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Electron Devices Society
Santa Clara Valley Chapter http://www.ewh.ieee.org/r6/scv/eds/ |
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The field of interest of the IEEE EDS is all aspects of the physics, theory,
and phenomena of electron and ion devices, such as elemental and compound
semiconductor devices, quantum effect devices, optical devices, tubes and
other vacuum devices. Please Post and Circulate within your Company. |
March 1, 2006 |
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For an online version of this announcement with active links, please visit http://www.ewh.ieee.org/r6/scv/eds/announcements/ieee-scv-eds-20060301.html |
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March 8 Meeting
Prof. Ron Schrimpf - Vanderbilt "Radiation Effects and Soft Errors" |
March 23 Meeting
Dr. Bill Bottoms - ITRS Committee Chair "2005 ITRS Packaging Roadmap Overview" |
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Past non-IEEE Events
Stanford Campus Events |
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IEEE SCV EDS Email List |
Upcoming IEEE SCV EDS Evening Meeting:
March 8, 2006 IEEE SCV EDS Meeting:
Abstract: Scaling of semiconductor technologies has created concern that future generations of integrated circuits will exhibit unacceptable levels of reliability due to radiation induced soft errors. Each error is a transient effect produced by the interaction of a single ionizing particle with a sensitive device. These particles may be produced by the reactions of cosmic rays in the atmosphere or they may originate from trace amounts of radioactive materials in packages or the surrounding environment. While these issues are particularly serious for space and defense systems, they are becoming an increasing concern for terrestrial applications that demand high reliability. In addition to single-event effects, electronics also may suffer parametric degradation or catastrophic failure caused by exposure to radiation. |
Upcoming IEEE SCV EDS Evening Meeting:
Biography: He joined Vanderbilt in 1996 and was an Invited Professor at the University of Montpellier II, France, in 2000. Ron Schrimpf is a Professor of Electrical Engineering at Vanderbilt University, where his research activities focus on microelectronics and semiconductor devices. In particular, he has a very active research program dealing with the effects of radiation on semiconductor devices and integrated circuits. Ron also is the Director of Vanderbilt’s Institute for Space and Defense Electronics (ISDE). The engineering staff of ISDE performs design, analysis, and modeling work for a variety of space and defense-oriented organizations, as well as commercial semiconductor companies. He is also Chairman of the IEEE Nuclear and Plasma Sciences Society (NPSS) Radiation Effects Steering Group. For more information on Ron Schrimpf - Vanderbilt For more information on the Vanderbilt ISDE For more information on the IEEE NPSS |
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Upcoming IEEE SCV Joint CPMT/EDS Luncheon Meeting:
March 23, 2006 IEEE SCV Joint CPMT/EDS Meeting:
Abstract: Bill Bottoms, Chair of the ITRS Assembly and Packaging Technical Working Group (ITWG), will talk about the current and future directions, challenges and potential solutions, as seen from the perspective of the ITRS Assembly and Packaging Committee. He will address the near-term assembly and packaging roadmap requirements and discuss new requirements and potential solutions to meet market needs in the longer term. Today, assembly and packaging is a limiting factor in both the cost and performance of electronic systems. This has resulted in an acceleration of innovation. Design concepts, packaging architectures, materials, manufacturing processes, and systems integration technologies are all changing rapidly. As traditional Moore's-law scaling becomes more difficult, assembly and packaging innovation allowing scaling in the third dimension is taking up the slack. Wireless and mixed signal devices, bio-chips, optoelectronics and MEMS have placed new requirements on packaging and assembly. Come listen to the latest output from the ITRS Assembly and Packaging ITWG, and offer your insights for the discussion session which follows Dr. Bottoms' talk. |
Upcoming IEEE SCV Joint CPMT/EDS Luncheon Meeting:
Biography: In 1981, after serving for several years on the faculty of Princeton University, Dr. Bottoms was named the first President of the newly formed Semiconductor Equipment Group of Varian Associates. He resigned from Varian in 1985 to spend full time in the venture capital industry. Dr. Bottoms was a General Partner of Patricof and Co. Ventures Inc, a leading international venture capital firm, from 1985 until he joined Credence Systems Corporation as its Chairman and CEO in July of 1996. He has participated in the founding of several companies in the semiconductor industry including Credence Systems Corporation and Tessera. Dr. Bottoms founded Third Millennium Test Solutions in 1999, and currently serves as its Chairman and CEO. Dr. Bottoms has been appointed to a number of government committees and was Chairman of the Technical Advisory Committee to the U.S. Export Control Commission for Semiconductor Equipment and Materials. He has served as Chairman of the National Research Council Board on Assessment of NIST Programs; Co-chair of the Sematech Supplier Roundtable for Assembly and Packaging; a member of the International Technology Roadmap Committee (ITRS), and chairman of its Technical Working Group for Assembly and Packaging. He currently is a member of the board of Tulane University and serves on the Boards of several private corporations. He is also a member of the Industrial Advisory Board for the University of California Lawrence Livermore National Laboratory (LLNL). For more information on the 2003 ITRS - Assembly and Packaging For more information on Dr. Bill Bottoms - 3MTS Executive Team For more information on IEEE SCV CPMT Meetings |
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Electron Devices Society (EDS) Chapter when desired. |
The IEEE SCV EDS Email Distribution List: How to Subscribe/Unsubscribe Subscribe to the IEEE SCV EDS Email Distribution List to UNSUBSCRIBE: unsubscribe eds-chap-scv Your email address is automatically captured by LISTSERV. To unsubscribe, it must agree exactly with the email address you used to subscribe to the Dlist. Use a two-step procedure to change from an old to a new email address. First, send an unsubscribe message using your old email address. Second, re-subscribe to the IEEE SCV EDS Dlist by sending a subscribe message using your new email address. Send email to the IEEE SCV EDS Dlist Administrator if you no longer have access to an old email address that you would like to delete so we can keep the IEEE SCV EDS Dlist database current. Go to the IEEE SCV EDS Dlist URL for more information about how to use our email distribution list. Email the IEEE SCV EDS Dlist Administrator for assistance with special cases. Visit the IEEE SCV Electron Devices Society Website Visit the IEEE SCV EDS Website at http://www.ewh.ieee.org/r6/scv/eds/ the first week of each month for more details about the IEEE SCV Electron Devices Society's upcoming monthly events, as well as the speaker slide sets for the IEEE SCV EDS past events.
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