Dear Colleagues:

The IEEE Technical Committee on Systems Packaging (TC-SP) wishes to invite you to its 9^th European Workshop. Our goal is to view all types of packaged electronics from the macro perspective with emphasis on the overall technical system attributes, choices and challenges. This includes the product specifications, system architecture, technologies chosen, electrical performance, power design and thermal management. We approach the product characteristics by focusing on all levels of packaging which is the "glue" that holds the entire hardware system together. Consequently, designing the total package requires an intimate knowledge of all the technologies that go into the final product. This perspective leads to a broad knowledge of what's going on in all aspects of the worldwide electronics industry. So if you can't go to all the sub-specialty conferences and you want a in-depth big picture view of the latest developments in the field of electronics, you should seriously consider attending our workshops.

We chose Berlin because it is a modern, historical and vibrant city. Some free time is built into the workshop schedule for a tour of parts of the city. There will also be a short tour of the Fraunhofer IZM labs at the conclusion of our program. There is one thread of presentations so you can see all the subjects on the program. Workshops are informal and interactions among all the attendees are encouraged. We want you to meet new interesting people and we hope you will learn more through informal conversations. This is why both the hotel stay and all meals and receptions during the conference are included in the fee. Share a meal with a stranger and new knowledge and opportunities may ensue.

The program sessions titles are: 1) Ambient Intelligence;  2) Biotechnology and Biomedical Technologies;  3) Photonics and Interconnect Technology;  4) High Performance Computing; and  5) Micro and Nano-technology Heterogeneous System Integration. The speakers were invited because they are experts on their subjects. After listening to the presentations and networking with the speakers and attendees, we know you will be infused with all soughts of new knowledge. From this, new career opportunities may ensue.

The TC-SP committee hopes you will be able to attend and we look forward to meeting you in Berlin.

 


General Chair:                                 Rolf Aschenbrenner (Fraunhofer IZM)

General Co-Chair:                           Christine Kallmayer (Fraunhofer IZM)

Program Chair:                                Thomas-Michael Winkel (IBM Germany)

Co-program Chair:                          Cian Ó Mathúna (NMRC, University Cork College )

Technical Program Committee:     Evan Davidson (IBM US - Ret.)

                                                           Erich Klink (IBM Germany)