análisis de rendimiento de la Interface Bonding y Channel Bonding en Point to Point (Performance Analysis of Interface Bonding and Channel Bonding at Point to Point)

Guruh Fajar Shidik (, Zul Azri Bin Muhamad Noh (

1University Dian Nuswantoro (UDINUS)
2University Teknikal Malaysia Melaka (UTeM)

This paper appears in: Revista IEEE América Latina

Publication Date: Feb. 2013
Volume: 11,   Issue: 1 
ISSN: 1548-0992

In this research, we have done the experiment by applying interface bonding and channel bonding techniques using Point to Point topology on wireless 802 11n to achieve greater performance of network transmission compare with normal wireless link. Some of parameters are used to measure the performance of the proposed methods, such as delay, jitter, data loss rate and throughput that applied on TCP/UDP protocols. Some of experiment setup such as Different Packet Sizes and Directional Traffic Flows also conducted to measures the capability of proposed methods. The results showed that Channel Bonding has significant throughput improvement when applied at Point to Point connection used wireless 802 11n by optimizing the available bandwidth. Different result is obtained with Interface Bonding where the performance transmission is lower than normal link.

Index Terms:
Channel Bonding, Interface Bonding, Point to Point, Wireless 802.11n   

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