IEEE Components, Packaging, & Manufacturing Technology Society

CPMT Technical Commitee
on Fiber Optics & Photonics (TC-10)

TC-10 addresses all issues of packaging/testing/assembly/manufacturing of fiberoptic and photonic components and modules:

Component and Module Design for Manufacturing;

Integration and Planar Waveguide Technology;

Fiber and Fiber Array Design for Efficient & Reliable Alignment;

Fiber-Optic Coupling Design for Manufacturing;

Optical Bench & Passive Alignment Technology;

Materials, Thermal, Optical, Mechanical and RF Optimization for Photonic

Packaging Design;

Hermetic and Non-Hermetic Packaging;

Packaging Process Design;

Active Alignment Methods and Tools;

Laser Welding, Laser Soldering and Adhesive Bonding Process Development;

Packaging Materials;

Package Reliability Requirements & Reliability Design;

Optical PCB and Optical Free-Space Interconnection;

Packaging, Assembly and Testing Automation Technologies.

Associated activities:

53rd ECTC – Sheraton New Orleans, New Orleans, Louisiana, USA. May 27-30, 2003

TC-10 is organizing a number of sessions at the Electronic Components and Technology Conference,

See the technology program , and other information on the optoelectronics packaging sessions.

For more information, or to join our TC, send an email note or letter to: Prof. Frank G. Shi, the TC Chair OptoElectronic Integration & Packaging Lab UC-Irvine Irvine, CA 92697 USA +1-949-824-5362 FAX: +1-949-824-2541 Anyone can be an participating member of one or more of the CPMT Society's TCs without belonging to the IEEE; most of our TCs have a mailing list, a newsletter, and a networking listing. CPMT Society Publications | Technical Committees | Chapters | Conferences | Educational Opportunities | Awards | Membership Last updated on || Send comments to Jenny Zhang.