Hong Kong Chapter

CPMT's Hong Kong Chapter was established on July 6, 1998 by the IEEE Executive Director. The goal of this chapter is to promote technical and social activities amongst Hong Kong professionals active in the area of component packaging and surface mount assembly. There are more than seventy five engineers and managers from various companies as well as many faculty from various universities in Hong Kong who are members of CPMT. 

EMAP2007    NEW!!

The 9th International Conference on Electronics Materials and Packaging will be held at Korea Advanced Institute of Science and Technology (KAIST), Daejon, Korea, Novemeber 19-22, 2007. The former eight conferences were successful and have gained a reputation as a premier electronics materials and packaging conference. Details may be found in the following link.

Experts in Electronics Packaging Technology

Coming to Asia?
A stopover in Hong Kong is a must!
Consider giving a talk in Hong Kong! 
Contact: Dr Ivan Sham (ivansham@astri.org)