RMCEMC August 2003 Meeting
|
Our last meeting was.. Troubleshooting IC Package Noise
Download the presentation here Presenter :Doug Smith - Bio Date : August 28th 2003 What we saw: Parasitic coupling in IC packages can affect the performance of the chip inside, particularly when a new technology chip replaces an existing custom chip in the same package. Such a combination, a new chip in an old package, has been a source of many worked. -weekends on the part of engineers trying to track: down the resulting problem. A simple, effective way of evaluating if an IC package and chip combination is robust was unveiled - the humble paper clip. Using a paper clip with known dimensions, an estimate of the mutual inductance between the clip and the bond wires can be made. With this in hand, an estimate of the noise present on the signal wires in a package can be attempted, The procedure can be performed in an hour or two and results in knowing that the chip and package combination is robust or not. All that is needed is a good scope, a paper clip (or other stiff wire) and a suitable voltage probe . A live demo was made on a chip contained on a working modem board to illustrate the principles involved. Location : Front Range Community College 3645 W. 112th Avenue Westminster, CO 303-404-5539 / FAX 303-404-5199 Room : Speaker:. Mr. Smith held an FCC First Class Radiotelephone license by age 16 and a General Class amateur radio license at age 12. He received a B.E.E.E. degree from Vanderbilt University in 1969 and an M.S.E.E. degree from the California Institute of Technology in 1970. In 1970, he joined AT&T Bell Laboratories as a Member of Technical Staff. He retired in 1996 as a Distinguished Member of Technical Staff. From February 1996 to April 2000 he was Manager of EMC Development and Test at Auspex Systems in Santa Clara, CA. Mr. Smith currently is an independent consultant specializing in high frequency measurements, circuit/system design and verification, switching power supply noise and specifications, EMC, and immunity to transient noise. He is a Senior Member of the IEEE and a former member of the IEEE EMC Society Board of Directors. His technical interests include high frequency effects in electronic circuits, including topics such as Electromagnetic Compatibility (EMC), Electrostatic Discharge (ESD), Electrical Fast Transients (EFT), and other forms of pulsed electromagnetic interference. He also has been involved with FCC Part 68 testing and design, telephone system analog and digital design, IC design, and computer simulation of circuits. He has been granted over 15 patents, several on measurement apparatus. Mr. Smith has lectured at Oxford University, Vanderbilt University, AT&T Bell Labs, and at many public and private seminars on high frequency measurements, circuit design, ESD, and EMC. He is author of the book High Frequency Measurements and Noise in Electronic Circuits. His very popular website, http://emcesd.com (www.dsmith.org), draws many thousands of visitors each month to see over 60 technical articles as well as other features Speaker Contact Information: Doug Smith |
 |
 |
 |
 |
 |
 |
 |
 |