Expert Sources
Philip Garrou CPMT Society President
John M. Segelken
Connie S. Swager
Walter J. Trybula
Rao R. Tummala
C.P. Wong
Dr. Philip Garrou
Areas of Expertise
Polymeric Materials… Wafer Level Packaging… Chip Packaging… Interconnect Technology… Multichip Modules… Passives Integration… Emerging Industry Trends.
Professional Background
Over 25 years of experience in the microelectronics industry… Currently Commercial Director of Thin Film Materials in Dow Chemicals Advanced Electronic Materials business… Single most important contribution is the commercialization of Cyclotene (BCB) dielectric. He guided BCB from its early days in Dow’s Central Research department in the late 1980s to its current multimillion dollar status. It is used in market segments as diverse as Flat Panel Displays, GaAs chips, optical waveguides, RF components, multichip modules, wafer level bumping and high frequency laminates for telecommunications… Author of two texts on microelectronics… Co-authored over 50 peer-reviewed chapters and publications on the use of polymeric materials in a variety of advanced microelectronic applications… Given over 100 technical presentations… Fellow of IEEE and IMAPS.
CPMT Society Responsibilities
President of the CPMT Society, Former Technical Vice President of the CPMT Society… A member of the CPMT Society’s Board of Governors… Previously chaired two Technical Committees - Materials and Wafer Level CSP… Associate Editor of the IEEE Transactions on Components and Packaging.
Education
B.S., Chemistry, North Carolina State University
Ph.D., Chemistry, Indiana University
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John M. Segelken
Areas of Expertise
Optoelectronics… Environmental Management… Interconnect Technology… Packaging… Advanced Technology Research… Engineering & Development… Business Systems… Industry Marketing… Emerging Technologies.
Professional Background
Consultant… Former Vice President of Corporate Development for the Haleos company… Spent more than 30 years with AT&T Bell Labs developing technologies in the areas of wireless, fiber optics and cable, connectors and materials… Worked in every facet of the industry, including research, manufacturing, technology and development… Responsible for multi-billion dollar procurements… Served as Director of Supply Chain Management at Lucent Technologies. Fellow of IEEE and ASME.
CPMT Society Responsibilities
Member of the CPMT Society for almost 20 years and an active member of their Board of Governors… Associate Editor for the IEEE Transactions on Components, Hybrids and Manufacturing Technology for more than a decade… Director of the Society’s Awards and Recognitions Committee.
Education
BSME, University of Maryland
MSME, Purdue University
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Ms. Connie S. Swager
Areas of Expertise
E-Business Strategy… Market Analysis…Supply Chain Management… Competitive Intelligence… Semiconductor Manufacturing… CPMT Society.
Professional Background
Executive procurement technologist and e-Business Strategy Consultant… Almost 20 years of experience with the IBM Corporation, managing e-business strategy to supply chain and global procurement… Consultant from manufacturing engineering to training development and management… Experience managing multiple international manufacturing plans… IEEE Senior Member.
CPMT Responsibilities
CPMT Society’s Director of Marketing, responsible for strategic planning and implementation… Elected member of the Society’s Board of Governors.
Education
B.S., Chemistry, University of Kentucky (Summa Cum Laude)
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Dr. Walter J. Trybula
Areas of Expertise
Lithography… Manufacturing… Microelectronics… Automation and Analysis… Emerging Technologies… Modeling… Research & Development.
Professional Background
Senior Fellow of SEMATECH, the premiere global research consortium for the semiconductor industry... Responsible for industry and economic analysis of lithographic technologies and developing new methods of cost and productivity analysis for semiconductor manufacturing… Former President of Ivy Systems, Inc., a manufacturing automation and analysis firm… Over a decade of innovation and senior management with the General Electric Company… Very well known and respected in the industry… Authored over 100 publications including papers, book chapters, encyclopedia articles, teaching modules and published conference proceedings… Often invited to speak at conferences… Organizer and chair of international conference sessions on microelectronics for almost 15 years… IEEE Fellow.
CPMT Responsibilities
CPMT Society Board of Governors elected member… Founding Editor and Editor in Chief, IEEE Transactions on Electronics Packaging Manufacturing… Reviewer of IEEE Transactions on Semiconductor Manufacturing… Reviewer of IEEE CPMT Society Transaction papers… Member of the CPMT Society for over 20 years… Chair of the Society’s Manufacturing Technical Committee.
Education
B.S., Physics, Illinois Institute of Technology, Chicago, Illinois
MBA, James Madison University, Harrisonburg, Virginia
Ph.D., University of Texas at Austin, Texas
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Rao R. Tummala
Areas of Expertise
System-on-Package… Packaging… Emerging Technologies… Electronic Materials… Industry Globalization.
Professional Background
Over 25 years of experience in microelectronics… Currently a Chair Professor in Electrical and Computer Engineering and in Materials Science and Engineering at the Georgia Institute of Technology… Founding Director of the Microsystems Packaging Research Center (PRC) funded by the National Science Foundation - currently the largest and most comprehensive microsystems packaging center involving 300 students, 35 faculty from six departments and over 50 global companies… An Eminent Scholar for the State of Georgia… pioneering System-on-Package (SOP) vision of microsystems for the next decade.
Formerly worked for the IBM Corporation and invented a number of major technologies for IBM's products… Pioneered the industry's first multichip module packaging based on alumina ceramic… Pioneered the industry's first 61 layer glass-ceramic/copper or LTCC… Part of the team that developed the industry's first flat panel based on gas discharge display… The author of Fundamentals of Microsystems Packaging, the first undergraduate textbook dedicated to the topic… Co-editor of widely-used Microelectronics Packaging Handbooks… Published 239 technical papers… Holds 68 U.S. patents... IEEE Fellow… IBM Fellow… Named by Industry Week as one of the 50 Stars in the U.S., for improving U.S. competitiveness… Member of National Academy of Engineering.
CPMT Society Responsibilities
Former President of the CPMT Society… Responsible for the direction and vision of the Society… Travels extensively to promote the Society and develop new chapters and initiatives… Manages fiscal matters… Oversees the Board of Governors… former CPMT Society Technology Vice President… Chair of the Society's Education Technical Committee.
Education
B.E., Metallurgical Engineering - Indian Institute of Science, Banglore, India
Ph.D., Materials Science and Engineering - University of Illinois
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Dr. C.P. Wong
Areas of Expertise
Polymeric Materials… IC Encapsulation…Hermetic Equivalent Plastic Packaging… Electronic Packaging Processes… SMT Assembly… Component Reliability, Embedded passives, Environmental Friendly (lead-free) Interconnect Materials.
Professional Background
Regents’ Professor, School of Materials Science and Engineering and a Research Director at the NSF Packaging Research Center at the Georgia Institute of Technology… Over 25 years experience in research and development… Nineteen years of research and innovation at AT&T Bell Labs… Elected as a Bell Labs Fellow in 1992… Holds over 45 patents and numerous international patents… Authored over 450 technical papers… Elected a member of the National Academy of Engineering in 2000… Fellow of IEEE and AIC.
CPMT Responsibilities
Active member of the CPMT Society’s Board of Governors… Member of IEEE’s Fellow Committee… Former President and Technical Vice President of the CPMT Society.
Education
B.S., Chemistry, Purdue University
Ph.D., Chemistry, Pennsylvania State University
Awarded a two-year Postdoctoral Fellowship at Stanford University with Nobel Laureate Professor Henry Taube.
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