IEEE Reliability

IEEE - SCV - Reliability

Education

See “www.reliabilitycalendar.com” for a more

complete list of events. Calendar was put together

by Fred Schenkelberg and the ASQ.

Also there is a google calendar on the bottom of the

site www.opsalacarte.com which has a lot of local

events.

HOBBS ENGINEERING ANNOUNCES

THREE COURSES ON ACCELERATED RELIABILITY TESTING

For more detail, view www.hobbsengr.com or write learn@hobbsengr.com

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Accelerated Test Data Analysis

Schenectady, NY, May 9-12, 2011

Presented by the Leader in Statistics and Accelerated Testing

Instructor: Mr. Wayne Nelson, Ph.D.

APPLICATIONS OF ACCELERATED TESTING

Products last for years under normal operating conditions. However, product tests must quickly yield reliable information for management and engineering decisions. Accelerated testing quickly yields such information. Test specimens are subjected to higher than normal levels of temperature, voltage, humidity and vibration and fail much sooner. Then a mathematical model based on physical considerations is fitted to the early failure data, yielding estimates of product reliability under normal conditions, including the failure rate, percentage failing on warranty, and mean time to failure. This course will show how accelerated testing can be used to measure and improve the reliability of diverse products including:

o Electronics which include microprocessors, semiconductors, solid-state devices, conductors, encapsulants, connections, and capacitors;

o Metals undergoing fatigue, creep, rupture, and corrosion;

o Electrical insulations and dielectrics in cables, motors, capacitors, and transformers;

o Ceramics, plastics, composites, and other materials; and pharmaceuticals, food, paints and protective coatings, rubber and elastic materials, and chemicals.

WHO SHOULD ATTEND

This Accelerated Test Data Analysis course on engineering and statistical models and data analysis methods will benefit engineers, statisticians, and others working in development, reliability, testing, manufacturing, procurement, and data analysis. You will learn how to use engineering and statistical models for accelerated tests, how to plan efficient tests, and how to estimate and improve product reliability.

BENEFITS

You will learn how to use up-to-date methods to successfully:

o Determine test purposes.

o Accelerate tests through overstress, high usage rate, termination of the test before all specimens fail, specimen design, degradation, cycling, etc.

o Plan efficient tests that yield the most accurate product information for the allotted test time, cost, and constraints.

o Model and understand how product life or degradation depends on accelerating stresses and on design, manufacturing, materials, and operating variables, thereby learning how to improve product reliability. Analyze test data with simple and informative plots to estimate reliability and to assess the data and assumed model.

o Analyze data with different failure modes to estimate reliability at a design condition when all failure modes act or when some modes can be eliminated through better design or manufacture.

o Compare designs, manufacturing methods, vendors, materials, etc., with respect to their effect on product reliability.

o Analyze data with computer programs that provide reliability estimates with confidence limits indicating how accurate estimates are.

You will see a variety of applications to electronic, mechanical, and other products that will illustrate the methods. You will apply the methods to actual problems, including your own data, which you are encouraged to bring.

For more course details, see

http://www.hobbsengr.com/Accelerated_Test_Data_Analysis.htm

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MASTERING HALT & HASS Schenectady, NY, May 9-10, 2011

2-day course

by Mr. Chet Haibel, Masters in Engr

This course begins with the science behind the HALT & HASS techniques. It provides the hard engineering and explains why the failures accelerated through higher stress levels are essential to developing reliable products. The course offers step-by-step instruction on why, how and when to perform HALT (environmental and other stress stimulation methods applied in the design phase), how to correctly set-up and tune HASS profiles on production units, and how to prove that the HASS profiles leave enough life left so the product can be confidently sold to customers. Learn how to vastly improve design margins and eliminate process problems using these highly accelerated techniques.

This seminar will cover the latest methods for finding weak links in designs and processes that cause field failures in products. Emphasis is placed on environmental and electrical stimulation applied in the design phase (HALT) in order to force accelerated design and process maturity. This technique allows earlier (mature) product introduction and obtains robust design margins. Emphasis is also given to the use of the methods in the production phase (HASS) to assure process and design control. Either application results in cost savings and reliability improvements that are orders of magnitude better than those attained using the traditional approaches. Many leaders in reliability throughout the world are using the methods. Physics of failure, test coverage and resolution, equipment required and management issues will also be discussed. The extreme non-linearities found in vibration of electronics and fixturing for both vibration and thermal cycling are covered. Several case studies are discussed and critiqued.

