Wednesday, February 22nd, 2012
Western Digital, 1710 Automation Parkway, San Jose, CA
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Cookies, Conversation &
Pizza too at 7:00 P.M.
Presentation at 7:30 P.M.
Soft Magnetic Thin Film Applications at Radio Frequencies
Prof. Masahiro Yamaguchi
Department of Electrical and Communication Engineering, Tohoku University
Abstract
Development of new passive component technologies will enable a “More-
than-Moore” paradigm leading to innovative application-specific compact
systems [1]. Ferromagnetic thin film materials, having high permeability
at (and above) radio frequencies, are candidate materials for use in
inductive passive components that are available in the forms of vacuum-
deposited and electro-deposited metallic alloys, chemically synthesized
nano-particulate composites, and traditional oxides, among others. Using
these materials, the development of CMOS integrated inductors and
integrated electromagnetic noise suppressors for Long Term Evolution, or
3.9th Generation, cell phone RFIC and Point-of-Load one-chip DC-DC
converters, is attracting great interest from both academic and industrial
communities.
This lecture begins with a review of new soft magnetic thin
film applications at radio frequencies for future system-in-package (SiP)
and system-on-chip (SoC) technologies. Proposed in late 1970s, these thin
film soft magnet applications have evolved from inductive read/write
recording head technology to the frontiers of GHz frequency device
applications. Discussions covered in this lecture include:
- Development of international cross measurements of RF permeameters [2]
to evaluate RF permeability and related FMR profiles of magnetic
films;
- small signal high permeable low loss applications to CMOS
integrated inductors [3];
- small signal lossy application to CMOS
integrated electromagnetic noise suppressor [4];
- small to medium
signal applications as new metal/ferromagnetic multi-stack “conductors” to
suppress skin effect utilizing negative permeability beyond the FMR
frequency [µr’< 0, µr”˜0][5]; and,
- large current permeable
application to Point-of-Load type one-chip DC-DC converters. The lecture
will conclude with an outlook that provides a perspective on the future of
on-chip RF magnetics.
Notes:
- John P. Kent, and Jagdish Prasad, “Microelectronics for the Real World: ‘Moore’ versus ‘More than Moore’,” IEEE 2008 Custom Integrated Circuits Conference, 15-4-1 (2008).
- M. Yamaguchi, Y. Miyazawa, K. Kaminishi and K.I. Arai, “A New 1 MHz-9 GHz Thin-Film Permeameter Using a Side-Open TEM Cell and a Planar Shielded-Loop Coil,” Trans. Magnetic Society of Japan, 3, 137-140 (2003).
- Masahiro Yamaguchi, Keiju Yamada, Ki Hyeon Kim, "Slit Design Consideration on the Ferromagnetic RF Integrated Inductor," IEEE Transactions on Magnetics, 42, 3341-3343 (2006)
- Sho Muroga, Yasushi Endo, Wataru Kodate, Yoshiaki Sasaki, Kumpei Yoshikawa, Yuta Sasaki, Makoto Nagata Masahiro Yamaguchi, “Evaluation of Thin Film Noise Suppressor Applied to Noise Emulator Chip Implemented in 65nm CMOS technology,” IEEE Transaction on Magnetics, 48, 4485 - 4488 (2011).
- Masahiro Yamaguchi, Yutaka Shimada, Takayoshi Inagaki and Behzad Rejaei, “Skin Effect Suppression in RF Devices Using a Multilayer of Conductor and Ferromagnetic Thin Film with Negative Permeability,” Microwave Workshop and Exhibition 2008 (MWE 2008), WS08-03 (Yokohama, 2008).
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