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welcome to the home page of the IEEE-CPMT Phoenix chapter. The purpose of this page is to provide information about the meetings and events we sponsor.
We attempt to have (i) a monthly seminar (ii) one technical tutorial per year
and (iii) a workshop in participation with the WAD chapter.
We
welcome and invite participation from speaker across the valley. Please contact
us for suggestions about speakers/seminar & tutorial topics. Contact!
Seminars
2010
|
|
Title |
Speaker / Affiliation |
|
29-Sep |
Flexible Printed Electronics (Macroelectronics) |
Dr. Robert Reuss,
Consultant |
|
25-Aug |
Package Benchmarking and Key Trends |
Mr. Joe Barrett, Director, ATTD Industry Intelligence and Analysis, Intel
Corporation |
|
18-Mar |
System Integration using Fan-out Wafer Level Package |
Scott Hayes, Packaging Technology Manager, Freescale Semiconductor |
|
23-Jun |
The Semblant Plasma Finish for Printed Circuit Boards |
Mr. Greg Thomas, Senior Vice President of Worldwide Customer Service, Semblant,
Inc., Chandler, Arizona 85286-1574 |
2009
|
|
Title |
Speaker / Affiliation |
|
4-Nov |
Microelectronics Packaging
Research and Education at ASU |
Prof. Amaneh Tasooji,
Mechanical, Aerospace, Chemical, and Materials Engineering Department, Arizona
State University, Tempe, Arizona |
|
22-Jul |
Tailoring nanostructures towards developing portable diagnostics tools for
clinical applications |
Dr. Shalini Prasad, PhD, Adjunct Faculty, Biomedical Engineering Department,
Oregon Health Science University, Portland, OR and Electrical and Computer
Engineering Department at Portland State University |
|
17-Jun |
Film-Bulk-Acoustic-Resonator for Sensing Biological / Chemical Molecules |
Dr. Junseok Chae, PhD, Assistant Professor,
Electrical Engineering, Arizona State University, Tempe, Arizona |
|
20-May |
Translational Nanoengineering for Medicine |
Dr. Pak Kin Wong, PhD, Aerospace and Mechanical Engineering, Biomedical
Engineering & Bio5 Institute,
University of Arizona, Tucson, AZ |
|
22-Apr |
Intellectual Property in Today’s World |
Mr. Ed Mischen, Founder and Director, In-Source International Consulting
Services, 4400 East Ridgewood Lane, Gilbert, AZ – 85298 |
|
18-Mar |
Design and Development of Microwaver Connectors. How mm Waver connectors differe
from RF connectors? |
Mr. David H. Shaff, General Manager, Microwave Product Division, Southwest
Microwave, Inc. (Tempe, AZ) |
|
11-Feb |
Optimizing Return on Investment Through Effective Project Management Structure
and Processes |
Mr. Mike McCloskey, Project Management Office, RF Division , Freescale
Semiconductor, Tempe, AZ 85284 |
2008
|
|
Title |
Speaker / Affiliation |
|
10-Dec |
ITRS Assembly & Packaging Roadmap |
Mr. Debendra Mallik, Principal Engineer, Intel Corporation, Chandler, Arizona |
|
8-Oct |
Electronics in Space System
Applications |
Mr. Rajul Parekh, Supplier Program Manager, Orbital Sciences Corporation,
Chandler, Arizona |
|
17-Sep |
Characterization of Nano Devices
and Nano Characterization of Materials |
Dr. Dieter K. Schroder, Professor, Department of Electrical Engineering and
Center for Solid State Electronics Research, Arizona State University, Tempe, AZ
85287-5706 |
|
27-Aug |
High-Bandwidth Microprocessor
Packaging: Trends, Solutions, and Issues |
Dr. Henning Braunisch, Process Technology Development Engineer, Component
Research, Intel Corporation, Chandler, Arizona |
|
13-Aug |
Overview of FA Methodologies for
Integrated Circuits |
Mr. Ryan Ross, Senior Failure Analysis Engineer, Freescale Semiconductor, Inc.,
Tempe, Arizona |
|
25-Jun |
MEMS Sensors and Packaging |
Dr. Junseok Chae, Assistant
Professor, Electrical Engineering, Ira A. Fulton School of Engineering, Arizona
State University, Tempe, AZ |
|
14-May |
Nano and Micro Technology-Based Next-Generation Electronics Cooling |
Dr. Ravi S. Prasher, Intel Corporation, Chandler, Arizona |
|
27-Feb |
Confidentiality Agreements: What
you Need to Know |
Mr. Fredric D. Bellamy, Partner, Steptoe & Johnson LLP, Phoenix, Arizona. |
|
30-Jan |
Materials Challenges for High
Density Microprocessor Packaging |
Dr. Gans Ganesan, Senior Staff
Packaging Engineer, Intel Corporation, Chandler, Arizona. |
Past Seminars
| March, 2007 Technical Seminar Announcement | Wednesday, March 21st, 2007 |
| Topic: Role of Materials in Microelectronics: Past, Present and Future |
| Speaker: Dr. Subhash Mahajan, Regents' Professor and Director, School of Materials, Arizona State University , Tempe , Arizona |
| Click [here] to download the details. |
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