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CPMT Technical Commitee
on Fiber Optics & Photonics (TC-10)


TC-10 addresses all issues of packaging/testing/assembly/manufacturing of fiberoptic and photonic components and modules:
Component and Module Design for Manufacturing;
Integration and Planar Waveguide Technology;
Fiber and Fiber Array Design for Efficient & Reliable Alignment;
Fiber-Optic Coupling Design for Manufacturing;
Optical Bench & Passive Alignment Technology;
Materials, Thermal, Optical, Mechanical and RF Optimization for Photonic
Packaging Design;
Hermetic and Non-Hermetic Packaging;
Packaging Process Design;
Active Alignment Methods and Tools;
Laser Welding, Laser Soldering and Adhesive Bonding Process Development;
Packaging Materials;
Package Reliability Requirements & Reliability Design;
Optical PCB and Optical Free-Space Interconnection;
Packaging, Assembly and Testing Automation Technologies.

Associated activities:
* 53rd ECTC – Sheraton New Orleans, New Orleans, Louisiana, USA. May 27-30, 2003
TC-10 is organizing a number of sessions at the Electronic Components and Technology Conference,
See the technology program , and other information on the optoelectronics packaging sessions.

For more information, or to join our TC, send an email note or letter to:
Prof. Frank G. Shi, the TC Chair
OptoElectronic Integration & Packaging Lab
UC-Irvine
Irvine, CA 92697 USA
+1-949-824-5362
FAX: +1-949-824-2541

Anyone can be an participating member of one or more of the CPMT Society's TCs without belonging to the IEEE; most of our TCs have a mailing list, a newsletter, and a networking listing.

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Last updated on || Send comments to Jenny Zhang.