Upcoming Event: Annual Christmas Lecture


Date: Tuesday, December 15, 2009

6:00pm: Networking & catered holiday dinner
7:00pm: Presentation
8:00pm: Adjourn

Location: National Semiconductor Building E Auditorium

Cost: $10/person, free for K-12 students or younger.

Dinner Menu:
Main Entrees: 1. Texas B.B.Q Ribs; 2. Chicken Marsala; 3. Cheese Tortellini Bake (vegetarian)
Sides: 1. Steamed Rice; 2. Garlic Bread; 3. Dinner Rolls
Salads: 1. Green Salad Bowl; 2. Fresh Fruit Salad Bowl; 3. Roasted Potatoes
Plus desserts and drinks.

Registration: Registration in advance is required. NO WALK-INS!

Title

Origami Holiday Lecture and Class

Speaker

Dr. Robert Lang

Abstract

Preying Mantis
Our December meeting has traditionally been something the whole family could come and enjoy, but with a scientific angle to it. Origami, for those who aren't familiar with it, is the ancient Japanese art making objects through paper folding designs, from one piece of paper, usually with no cuts. In more recent years, computer programs have allowed folding diagrams to be developed for arbitrarily designed objects: something our speaker has helped to advance.

Robert Lang has made his living over the past 8 years as one of the world's more famous origami artists, making folded artworks for art collectors, television commercials, and working with Lawrence Livermore National Laboratory on how to fold a collapsible telescope lens, among other projects. In his spare time, he is the Editor-in-Chief of the IEEE Photonics Society's most established publication: the Journal of Quantum Electronics. He also continues to stay involved in laser projects through consulting assignments and in 2009 received Caltech's highest honor, the Distinguished Alumni Award.

Our Chapter Chair Bob Herrick followed Robert's work back 17 years ago when he was doing semiconductor laser research at Spectra Diode Labs, where he worked his way to the position of VP of R&D. He's been asked to start out the presentation with a discussion of how he went from SDL during the crazy telecom boom and bust, to becoming a professional origami artist. He will follow with material from his famous presentation, "From Flapping Birds to Space Telescopes: the Modern Science of Origami", which has been delivered at universities, companies, and museums worldwide, and is available in abbreviated form below in the TED video link. In addition, he will include a live demonstration, and handouts so you can try your hand at folding yourself. He had authored, coauthored, or edited 9 books on origami, including his latest, "Origami4", which explores connections between origami, math, science, technology, and education. We will be giving a few books away to lucky raffle winners.

Come join us for this holiday celebration, and bring friends and family! Sign up in advance is required, since capacity crowds are expected.

Links to the work of Dr. Robert Lang:

Biography

Dr. Robert Lang
Robert J. Lang received his BS from Caltech, MS from Stanford, and Ph.D. from Caltech. After a postdoc at Standard Elektrik Lorenz AG, he worked at NASA's Jet Propulsion Laboratory carrying out research on semiconductor lasers and optoelectronics. In 1992 he joined Spectra Diode Laboratories, where he led research on high-power lasers including unstable resonator diode lasers, high-power DFBs, tunable lasers and others, eventually becoming Vice-President of Research and Development. In 2000, he took over Component Packaging Development for SDL, Inc., developing and delivering Telcordia-qualified high-power pump laser modules to manufacturing and sale. In 2001, he left SDL (then JDSU) to focus on his long-time passion, origami, an art in which he is a recognized world master. Since then he has divided his time between exhibitions, writing, and lecturing on origami and its underlying mathematics in forums both artistic and technical, and consulting in lasers and optoelectronics, most recently in the area of speckle-based position sensors. He is the author or co-author of 80 refereed papers and over 50 patents awarded and pending. In 2009 he was awarded Caltech's highest honor, the Distinguished Alumni Award. He is a member of the IEEE Photonics Society, a Fellow of the Optical Society of America, and the current Editor-in-Chief of the IEEE Journal of Quantum Electronics.

January Event: Annual Joint Meeting with SCV-CPMT


Date: Tuesday, January 13, 2010

6:30pm: Seated dinner ($25 if reserved by Jan. 11; $30 after & at door; vegetarian available)
7:30pm: Presentation (no cost)
8:30pm: Adjourn

Location: Biltmore Hotel, 2151 Laurelwood Rd, Santa Clara

Reservation at SCV-CPMT website

Title

High-Reliability Through Silicon Via (TSV) Solutions for Image Sensor Packaging

Speaker

Dr. Bel Haba, Fellow & CTO of ICM division, Tessera

Abstract

There is no doubt that the potential of imaging is astronomical. Current and potential markets include digital still cameras, business applications, Web-cams, cell phone cameras, security cameras, gaming, video, automotive and toys. In 2009, the industry shipped 2.5B image sensor units with an average selling price of $5 - providing a total addressable market of $12B. This presentation will discuss image sensor and camera module trends and growth. It will trace the growing movement in the image sensor market from chip-on-board to wafer-level packaging for cost savings and other advantages. It also will trace the image sensor evolution toward wafer-level packaging and introduce through-silicon via (TSV) wafer-level chip-scale packaging, and how to address the barriers to adoption with a new approach.

Biography

Belgacem Haba is a Tessera Fellow and chief technology officer for the Interconnect, Components & Materials (ICM) division. He is responsible for directing research and strategic development in leading-edge packaging technology.

Haba came to Tessera from SiliconPipe Inc., a high-speed Internet start-up company which he co-founded. During his 20 year career, he has held management positions in research and development at Rambus, NEC Central Research Laboratories, and the IBM T.J. Watson Research Center.

He has published over 100 articles, holds 100 U.S. patents and more than 140 international patents and patent applications. He is a member of the IEEE Components, Packaging, and Manufacturing Technology Society.

Haba holds a bachelor's degree with honors in physics from the University of Bab-Ezouar, Algeria, master's degrees in applied physics and materials science and a doctorate in materials science and engineering from Stanford University.