Local seminars

　

　

The institute of Electrical and Electronics Engineers, Inc - Components, Packaging and Manufacturing Technology, Hong Kong Chapter organizes different seminars for both members and non-members. 

Coming

 

More Than Moore: TSV, 3D, LTB, EWLP, MEMS and Photonic Packaging (Flyer)

Speaker: Dr. John H. Lau

Date: Wednesday, Nov 21, 2007 (2:00 p.m. – 3:00 p.m.)

Venue : Room 2571B (Lift 27, 28), HKUST

 

Past Seminars and Conferences

Reliability of Power Connections

Speaker: Dr. Milenko Braunovic

Date: Tuesday, Apr 3, 2007 (11:00 a.m. – 12:00 noon)

Venue : Room 2571B (Lift 27, 28), HKUST

Presentation file is now available (Click here)

 

Key Differences between EU RoHS and China RoHS

Speaker: Dr. John H. Lau

Date: Monday, Oct 16, 2006 (9:30 a.m. – 11:30 a.m.)

Venue : Room 3315 (Lift 17, 18), HKUST

 

Product-Oriented Microelectronics Packaging & Interconnect: Designs, Analyses, Reliability & Applications

Speaker: Dr. Amit P. Agrawa

Date: Thursday, Aug 24, 2006 (8:45 a.m. – 5:15 p.m.)

Venue : Convention Hall1, G/F Core Building, Hong Kong Science Park, Shatin, Hong Kong

 

Are You Really Ready for RoHS and WEEE?

- A Course on Tin Whiskers and Flame Retardants-

Speaker: Prof. Michael Pecht

Date : Thursday, Apr 13, 2006 (9:00 a.m. – 5:00 p.m.)

Venue : Room 4333 (Lift 3, 4), HKUST

 

High Performance Signal and Power Integrity Design for Complex PCB and IC Package

Speaker: Dr. Wang Tong

Date : Wednesday, Apr 12, 2006 (9:00 a.m. – 5:00 p.m.)

Venue : Room 4402 (Lift 17, 18), HKUST

Packaging and Board Assembly: Technology Trend, Materials, Processes and Reliability

Speaker: Dr. Dongkai Shangguan

Date : Thursday, Dec 15, 2005 (9:00 a.m. – 5:30 p.m.)

Venue : Room 4333 (Lift 3, 4), HKUST

Virtual Thermo-Mechanical Prototyping and Qualification of Microelectronics and Microsystems

Speaker: Prof.Dr. G.Q. (Kouchi) Zhang

Date : Thursday, Aust 25, 2005 (9:00 a.m. – 5:30 p.m.)

Venue : Room 4333 (Lift 3, 4), HKUST

Impacts of EU RoHS & China RoHS on Design, Materials, Process, Manufacturing, and Reliability of Electronics Products

Speaker: Dr. John H. Lau

Date : Friday, May 06, 2005 (9:00 a.m. – 12:30 p.m.)

Venue : Room 2404 (Lift 17, 18), HKUST

Trend and Design of MEMS & Advanced Packaging

Speaker: Dr. K. N. Chiang

Date : Friday, September 03, 2004 (9:00 a.m. – 12:30 p.m.)

Venue : Room 2404 (Lift 17, 18), HKUST

Preparation and Implementation for Lead-Free Soldering
Speaker: Dr. Ning-Cheng Lee

Date : Friday, August 20, 2004 (9:00 a.m. - 5:30 p.m.)
Venue : Room 2404 (Lift 17, 18), HKUST

Conductive Adhesive Joining Technology for Electronic Packaging Applications
Speaker: Prof. Johan Liu

Date : Monday, July 26, 2004 (9:00 a.m. - 5:30 p.m.)
Venue : Room 1505 (Lift 25, 26), HKUST

 

Migration to Lead-Free Microelectronics Assembly &

Some Key Technical Issues

Speaker: Dr Karl Puttlitz

Date: Friday, July 23, 2004 (3:00 p.m. - 4:00 p.m.)

