IEEE Components, Packaging and Manufacturing Technology Society Announces 2002 Award Winners

(April 1, 2002) Piscataway, N.J. – The Components, Packaging and Manufacturing Technology Society (CPMT) announces its annual honors to individuals, teams and chapters for their technical excellence, achievement, leadership and service.

The award winners are:

• The David Feldman Outstanding Contribution Award – Prof. Herbert Reichl (Fraunhofer IZM, Germany) for his technical leadership and outstanding contributions to the microelectronics packaging industry. He is the head of the Research Center for Microperipheric Technologies-System Integration, TU Berlin, and Founded and directs the Fraunhofer IZM.
• Outstanding Standing Technical Contribution Award – Prof. Avram Bar-Cohen (University of Maryland) for his contributions to thermal design, Modeling and analysis and for orginal research on ebullient and liquid-phase cooling.
• Electronics Manufacturing Technology Award – Scott Kulicke (Chairman and CEO, Kulicke & Soffa) for his leadership and vision in transforming Kulicke & Soffa from a premier wireboning supplier to a global leader in semiconductor interconnecting technologies.
• Exceptional Technical Achievement Award – Prof. C.P. Wong (Georgia Institute of Technology) for his pioneering work in polymeric materials for electronics packaging applications and for the introduction and development of silicon gels to achieve reliability without hermeticity in plastic IC packaging.
• Outstanding Young Engineer Award – There was such phenomenal talent in this category that two co-recipients were chosen to share the award. (Shown in alphabetical order)

*Christine Kallmayer (Fraunhofer IZM, Germany) for her contributions to various packaging technologies including Au-SN solder interconnections and fex-based packages and for her active participation in technical conferences sponsored by the CPMT Society.

*Li Li. Ph.D. (Motorola Inc.) for her contributions to flip chip interconnect bumping materials and process development and embedded passive design and implementation in RF modules, and for her service to the CPMT society via conferences and IEEE Transactions.

The awards will be presented at the 52nd Electronics Components & Technology Conference (ECTC) in San Diego, CA. during the CPMT Society luncheon. The exception is the Electronics Manufacturing Technology Award, which will be presented at the International Electronics Manufacturing Technology (IEMT) Symposium and SEMICON West 2002 in San Jose, Calif., July17-19. IEEE Components, Packaging and Manufacturing Technology (CPMT) Society is the leading international Forum for Scientists and engineers engaged in the research, design and development of revolutionary advances in Microsystems packaging and manufacture. For more information, visit www.cpmt.org.