FOR IMMEDIATE RELEASE	Contact: Kristine Martin
June 10, 2004	202-466-7391 x 124

The IEEE CPMT Society Announces Its 2004 Award Winners

Piscataway, N.J., 10 June 2004 – The IEEE Components, Packaging and Manufacturing Technology (CPMT) Society is pleased to announce the winners of its annual awards, given for distinguished performance in technical fields and dedication to the Society.

“These awards acknowledge tremendous contributions in many diverse topic areas that advance science. Their contributions lead to innovative solutions that enhance life around the globe,” said N. Rao Bonda, CPMT Society awards chair.

• Dr. Ralph W. Wyndrum, Jr. (Wyndrum Associates, Fair Haven, New Jersey USA) – The David Feldman Outstanding Contribution Award – for 45 years of dedicated service to the IEEE and the CPMT Society. He began his career at Bell Laboratories in 1963, where he led the SLC-5 digital loop carrier systems development that now serves more than five million telephone customers globally. He currently sits on IEEE’s Board of Directors and is the Vice President of Technical Activities. Top positions at the CPMT Society include the Board of Governors from 1991 to 2002 and president from1996 to 1997. He holds six patents and has authored more than 40 technical papers and textbook chapters.
• Dr. Luu T. Nguyen (National Semiconductor Corporation, Santa Clara, California USA) – Outstanding Sustained Technical Contribution Award – for his leading edge research in wafer level packaging, lead-free packaging, and for research collaboration and technology transfer in electronic packaging. His development of the Micro SMD, a wafer level-chip scale package (WL-CSP), led to an industry standard for this type of packaging, with more than 200 million manufactured and shipped since 1998. In addition, his development of a wafer level underfill material and process led last year to the Microfil, the industry’s first commercial introduction of WL-CSP with a pre-applied underfill. He is a Fellow of IEEE and the American Society of Mechanical Engineers (ASME) and was a Fulbright Scholar.
• Mr. Michael J. Varnau (Delphi Electronics and Safety, Kokomo, Indiana USA) – Electronics Manufacturing Technology Award – for leading advancements in automotive electronics packaging and for developing a commercially successful printed solder flip chip technology, the leading technology for harsh environment, consumer and low-cost applications. Mr. Varnau has been active in automotive electronics packaging since 1973. He was the lead packaging engineer in Delphi’s first electronically tuned radio and its first digital engine control module, each of which was a first application of technology in the automotive industry. He is a member of IEEE, the CPMT Society and IMAPS.
• Dr. Johan Liu (Chalmers University of Technology, Molndal, Sweden) – Exceptional Technical Achievement Award – for his research in conductive adhesives for electronic interconnect applications for a wide variety of industrial and consumer products. He established a major academic and industrial research center in Sweden focused on developing electronic micro-system integration technology while linking industry, university, and government research organizations together. He has published a book, authored more than 150 articles and holds several patents. He has served as the Swedish IEEE CPMT Society chapter chair since 1996, the Scandinavian chair since 2000, and CPMT Society Board of Governors member since 2001.

“This year we are especially pleased to present not one, but three Outstanding Young Engineer Awards. These individuals are shaping the future, and we expect great things from them,” said Phil Garrou, CPMT Society president.

• Dr. Daoqiang Lu (Intel Corporation, Chandler, Arizona USA)– Outstanding Young Engineer Award – for several contributions, including development of conductive adhesive as solder replacement, a 40 Gb/s receiver for telecommunications applications and optical chip-to-chip interconnect technology. Dr. Lu was the first person to clearly show the unstable contact resistance of electrically conductive adhesives and to develop them with stable contact resistance and improved impact performance. He has already published approximately 40 technical papers, written chapters for three books, and awarded one U.S. patent. He has more than 20 patent applications pending. He also the secretary of his local CPMT Society chapter.
• Dr. Shijian Luo (Micron Technology Inc., Boise, Idaho USA)– Outstanding Young Engineer Award – for his contributions to the fundamental understanding of adhesion of underfill material for flip chip packaging, which has led to a new technology for wafer level packaging. Dr. Luo was the first person to apply the solid state nuclear magnetic resonance technique for adhesion study and to demonstrate that rate of adhesion in a hot-wet environment is controlled by the mobility of absorbed water and polymer matrix. He was also the first to discover that the orientation of a coupling agent (as an additive) at the interface plays an important role in retention of adhesion of epoxy underfill to passivation of wafer during hot-wet aging. He has published almost 40 technical papers and has three U.S. patents pending.
• Dr. Lei L. Mercado (Intel Corporation, Chandler, Arizona USA) – Outstanding Young Engineer Award – for her contributions to the development of industry standards for electronic package reliability assessment and for her innovations in RF MEMS designs and copper low-k packages. Prior to joining Intel, she worked as a principal staff engineer in Motorola’s semiconductor product sector. She is a senior member of IEEE and has served on the ECTC Program Committee since 2000. She was the recipient of the Best Poster Paper Award at ECTC in 1999, the Best Paper Award at 2000 IEEE/IEMT, and Best Paper Awards at Motorola conferences.

The awardswere presented at the 54th Electronics Components & Technology Conference (ECTC) in Las Vegas, Nevada, during the CPMT Society luncheon. The exception, the Electronics Manufacturing Technology Award, will be presented at the International Electronics Manufacturing Technology (IEMT) Symposium held in conjunction with SEMICON West 2004 in San Jose, California, USA.

About the CPMT Society
IEEE Components, Packaging and Manufacturing Technology (CPMT) Society is the leading international forum for scientists and engineers engaged in the research, design and development of revolutionary advances in microsystems packaging and manufacture.