Venue: Room 3006 (Lift 3), HKUST

Trends in High Density Packaging and Portable Microelectronics
Speaker: E. Jan Vardaman

Date : Tuesday, June 29, 2004 (2:00 p.m. - 5:30 p.m.)
Venue : Room 3006 (Lift 3), HKUST

Impact of Lead-Free on Electronic and Optoelectronic Packaging and Their SMT Assembly
Speaker: Dr. John H. Lau

Date : Tuesday, June 15, 2004 (2:30 p.m. - 5:30 p.m.)
Venue : Room 3006 (Lift 3), HKUST

Monitoring the Health (Reliability) of Products
Speaker: Dr. Michael Pecht

Date : Wednesday, June 09, 2004 (2:00 p.m. - 5:30 p.m.)
Venue : Room 2404 (Lift 17, 18), HKUST

Three Dimensional Packaging, Interconnection & Assembly for Microelectronics Miniaturization
Speaker: Dr. Chuck Bauer

Date : Wednesday, April 21, 2004 (10:00 a.m. - 5:00 p.m.)
Venue : Room 2404 (Lift 17, 18), HKUST

　

Wire Bonding in Microelectronics
Speaker: George G. Harman

Date : Friday, April 30, 2004 (9:00 a.m. - 5:30 p.m.)

Venue: Room 2404 (Lift 17, 18), HKUST

Encapsulation of Electronics: Materials, Process and Reliability
Speaker: C. P. Wong
Date: Monday, December 22, 2003 (9:00p.m. - 5:30 p.m.)
Venue: Rm 2405 (Lift 17,18), HKUST

Cleanroom Technology for Microelectronics and Photonic Packaging
Speaker: Ken Goldstein
Date: Friday, October 31, 2003 (9:00p.m. - 5:30 p.m.)
Venue: Rm 2404 (Lift 17,18), HKUST

Laser Diodes, VCSELs, Photodiodes, Modulators: Device Physics, Packaging, Integration, and Qualification
Speaker: Torsten Wipiejewski
Date: Wednesday, September 10, 2003 (2:30p.m. - 5:30 p.m.)
Venue: Rm 2404 (Lift 17,18), HKUST

Impacts of Lead-Free Solder on Wafer-Level Chip Scale Package (WLCSP)
Speaker: John H. Lau
Date: Friday, August 15, 2003 (2:00p.m. - 5:00 p.m.)
Venue: Rm 2303 (Lift 17,18), HKUST

BGA Solder Joint Reliability - Failure Modes and Test Methods
Speaker: Keith Newman
Date: Monday, March 11, 2003 (2:00p.m. - 6:00 p.m.)
Venue: Rm 2404 (Lift 17,18), HKUST

Customising System Solutions through Advanced Packaging
Speaker: Rolf Aschenbernner
Date: Monday, December 9, 2002 (9:00a.m. - 5:15 p.m.)
Venue: LTH, HKUST

Flip-chip Technology
Organized by Innovation and Technology Fund Project - ITS/196/00 and IEEE CPMT HK Chapter
Date: Tuesday, October 22, 2002 (9:00a.m. - 1:00p.m.)
Venue: Rm 6581-2 (Lift 27,28), HKUST

ACAs for Flip Chips on Organic Substrates
- A Reliable, Low Cost and Green Flip Chip Technology
Speaker: Dr. Kyung W. Paik
Date: Friday, August 9, 2002, (2:00 p.m. - 5:15 p.m.) 
Venue: Lecture Theater H, HKUST

Thermal Management of Electronic Components
Speaker: Dr. Avram Bar-Cohen
Date: Tuesday, April 9, 2002, (9:00 a.m. - 5:15 p.m.) 
Venue: Rm 2404, HKUST