For more course details, see our website: http://www.hobbsengr.com

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Advancing HALT & HASS: Moving to Comparative Limit Analysis

Schenectady, NY , May 11, 2011

by Mr. Kirk Gray, BSEE

This one-day seminar is intended to provide both review of the basic theory and practice of HALT and HASS and then from that foundation students will learn the advanced use of HALT for comparative boundary or limit analysis for building robust designs. The course will include case histories of the benefits of HALT, as well as the significant challenges to adoption of these techniques. The class will cover many of the pitfalls and errors of misapplication of HALT and HASS.

The class will also cover the expansion of HALT from the simple stresses to advanced use of HALT methods for more rapid discovery of the effect of component variations on reliable operation. The course covers the use of comparative stress limits for making a costs/benefit model for increasing margins. You will learn the process of mapping stress boundaries for use with HASS and HASA for more advanced and comprehensive ongoing reliability monitoring.

This course will quickly cover and review the basic HALT and HASS methods for finding weaknesses in products that cause field failures. The course will contrast HALT and HASS with traditional reliability engineering theories on predictions and life calculations. HALT is presented as a qualitative test method that Dr. Gregg Hobbs demonstrated as the most straight forward and efficient approach to rapid reliability development.

The course will cover the application of HALT in development stage and then HASS or HASA in the production phase. Much of the information for HALT and HASS is geared towards teaching the technique, procedures, or way of performing the Highly Accelerated Life Test (HALT) and Highly Accelerated Stress Screen (HASS). But before you are able to apply these processes you will need the understanding and support of management and design engineering to acquire management approval to spend funds for an outside lab, or even better, the purchase of your own HALT/HASS chamber. The process of selling a new approach in testing before you have a chance to actually prove is sometimes daunting. Most of the challenge of using these methods is in educating the skeptics of the benefits others claim and addressing the previous history of invalid theories and perceptions of causes of unreliability and the limited life of microelectronics. The Stress/Strength model of reliability will be used to graphically illustrate the concepts and use of comparative stress limit analysis.

Examples and case histories of HALT and HASS successes will be presented. Either application results in cost savings and reliability improvements that are orders of magnitude better than those attained using the traditional approaches.

For more course details, see our website: http://www.hobbsengr.com

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COST: 1-Day Seminar $695 • 2-Day Seminar $1,195 • 4-Day Seminar $1,895

Register for Relex Reliability Software Training

Register now to attend a Relex University training course! All Relex training classes are interactive sessions which include hands-on examples and plenty of time for discussion and Q&A. Relex training classes benefit both novice and advanced professionals, and are a great way to expand your reliability engineering knowledge.

The Relex Fundamentals classes cover basic theory, core concepts, operating fundamentals, and time-saving tips you need to get the most out of your Relex software investment. Relex Best Practices courses enable you to expand your theoretical knowledge and cover reliability theory, industry best practices, and application for real-world solutions. Please see the schedule below to see the upcoming classes;

Relex 2011 - Fundamentals: March 22 - 24, 2011 - Baltimore, MD Relex 2011 - FRACAS Best Practices: April 12 - 14, 2011 - Huntsville, AL Relex 2011 - Fundamentals: April 26 - 28 - Las Vegas, NV

Or visit http://www.ptc.com/appserver/services/learning/courseScheduleSearch.jsp?product=relex for more detailed information on our classes or to register. You can also send an email to clutz@ptc.com for pricing information.

From Ops Ala Carte:

DFSS and DfR – Comparing the Two	March 3, 2011	FREE – Webinar
Reliability Symposium	May 9-13	Santa Clara
How to Use HALT with Prognostics	June 7, 2011	FREE – Webinar

iMAPS Conference (Boston, MA: May 3)
Cheryl Tulkoff and Nathan Blattau will be making a presentation entitled "Automated Design Analysis: Accurately Capturing Warranty and End-of-Life Risks Early in Product Development," at the IMAPS New England Conference. If you and your associates are interested in an onsite visit and/or presentation or you would like to meet with either Nathan or Cheryl at the conference, please contact June Caswell.

