Upcoming IEEE SCV EDS Evening Meeting:
Friday, February 8, 2008 IEEE SCV EDS Meeting:
"Ultra-thin Chips - a New Paradigm in Silicon Technology"
Speaker: Dr. Joachim N. Burghartz, Institute for Microelectronics Stuttgart (IMS CHIPS
Subject: "Ultra-thin Chips - a New Paradigm in Silicon Technology"
Location: National Semiconductor, Building E1, Conference Center,
2900 Semiconductor Drive, Santa Clara, CA 95051.
See the NSC Campus driving directions
and the NSC Building E location map
Time: 5:15 PM - Pizza , 5:30 PM - Lecture
Speaker Contact:
Samar Saha
Abstract:
In contrast to conventional thick silicon chips ultra-thin chips will be the basis for new applications,
such as 3D integrated circuits (3D-ICs) and plastic electronics. This talk will introduce and compare
two generically different process technologies that can be exploited for the fabrication of ICs on
extremely thin chips. Furthermore, several application results and demonstrations will be presented
and discussed based on material that has been presented at the recent IEDM and ISSCC conferences.
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Upcoming IEEE SCV EDS Evening Meeting:
Biography:
Joachim N. Burghartz is an IEEE Fellow, an IEEE Distinguished Lecturer, and an AdCom member of
the IEEE Electron Devices Society. He received his MS degree from RWTH Aachen in 1982 and his
PhD degree in 1987 from the University of Stuttgart, both in Germany.
From 1987 thru 1998 he was with the IBM T. J. Watson Research Center in Yorktown Heights,
New York, where he was engaged in early development of SiGe HBT technology and later in the
integration of passive components, particularly inductors, for application to monolithic RF
circuits. From 1998 until 2005 he was with TU Delft in the Netherlands as a full professor
and from 2001 as the Scientific Director of the Delft research institute DIMES.
In fall 2005 he moved to Stuttgart, Germany, to head the Institute for Microelectronics Stuttgart
(IMS CHIPS). In addition he is affiliated with the University of Stuttgart as a full professor.
Dr. Burghartz has published more than 250 reviewed articles and holds some 30 patents.
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