA from Northeastern University.

 

The IEEE Southeastern Michigan EMC Homepage is http://www.emcsociety.org