FOR IMMEDIATE RELEASE
Contact: Kristine Martin
October 11, 2005
202-466-7391 x124

Renowned Georgia Tech Professor C.P. Wong Wins IEEE Technical Field Award for Components, Packaging and Manufacturing Technology

  • C.P. Wong awarded IEEE Technical Field Award for Components Packaging and Manufacturing Technology - Award is one of the highest honors conferred by the IEEE
  • Recognizes advances in polymeric materials science and processes for highly reliable electronic packages
  • Wong’s contributions have spanned both the industrial and academic worlds and have contributed greatly to U.S. military applications and commercial electronics

Piscataway, N.J. – The IEEE is pleased to announce Professor C. P. Wong as the winner of the IEEE Technical Field Award for Components, Packaging and Manufacturing Technology. This IEEE award is part of its Technical Field Awards program and is sponsored by the IEEE CPMT Society. Wong was recognized for his contributions in advanced polymeric materials science and processes for highly reliable electronic packages.

Wong is a Regent’s Professor and the Institute Endowed Chair at the Georgia Institute of Technology, Atlanta, Ga. (USA), and has more than 25 years of experience researching and developing polymeric materials in electronics packaging, vital to the electronics industry. Highlights from his career:

  • Holds over 40 U.S. patents, has published more than 450 technical papers, and has delivered hundreds of presentations around the world
  • During his graduate study at Penn State, Wong synthesized the first known lanthanide and actinideporphyrin complexes – a break-through in metalloporphyrin chemistry
  • Served as a former president and technical vice president of the IEEE CPMT Society and is currently an elected CPMT Society Board of Governor
  • Received the IEEE CPMT Society’s Sustained Technical Contributions Award and Exceptional Technical Contributions Award in 1995 and 2002, respectively.
  • Was elected an AT&T Bell Laboratories Fellow an and IEEE Fellow in 1992
  • Was elected a member of the National Academy of Engineering in 2000
  • Was elected the Georgia Tech Class of 1934 Distinguished Professor in 2004
  • Was named Holder of the Georgia Tech’s Institute Endowed Chair in 2005
  • Served as the program and general chair of the International Microelectronic and Packaging Society (IMAPS) , the IEEE CPMT Society’s ECTC and Advanced Materials for the organization’s packaging conferences

Dr. Phil Garrou, President of the IEEE CPMT Society noted, "Knowing C.P. as both a collaborator and a friend, it is clear that he has shown leadership and initiative in all of his activities while at AT&T, Georgia Tech and his long-time involvement with the IEEE CPMT Society. His prolific research activities span many areas of microelectronics and have helped solve many of today’s leading edge issues such as underfilling of wafer level packaging."

Prof. Rao R. Tummala, Director of Georgia Tech’s Microsystems Packaging Research Center added, "Prof. Wong's contributions span both the industrial and academic worlds. For the past 15 years, he has changed the prevailing view in industry that polymers cannot be reliable. He has shown that polymers can achieve reliability without being hermetic. In the academic world, he has demonstrated that polymeric underfills can be designed at the molecular level to contribute to reliability of solder joints in today's electronics.”

The award was established in 2002 and may be presented to an individual or a small team involved in device and systems packaging, including packaging of microelectronics, optoelectronics, RF and wireless and micro-electro-mechanical systems (MEMS). The award will be presented to Prof. Wong at the 2006 Electronic Components and Technology Conference (ECTC) in San Diego, Ca. (USA).

About the CPMT Society
IEEE Components, Packaging and Manufacturing Technology (CPMT) Society is the leading international forum for scientists and engineers engaged in the research, design and development of revolutionary advances in microsystems packaging and manufacture. Visit www.cpmt.org for more information.