ESPW09

IEEE Computer Society

Notice: The Technical Committee on Systems Packaging has postponed the European Systems Packaging Workshop (ESPW) due to travel restrictions being experienced by program participants. This situation has been caused by the current worldwide economic conditions. The workshop was originally scheduled for February 2 – 4, 2009 in Kinsale, Ireland. Contingent upon a more favorable economic environment, the workshop will be rescheduled for late April 2009.

Because of pervasive employer travel restrictions, the 2009 ESPW has been canceled. Future workshops are planned when worldwide economic conditions improve.

Date: January 25, 2009

The IEEE Technical Committee on Systems Packaging (TC-SP) wishes to invite you to its 11^th European Workshop. Our goal is to view all types of packaged electronics from the macro perspective with emphasis on the overall technical system attributes, choices and challenges. This includes the product specifications, system architecture, technologies, electrical performance, power design and thermal management. We approach the product characteristics by focusing on all levels of packaging as the "glue" that holds the entire hardware system together. Consequently, designing the total package requires an intimate knowledge of all the technologies that go into the final product. This perspective leads to a broad knowledge of what's going on in all aspects of the worldwide electronics industry. So if you can't go to all the sub-specialty conferences and you want an in-depth big picture view of the latest developments in the field of electronics, you should seriously consider attending this workshop.

The workshop will be conducted in English. It will be held at the Trident Hotel. Program, hotel and registration information can be found at this website as it becomes available. The committee is looking forward to your participation.

Session Topics are:

2009 European Systems Packaging Workshop