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4th
International Symposium on Electronic Packaging Technology (ISEPT), held
August 8-11 2001, in Beijing,
China.
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Dr. John Lau of Agilent
Technologies, USA
(third from left) at the Poster Session.
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Chapter Chair:
Prof. Jusheng Ma
Address:
Division of Electronic Materials and Packaging Technology,
School of Materials
Science and Engineering,
Tsinghua University,
Beijing, 100084, China
Work Phone: 0086-10-62772724
Fax: 0086-10-62772724
Email: temptm@mail.tsinghua.edu.cn
Homepage:
JushengMa
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