This
committee is chartered jointly with the IEEE Computer Society.
CPMT Technical Commitee
on Systems Packaging (TCSP)
This committee provides a global view of the impact of
microarchitecture, semiconductor
properties and packaging technologies upon the performance and cost of
electronic
and
photonic systems. Of particular interest are systems for the following
classes
of products: computing, wired and wireless communications, automotive,
military, aerospace and portable equipment. The TC deals with the
interactions between the chips and the mechanical design, electrical
design and thermal design aspects of the interconnection products that
support them. Activities for the TC are one or two 3-day workshops each
year.
These meetings mainly deal with the system application and tradeoff
considerations for organic and ceramic SCM and MCM first level
packages, organic circuit boards, connectors, cables, and the related
power distribution and heat removal hardware. Over the years, the
participants in the Systems Packaging Technical Committee Workshops
have discovered that every designer, independent of specialty, will
benefit from understanding the pervasive nature of the decision
processes
used in choosing the technologies for an electronic system.
Upcoming Events
2008
Systems
Packaging Japan Workshop; January
28th - January
30th; Hakone (near
Odawara), Japan
Past Programs
Portable
2007; March 25th
- March 29th;
Orlando, Florida
-- USA
2007 European Systems
Packaging Workshop; January
29th - January 31st; Como -- Italy
2006
Second
International Workshop on SOP, SIP, SOC (3S) Electronics; September
28th - September 29th, Atlanta, GA, USA
2006
Systems
Packaging Japan Workshop; January
30th - February 1st; Hakone (near
Odawara), Japan
2005
European
Systems Packaging Workshop; January 31st - February 2nd,
2005; Park Inn Hotel, Berlin, Germany
- Associated activities:
- 3S
Workshop at PRC at Georgia Tech, European
and Japanese System Packaging Workshops
- Topical
Meeting on Electrical Properties of Electronic Packages
- Electronic
Components and Technology Conference (ECTC)
International
Conference on Portable Information Devices
Workshop Photos
For more information, to join our TC, or to volunteer for a
leadership position in the TC, send an email note to:
Anyone can be a participating member of one or more of the CPMT
Society's TCs without belonging to the IEEE; most of our TCs have a
mailing list,
a newsletter, and a networking listing.
Please see our workshop reports in the CPMT Newsletter at:
http://www.ewh.ieee.org/soc/cpmt/newsletter/index.html
Last Updated: July 11, 2007