Rocky Mountain Chapter EMC Society

Our November meeting was ..

 Signal Integrity Design versus Radiated Emission Control
 

Download the presentation here
Pictures from the meeting

Special thanks to our sponsor: Ansoft Corporation

 

Presenter :  Dr. Cheung-Wei Lam (Speaker Bio) Senior EMC Engineer at Apple Computer.  

Date : November 20th 2002

Location:  TUV Product Service, 5541 Central Avenue Boulder, CO 80301-2846
Phone +1-303-786-7999 Click here for directions.

What we saw: While it is true that good signal integrity design can help reduce EMI, it alone is not sufficient to achieve good radiated emission control. This presentation discussed where designing for one can help the other and where one may have more stringent or even conflicting requirements with the other. In today's competitive markets, it is important for signal integrity engineers and EMC engineers to understand each other's need to reduce design iterations and minimize product costs. For engineers responsible for both disciplines, an in-depth understanding of the similarities and differences between the two is even more important. In this presentation, key signal integrity and EMC concepts were reviewed. Design considerations in the two disciplines were compared and contrasted at the chip and PCB levels.
 

Speaker Bio: Dr. Cheung-Wei Lam is currently a Senior EMC Engineer at Apple Computer, where he has implemented an EMC design and analysis process to facilitate on-time compliance at lower cost. At Apple, he is also engaged in IC, PCB and system level EMC R&D. Prior to joining Apple, he was a Co-Founder and Principal Engineer of Transcendent Design Technology. In addition to Transcendent, he has worked in Viewlogic's Advanced Development Group (formerly Quad Design Technology). During his years in the EDA industry, he has played key roles in the design and development of EMC, signal integrity and ground bounce analysis software tools. From 1988 to 1993, he was with the MIT Research Laboratory of Electronics, where his focus was on modeling of high-speed interconnects and superconducting transmission lines.

Dr. Lam received the B.S. degree in electronics from the Chinese University of Hong Kong, and the S.M. and PhD degrees in electrical engineering and computer science from MIT. He has served on the IEEE EMC/S TC-9 Computational EMC committee and the SAE EMC Modeling Task Force committee. He has given numerous papers, seminars, workshops, tutorials, and training courses on various EMC and signal integrity topics in the US, Europe and Japan. He was a co-recipient of the best paper award at the 1996 IEEE International Symposium on EMC. He is listed in Who's Who in Science and Engineering, Who's Who in America, and Who's Who in the World.
 

PICTURES FROM THE NOVEMBER MEETING