FOR IMMEDIATE RELEASE	Contact: Bob Conrad
March 18, 2002	202-466-7391 x 1123

The IEEE Components, Packaging, and Manufacturing Technology Society Announces its 2002 Award Winners

Piscataway, N.J. – The Components, Packaging and Manufacturing Technology Society (CPMT) recently announced it annual honors to individuals, teams and chapters for their technical excellence, achievement, leadership and service.

“These awards aim to recognize excellence in our field and outstanding contributions,” stated Rao Bonda, Ph.D. Chair, Awards Program. “The CPMT Society is very honored to reward these incredibly talented individuals for their hard work and innovation.”

The following is a detailed listing of the awards and award winners:

• The David Feldman Outstanding Contribution Award – Prof. Herbert Reichl (Fraunhofer IZM, Germany) for his technical leadership and outstanding contributions to the microelectronics packaging industry. He is the Head of the Research Center for Microperipheric Technologies-System Integration, TU Berlin, and founded and directs the Fraunhofer IZM. In addition, he is active in various CPMT Society-sponsored conferences and workshops. Prof. Reichl is an IEEE Fellow and considered to be one of the premier leaders in electronics packaging education and technology in the European community.

• Outstanding Sustained Technical Contribution Award – Prof. Avram Bar-Cohen (University of Maryland, USA) for his contributions to thermal design, modeling and analysis and for original research on ebullient and liquid-phase cooling. An IEEE Fellow since 1993, Prof. Bar-Cohen serves as Editor-In-Chief for the IEEE Transactions on Components & Packaging Technologies and is an elected member of the CPMT Society Board of Governors. He is also known for achievements outside his particular job, such as mentoring a group of Russian thermal engineers in Siberia – visiting them, developing sponsorships so they could attend conferences and helping to edit technical papers.

• Electronics Manufacturing Technology Award – Mr. Scott Kulicke (Chairman and CEO, Kulicke & Soffa, USA) for his leadership and vision in transforming Kulicke & Soffa from a premier wire-bonding supplier to a global leader in semiconductor interconnecting technologies. He was the founding Chairman of SEMI/SEMATECH, Inc., an organization of semiconductor equipment and materials suppliers supporting
the goals of SEMATECH (the consortium of U.S. semiconductor manufacturers and the U.S. Government for manufacturing competitiveness) and served as Chairman of the U.S. Department of Commerce's Technical Advisory Committee on Semiconductors.

• Exceptional Technical Achievement Award – Prof. C.P. Wong (Georgia Institute of Technology, USA) for his pioneering work in polymeric materials for electronics packaging applications and for the introduction and development of silicon gels to achieve reliability without hermeticity in plastic IC packaging. He is considered a world-renowned expert in the research and development of polymeric materials in electronics packaging. Prof. Wong is an IEEE Fellow, an elected member to the Board of Governors and previous President of the CPMT Society. In addition, he is an elected member of the National Academy of Engineering, which is considered one of the highest honors one can receive in the industry.

• Outstanding Young Engineer Award – There was such phenomenal talent in this category that two co-recipients were chosen to share the award. (Shown in alphabetical order)
* Ms. Christine Kallmayer (Fraunhofer IZM, Germany) for her contributions to various packaging technologies including Au-Sn solder interconnections and flex-based packages and for her active participation in technical conferences sponsored by the CPMT Society.
* Dr. Li Li (Motorola, Inc., USA) for her contributions to flip chip interconnect bumping materials and process development and embedded passive design and implementation in RF modules, and for her service to the CPMT society via conferences and IEEE Transactions.

The awards will be presented at the 52nd Electronics Components & Technology Conference (ECTC) in San Diego, California, USA, during the CPMT Society luncheon. The exception is the Electronics Manufacturing Technology Award, which will be presented at the International Electronics Manufacturing Technology (IEMT) Symposium and SEMICON West 2002 in San Jose, California, USA, July 17-19.

About the CPMT Society
IEEE Components, Packaging and Manufacturing Technology (CPMT) Society is the leading international forum for scientists and engineers engaged in the research, design and development of revolutionary advances in microsystems packaging and manufacture. Members include world-renowned authorities in microelectronics, optoelectronics, semiconductor processing, materials and connector technologies at companies, universities, government research centers and allied enterprises around the globe. The CPMT Society (www.cpmt.org) promotes technical excellence and professional development, information exchange and networking opportunities through its journals, conferences and workshops, committee activities, chapter events, educational programs and awards. The Institute of Electrical and Electronics Engineers, Inc. (IEEE), CPMT Society's parent organization, is the world's largest international technical professional society with more than 360,000 members in over 150 countries.