Sponsored Workshop and Conferences
The EDMS sub-committee currently sponsors four major conferences which are:
- Electrical Performance of Electronic Packaging - EPEP
- http://www.epep.org
- Held once a year in USA.
- Signal Propagation on Interconnects - SPI
- http://www.spi.uni-hannover.de
- Held once a year in Europe.
- Electrical Design of Advanced Packaging and Systems - EDAPS
- http://www.edaps2008.org
- Held once a year in Asia.
- International Symposium of Quality Electronic Design - ISQED
- http://www.isqed.org
- Held once a year in USA.