Wire Bonding in Microelectronics
Speaker: George G. Harman (NIST)
Date: Tuesday, March 19, 2002, (9:00 a.m. - 5:15 p.m.) 
Venue: Rm 2404, HKUST

International Symposium on Electronic Materials and Packaging 2000
Date: November 30 - December 2, 2000
Venue: The Hong Kong University of Science and Technology, Clear Water Bay, Hong Kong

 

Advanced Packgaing Process Technology Tutorial
Date: Friday, November 17, 2000 
Venue: University Center, The Hong Kong University of Science and Technology 

Lead-Free Soldering-The Action You Don't Want to Miss
Speaker: Dr. Ning-Cheng Lee, Indium Corporation of America
Date: Wednesday November 29, 2000 (9:00 a.m. - 5:00 p.m.) 
Venue: University Center, The Hong Kong University of Science and Technology 

Plastic Packages of IC Devices: Physical Design for Reliability
Speaker: Dr. Ephraim Suhir (Bell Labs)
Date: Friday June 30, 2000 ( 9:00 a.m. - 5:00 p.m.)
Venue: Room 1402 (near Lift 25/26), HKUST [morning session]
              Lecture Theatre F, HKUST [afternoon session]


Low Cost Flip Chip Technologies for DCA, WLCSP, PBGA Assemblies
Speaker: Dr. John H.  Lau 
Date: Tuesday May 30, 2000 (9:00 a.m. - 5:00 p.m.) 
Venue: Lecture Theatre G, The Hong Kong University of Science and Technology 


Wire Bonding in Microelectronics, Materials, Processes and Reliabilty
Speaker: George G. Harman
Date: Wednesday March 15,  2000
Venue: The Hong Kong University of Science and Technology, Room 7336*(Council Chamber)


Tutorial on Chip Scale Package (CSP) - Design, Materials, Process, Reliability & Applications
Speaker: Dr. John Lau and Dr. Ricky Lee
Date: Monday February 21, 2000 
Venue: The Hong Kong University of Science and Technology 


IBM ASIC & Packaging Technology 
Speaker: To be determined, IBM, USA 
Date: Tuesday January 18, 1999 
Venue: Lecture Theatre D, The Hong Kong University of Science and Technology 


Chip Size Packaging and Flip Chip without Underfill
Speaker: Dr. Juergen Simon, FhG-IZM & Technical University of Berlin 
Date: Tuesday December 14, 1999 
Venue: Mech Conference Room, The Hong Kong University of Science and   Technology


Polymers for Electronics Packaging: Materials, Process and Reliability
Speaker: Dr. C.P. Wong, Georgia Tech, Atlanta, GA 
Date: Monday December 13, 1999
Venue: 1/F., HKPC Building, 78 Tat Chee Avenue, Kowloon 


Packaging and Assembly Trends in Microvia, CSPs & Lead Free
Speaker: Jan Vardaman, TechSearch International, Austin, TX
Date: Tuesday November 30, 1999 
Venue: Seminar Room, The Hong Kong University of Science and Technology 


Tutorial on Flip Chip
Speaker: Dr. Zakel, Pactech GmbH Germany 
Date: Monday November 29, 1999 
Venue: Seminar Room, The Hong Kong University of Science and Technology


Lead-free Soldering Process & Technology
Speaker: Dr. Alan Rae
Date: Monday October 11, 1999 
Venue: The Hong Kong University of Science and Technology 

Dr. Annette Teng (left) with Dr. Alan Rae (Right) who gave the seminar on Lead-free  attended by many engineers from the local electronic industries. 


New Polymers for Electronic Packaging, Reliability without Hermeticity
and Electrically Conductive Adhesives
Speaker: Dr. C.P.Wong
Date: Tuesday December 15, 1998
Venue: HKUST Council's Chamber 

Distinguished lecturer, Dr C.P.Wong (centre) with Dr. Matthew Yuen (left) and past IEEE Hong Kong Section chair (Dr. N.F.Chin).