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IEEE Singapore Rel/CPMT/ED Chapter Reliability (Rel), Components, Packaging and Manufacturing Technology (CPMT) and Electron Devices (ED).
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Chapter news |
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Past Activities |
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REL/CPMT/ED Chapter won the Reliability Society 2005 Best Chapter Award 2005
IEEE Reliability Society Chapter Awards results: |
EPTC 2009 11th Electronics Packaging Technology
Conference, December 2009 Singapore IPFA 2010 17th
IEEE INTERNATIONAL SYMPOSIUM ON THE PHYSICAL AND FAILURE ANALYSIS OF
INTEGRATED CIRCUITS - Suntec
05-09,
July, 2010 |
Recent Activities 3 Talks Related to Delamination in Plastic Encapsulated IC Packages Date: Time: DL Talk DL Talk Workshop
and IEEE EDS Mini-colloquium on NAnometer CMOS Technology IPFA 2009 16th
IEEE International Symposium on The Physical And Failure Analysis of
Integrated Circuits (IPFA2009) Dushu Lake Higher Education Town,
Suzhou, China, 06-10 July, 2009 Recent
Advances in Anisotropic Conductive Adhesives (ACAs) Interconnection Technology
– Low Temperature and Fast Assembly Methods Speaker:
Prof. Kyung-Wook Paik Korea
Advanced Institute of Science and Technology (KAIST), Date: Speaker : Prof Ganesh Subbarayan, School of
Mechanical Engineering, Date: 25 June 2009 (Friday) Simulations of
Near-Percolation Thermal Transport in
Particulate Systems” Speaker Prof Ganesh Subbarayan, School of
Mechanical Engineering, Date: Speaker : Professor Donald Wunsch M.K. Finley Missouri Distinguished
Professor Dept. of Electrical & Computer Engineering Missouri University
of Science & Technology Date : 22 May 2009, Friday Previous years Activities > Year 2004 |
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Contact: Jasmine Leong |
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