|
|
|
|
|
 | ||
| ||
|
||
Welcome to the (temporary) Georgia Tech CPMT Student Chapter Webpage. We have made the following information available while our own website is being contructed.
 |
Sermet Akbay |
 |
Devarajan Balaraman |
 |
Shashikant Hegde |
| President: | Shashikant Hegde, Ph.D. Student (ME) gte109x@mail.gatech.edu |
| Vice-President: | Devarajan Balaraman, Ph.D. Student (MSE) gte960w@mail.gatech.edu |
| Treasurer: | Sermet Akbay, Ph.D. Student (ECE) sermet@ece.gatech.edu |
| Chapter Advisor: | Dr. Leyla Conrad leyla.conrad@ece.gatech.edu |
Website (under development): http://www.prc.gatech.edu/students/student_council/index.htm
1. Distinguished Lecture Series: Several eminent professors and researchers from around the world, working in electronic packaging science were invited by the student chapter. The lecture series enabled students to enhance their knowledge outside the classroom.
| Date | Speaker | Topic |
|---|---|---|
| 04/13/2004 | Professor Ray Chen, Microelectronics Research Center, University of Texas, Austin | Fully Embedded Guided-Wave Board Level Optical Interconnection |
| 12/03/2003 | Prof. M. K. Surappa, Department of Metallurgy, Indian Institute of Science, Bangalore, India | Research on Metal Matrix Composites (MMCs) based on light alloy matrices at the Indian Institute of Science |
| 11/19/2003 | Professor Enboa Wu, Institute of Applied Mechanics, National Taiwan University, Taipei 106 Taiwan ROC | Determining Young’s Modulus, coefficient of thermal expansion, Poisson’s ratio and thickness of thin films on silicon wafer |
| 10/17/2003 | Prof. Mitsumasa Koyanagi, Tohoku University, Japan - Graduate School of Engineering, Dept. of Bioengineering and Robotics, Bio-Devices Lab | Three-Dimensional Integration Technology and Optical Interconnection |
| 09/12/2003 | T. Onishi, Grand Joint Technology Ltd., Hong Kong | Bare chip assembly site situation in Asia (COB, ACF Flip chip, LCD module) |
| 03/26/2003 | King L. Tai, Ph.D., Stevens Institute of Technology, Bell Labs Fellow, Chairman Technical Advisory Board, SyChip Inc. | SOC vs. SIP for Wireless Products |
2. Membership Drives: On August 28th 2003 we had a 2 hour student seminar on the
Georgia Tech campus. PRC director Prof. Rao Tummala addressed the students and
encouraged them to pursue careers in electronic packaging. During the seminar we
conducted a membership drive and handed out CD-ROMs of CPMT Transactions
compendium 1954-2002 to students who registered as CPMT student members.
We also set up a booth at the new student orientation program for freshman and transfer students at Georgia Tech called FASET (Familiarization and Adaptation to the Surroundings and Environs of Tech). The booth was intended to attract undergraduate students to electronic packaging research and education. We highlighted the activities of the CPMT and the PRC.
3. Social Event: To give students a break from work and to enable them to interact in an informal setting, we organized a bowling event in summer 2003. Five bowling alleys and five pool tables were reserved at the Georgia Tech recreational center for three hours. Food and drinks were also served.
4. CPMT/ECTC Booth: The student chapter was present at a booth in the CPMT sponsored 53rd Electronic Components Technology Conference (ECTC) 2003. We will also be present at a booth in ECTC 2004 from June 2-4 2004.
We hold monthly student seminars in different research thrusts of electronic packaging such as Digital, RF, Optoelectronics and Wafer Level Packaging. We rotate the focus of the seminar each month and two students chosen for each seminar share their latest research progress. Around 35-40 students attend each month. In addition to disseminating knowledge of their research the seminars also help in the professional development of students.
The student chapter meets every two weeks to discuss various activities. Currently we are focusing on developing and adding content to our website. Our chapter advisor, Dr. Leyla Conrad, encourages our activities.