CALL FOR PAPERS
2000 European VLSI Packaging and Microsystem Packaging
Techniques and Manufacturing Technologies Workshop
8-9 May 2000, Cork, IRELAND

The 2000 VLSI and Microsystems Packaging Workshop, supported by the IEEE CPMT Society, will be held at the Hayfield Manor Hotel, in Cork, Ireland.
The Workshop is a continuation of the successful series of IEEE-CPMT workshops held in Europe on Electronic packaging to stimulate the activities and important initiatives in this rapidly changing area. This Workshop succeeds the previous Workshop held in Baveno, Italy in 1996, Brugge, Belgium 1998 and alternates with the IEEE European System Packaging Workshop held in Malta in 1997 and in Ireland, 1999.
The conference will provide a forum for the presentation and discussion of significant progress in VLSI and microsystems packaging. The topics covered in the Workshop will include methodologies for design and implementation of first level electronic packaging and technologies, materials, and equipment for the manufacturing of multi and single chip packages for VLSI, subsystems and microsystems. All attendees are expected to be specialists in their respective fields and to participate in the relevant discussions. The language of the Workshop will be English with 30 minute presentations.
Paper should cover relevant topics including but not limited to:
- Single chip packages, design, implementation, characterization, and roadmaps
- Product-oriented microelectronics packaging technology
- MCM (L,C,D), integrated passives, Large Area Processing, and roadmaps
- Trends in CSP and wafer level packaging
- Flip chip technologies (bumping, assembly, underfill)
- Packaging and interconnection of high frequency devices
- Packaging and interconnection of sensors and microsystems
- 3D packaging, optical interconnects, optoelectronic packaging
- Interconnect Technologies for high density organic packaging
- Test and Inspection, KGD, EMC, Thermal management, Reliability, Cost
Paper Submission
An extended abstract with a maximum of 4 pages in length, including up to 4 of your most important figures of the proposed paper is required for review by the Technical Programme Committee (please send 5 copies). To encourage an open exchange of up-to-the-minute findings, there will be no published proceedings and cameras or tape recorders will not be permitted. The extended abstracts will be made available to Workshop attendees only.
Abstracts with the name, address and phone and fax numbers of the principal author should be sent by November 19, 1999, to the address given below. Authors will be notified of paper acceptance by the end of January 2000.
Dr. Rolf Aschenbrenner
FhG IZM
Gustav Meyer Allee 25
13355 Berlin
Germany
A Web page will be available for the workshop at http:// nmrc.ucc.ie
with programme and registration information