Upcoming IEEE SCV EDS Evening Meeting:
Tuesday, April 10, 2007 IEEE SCV EDS Meeting:
"Current Limitations of Floating Gate NVM and New Alternatives"
Speaker: Albert Bergemont - Maxim Integrated Products
Subject: "Current Limitations of Floating Gate NVM and New Alternatives"
Location: National Semiconductor Building E Auditorium,
2900 Semiconductor Drive, Santa Clara, CA 95051.
See the NSC Campus driving directions
and the NSC Building E location map
Time: 6:00 PM - Pizza , 6:15 PM - Lecture
Speaker Contact:
Jayasimha Prasad
Abstract:
This talk will review the expected flash memory scaling limits
below 45 nanometers and present the most promising emerging
flash memory technologies for mass storage applications.
Floating gate flash memory scaling has been phenomenal in the
last 15 years. As a result, the overall flash memory market
has grown at an unprecedented pace, mainly driven by exploding
customer demand for mobile mass storage applications such as
digital cameras, MP3 players, and cell phones.
In such a large commodity market, the course for further flash
memory cell scaling has led to tremendous R&D activity in the
last few years with NAND density doubling almost every year.
Although it is expected that flash memory cells will continue
to scale, there are several physical limitations to confront,
and scaling down beyond 45nm is a concern, especially for
the floating gate memory architectures.
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Upcoming IEEE SCV EDS Evening Meeting:
Biography:
Albert Bergemont was born in Toulouse, France, in 1953. He graduated
from the French National Institute of Applied Sciences, where he
received the B.S degree in Physics and Solid State Physics in 1975.
Up to 1995, he was mainly involved with technology development
of non-volatile technologies (stand-alone EEPROM, EPROM, FLASH)
successively at Harris Semiconductor (first CMOS EEPROM, ahead of Intel),
SGS-THOMSON Micro (several NVM platforms from 0.8µm down to 0.35µm)
and National Semiconductor (first AMG EPROM with Boaz Eitan, and first
contact-less NOR Virtual Ground Flash, using channel erase, ahead of
all the other semiconductor industry players.
From 1995 to 2000 at National Semiconductor, he also developed and
transferred successfully to production three generations of core CMOS
and mixed-mode modules down to 0.18µm.
He invented and demonstrated ahead of all the industry the free P-channel
OTP and MTP concepts, now widely used worldwide. He also developed with
Carver Mead the first Active Pixel Sensor CMOS imager (0.18µm), while
the rest of the world was still using CCDs.
He joined Maxim Integrated Products in 2000, where he is currently the
TR&D Executive Director. He is in charge of core analog CMOS/Bipolar/HV
technology platforms which also feature embedded NVM (EEPROM and Flash).
He has authored and co-authored around 50 technical papers.
He currently holds 181 patents with a few more pending at Maxim.
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