DfR Solutions in Israel (Israel: May 3-5)
Craig Hillman will be jointly presenting with MET Labs in Israel. While he is in Israel, he will be visiting companies in the area. If you and your associates are interested in an onsite visit and/or presentation, please contact June Caswell.

International Conference on Soldering and Reliability (Toronto, Canada: May 4-6)
Cheryl Tulkoff will be presenting courses at the International Conference on Soldering and Reliability entitled "High Reliability: Solving Problems with Reliability in the Lead-Free Era" and "Second Generation Lead Free Alloys: Is SAC the Best We Can Do?" To register for the conference, visit the SMTA website. For more information, please contact Cheryl Tulkoff.

iMAPS High Reliability Microelectronics for Military (Baltimore, MD: May 17-19)
The International Microelectronics And Packaging Society (IMAPS) is sponsoring an Advanced Technology Workshopp on military high reliability packaging issues and applications which is chaired by Greg Caswell. The technical program will focus on the latest military electronic devices, systems, and applications with particular emphasis on system level issues that have an impact on mission assurance as well as the connected issues at the design and applications level. Abstracts are currently being solicited for the technical program. To register for this conference, please contact Greg Caswell or go to the website.

International Applied Reliability Symposium (San Diego, CA: June 7-9)
Randy Schueller will present "Physics of Failure in Five Minutes" at the 2011 International Applied Reliability Symposium. For more information, or to arrange a meeting during the conference, please contact Randy Schueller.

Product Development Webinar (June 30)
Jim McLeish will present a webinar entitled "How to Accelerate Automotive Product Development." Registration is now open. For more information, contact Jim McLeish.

And a big thanks to our friends at DFR for these interesting articles:

The Best Way to Stop Tin Whiskerss

The electronics industry has struggled to find the right combination of confidence and cost in mitigating the risk of tin whiskers. An excessive reliance on environmental testing has resolved neither of these issues. The real solution, detailed in this white paper, relies on the fundamentals of physics and quality control to put a stop to whiskers once and for all. For more information, contact Randy Schueller.

Beyong Bearing Wearout: Solving Fan Reliability

Fans continue to be a liability in the long-term reliability of electronic systems. To address this risk, DfR has developed an accelerated test methodology that is a singular solution for electronic OEMs attempting to select fan suppliers or attempting to determine the root-cause of field failures. By subjecting fans to conditions more applicable to application environment, their true capability and performance can be assessed in a fraction of the time. For more information, contact Tom Johnston.

How to Design for Thermal Cycling (iMAPS)

In collaboration with iMAPS, DfR Solutions will present a broad-based webinar on the challenges of designing for an environment with changing temperature. Whether your product is military, industrial, or part of the 'Free Air Cooling' trend, this insightful presentation will identify all of the mechanisms affiliated with thermal cycling and how to rapidly assess these risks during product design. To register, please contact Brian Schieman. For more information, contact Nathan Blattau.

From Concept to Customer

DfR has documented a comprehensive review methodology for a Product Delivery Process (PDP) that involves the entire product life cycle from design to manufacturing to delivery. The approach utilizes well established "Benchmarking," "Organizational Re-Engineering" and "Lean Process" evaluation methods. The intent is to identify the various steps in a company's current PDP and to benchmark their effectiveness and efficiency to best-in-class organizations. For more information on how DfR can help your organization become a market leader, contact Cheryl Tulkoff.

Solderability and Long-Term Storage

With shorter product life cycles and longer extensions of existing products, electronic OEMs are increasingly relying on storage to mitigate the risks of part availability. As explained in this white paper, solderability is a major issue that must be proactively assessed before any long-term storage plan is implemented. For more information, contact Greg Caswell.

How to Choose a Reliable Package on Package (PoP)

One company's solution can be another company's nightmare, especially in component packaging. A desire to maximize functionality and fit space constraints can result in something like this monster (25mm x 50mm) package on package (PoP). While likely satisfying a market need, this component will be challenging from a manufacturability and reliability perspective. For example, the package weight will likely reduce solder ball height to less than half the diameter, increasing the likelihood of pad cratering and thermo-mechanical fatigue. If you are looking for real solutions to PoP challenges, contact Craig Hillman.

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Last Modified: 05/01/2011