Description of Talk: Advanced microprocessors have high current demands at low voltage and require low impedance power across a broad frequency range. Silicon circuits want to look out from their power terminals and see a power supply impedance that is less than or equal to a target impedance. A target impedance may be calculated for any electronic system from the allowed voltage ripple and the maximum transient current. Decoupling capacitance on the chip and package inductance form a parallel RLC circuit that has a high impedance at the chip-package resonant frequency. Circuits on the chip are not able to get the power that they need at this resonant frequency and may not function as intended. This talk will examine and analyze the components that make up a power distribution system and show how to calculate a target impedance. Single Node and MultiNode Analysis with package parasitics will be used to derive a system approach to power distribution design.
Author: Larry Smith Sun MicroSystems: Larry D Smith received the BSEE degree from Rose Hulman Institute of Technology in 1975 and the MS degree in Material Science from the University of Vermont in 1983. After joining IBM in 1978, he worked in the areas of reliability, characterization, failure analysis, power supply and analog circuit design, packaging and signal integrity at Sun Microsystems since 1996. His current area of concentration is design of power distribution systems and reduction of simultaneous switch noise
Download past papers on Power Integrity from Larry Smith (and associates) here
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NOTE: At the request of the author, only attendees at the Conference are eligible for the presentation slides.
Title: Simulation Analysis of PCB Power/Ground Plane Decoupling new Solver Technology - Ansoft Corporation
Description of Talk : Proper understanding and mitigation of power and ground plane behavior has become increasingly important as PCB designs incorporate increasing trace density, increasing layer counts, and tightened operational specifications. Traditional analysis methods have been insufficient to rapidly address true distributed power and ground structure behavior, requiring the application of general .rules-of-thumb. as preventative decoupling strategies. A new two-dimensional finite-element solution technology now permits true analysis of even complex power and ground configurations, allowing direct pre- or post-route analysis of various decoupling options. This paper will outline the solution technology, provide verification comparisons to measurements to validate its accuracy, and propose a design methodology that may allow more optimized, cost-effective decoupling strategies
Author
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Title: ESD Validation - Kenneth Wyatt
Description of Talk : Any manufacturer interested in shipping product to the European Union is very familiar with the mandated ESD test requirements. Indeed Electrostatic Discharge testing has become ubiquitous in any hardware design lab concerned with error-free and robust product performance in adverse electromagnetic environments. However, although most EMC labs and hardware design facilities have an ESD simulator, almost none have the capability of verification of the simulators performance. This talk will cover the verification techniques with practical aspects of measurement and performance such as target design, waveforms, how to choose attenuators cables and oscilloscope performance requirements.. A live demonstration will conclude the talk.
Author: Ken Wyatt, Lab Manager Agilent Technologies
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.Title: Worldwide Wireless Standards
Description of Talk: Worldwide radio device compliance is extremely complicated and cumbersome. This presentation will cover the pitfalls that most manufacturers run into when placing a radio device on the global market and how to avoid them. Specifically:
Choosing an operation frequency
Designing for compliance
Testing for worldwide compliance
Overall compliance planning and budgeting
Author Todd Seeley - Principal
Engineer Todd
grew up in the Denver area and currently resides in Westminster. His extensive
background includes the design of hybrid, TCXO, VCXO, and OCXO open crystal
oscillators and RFID systems before he was tagged with a compliance/regulatory
role. After being "Tagged," Todd gradually expanded his expertise and knowledge
to eventually support the Compliance and Product Integrity needs for 11
different projects simultaneously in 6 divisions within a large corporation to
include requirements research, EMC/EMI/Safety design review and mitigation,
environmental and reliability test, radio and telecom compliance, project
planning and execution, policy implementation, and international regulatory
approvals throughout the globe. Through this experience, Todd has proven his
ability to work with every level of an organization to include marketing,
management, test groups, and manufacturing to implement and streamline the
compliance process to reduce product time-to-market.
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Title: IT & Medical Standards - What's on the horizon
Abstract: Electromagnetic Compatibility (EMC) standards, necessary for manufacturers to adhere to in order to sell their products abroad, are constantly changing. We will cover the latest changes to the EMC standards and test requirements as well as how to update your technical files, ensure uninterrupted sales by proper planning and preparation, the pro’s and con’s of embracing these new requirements, and how to schedule the necessary resources to implement the changes. Many project designers are frustrated with this moving target, but hopefully after this informative discussion, most of your questions will be put to rest. This presentation is applicable to the Information Technology, medical, and industrial industries.
Author:
Robert Cresswell - Principal Engineer
IALAbs, Boulder Colorado
Bob
has lived in Colorado for 35 years and currently resides in Rollinsville, CO. As
a co-founder of International Approvals Laboratories, Bob is extremely
knowledgeable in military testing, regulatory requirements for the European
Union, and has an extensive background in EMC/EMI testing and design. Having 25
years of direct EMC/EMI experience and 2 years experience in antenna design
under his belt, Bob undeniably understands commercial and military test
requirements as well as technical procedures, EMC/EMI mitigation, and design and
evaluation of electrical circuits and assemblies for EMC/EMI
compliance.
Bob also has a strong background in business having worked as
the Regional Operations Director for TUV America, his responsibilities included
and were not limited to budgeting, market analysis and penetration, staffing,
approval of quotations for all products, managing daily staff activities and
training, business development, customer satisfaction and all facility issues.
Helping to develop and cultivate EMC/EMI test facilities, Bob is extremely well
versed in what it takes to develop, run, and maintain an EMC
laboratory.
Bob has many years working with manufacturers and understands
the pressures to produce products and get them to market. This blend of
design/manufacturing along with agency testing experience, produces an
attractive business element for our clients, eliminating many of the pit-falls
associated with the complexity of Regulatory Compliance.
Affiliations and
former employers include: NARTE Certified Test Engineer (ATL-0141-E), IEEE
Denver Section Member (41241181) TUV America, Criterion Technology, Hach
Company, Co-Founder EMC Integrity, Ball Aerospace and Storage
Technology.
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