FOR IMMEDIATE RELEASE	Contact: Kristine Martin
December 9, 2003	202-466-7391 x 1124

The IEEE CPMT Society Names New President, Officers for 2004

• Dr. Phil Garrou takes over the reins for outgoing Society President Dr. Rao R. Tummala, whose term ends 31 December
• Rolf Aschenbrenner takes over technical vice president duties and Dr. S.W. Ricky Lee becomes the conferences vice president
  

Piscataway, N.J. (9 December 2003) – The IEEE Components, Packaging and Manufacturing Technology Society (CPMT) is pleased to announce its new officer lineup beginning 1 January 2004:

President: Dr. Philip Garrou has over 25 years of experience in the microelectronics industry. He is currently the Director of Technology and Director of New Business Development in Dow Chemical’s Advanced Electronic Materials (AEM) business unit. He was previously the technical vice president of the CPMT Society, and also serves as an associate editor of the IEEE Transactions on Components and Packaging. Garrou is a Fellow of both IEEE and IMAPS. He has authored two texts on microelectronics, co-authored over 75 peer-reviewed chapters and publications on microelectronic materials. In 2002 he won the Fraunhofer IZM award for outstanding achievements by international specialists in the field of Advanced Packaging. He earned his BS in Chemistry from North Carolina State University and his PhD in Chemistry from Indiana University.

Garrou will be responsible for the direction and vision of the CPMT Society.

Vice President of Technical Activities: Rolf Aschenbrenner is the deputy director of the Fraunhofer IZM in Berlin, Germany, and head of the Chip Interconnection Technologies department. He has authored over 80 peer-reviewed articles in the area of electronic packaging, holds five patents and has eight patents pending in the microelectronics arena. Aschenbrenner is an elected member of the CPMT Society Board of Governors and plays an active role in the globalization of the Society in terms of membership and chapter development. He previously served as the strategic program director of European activities. He received his MS in mechanical engineering from the University for Applied Sciences in Germany and a BS in physics from the University of Giessen.

Aschenbrenner will be responsible for guiding the Society’s 19 Technical Committees that drive the leadership and direction within the CPMT Society on emerging technologies.

Vice President of Conferences: Dr. S.W. Ricky Lee is an associate professor of mechanical engineering at the Hong Kong University of Science and Technology and the director of its Electronic Packaging Lab (EPACK Lab). Lee has been published extensively in international journals, is the co-author of three books and is often invited to teach technical workshops and courses worldwide. He is the former chair of the Hong Kong Chapter of the CPMT Society, a member of its Board of Governors, and serves as associate editor for both IEEE Transactions on Components & Packaging Technologies and IEEE Transactions on Advanced Packaging. He is a Senior Member of IEEE and a Fellow of ASME. Lee received his BS in mechanical engineering from National Taiwan University and PhD in aeronautical engineering from Purdue University.

Lee will be responsible for the oversight of the 30-plus CPMT Society-sponsored conferences around the globe.

Officer terms are for two years.

Continuing for another two-year term in their current positions are:
Paul Wesling – Vice President of Publications
Al Puttlitz – Vice President of Education
Tony Chan – Vice President of Administration

About the CPMT Society
IEEE Components, Packaging and Manufacturing Technology (CPMT) Society is the leading international forum for scientists and engineers engaged in the research, design and development of revolutionary advances in microsystems packaging and manufacture. Members include world-renowned authorities in microelectronics, optoelectronics, semiconductor processing, materials and connector technologies at companies, universities, government research centers and allied enterprises around the globe. The CPMT Society (www.cpmt.org) promotes technical excellence and professional development, information exchange and networking opportunities through its journals, conferences and workshops, committee activities, chapter events, educational programs and awards. The Institute of Electrical and Electronics Engineers, Inc. (IEEE), CPMT Society's parent organization, is the world's largest international technical professional society with more than 360,000 members in over 150 countries.