The 9thEuropean
Workshop of the
IEEE's CPMT and Computer Societies Systems Packaging Committee (TC–SP)
will be held this year in Berlin, Germany
on January 31 – February 2, 2005
at the Park
Inn Hotel, Berlin-Alexanderplatz
Workshop
Program
Monday:
January 31, 2005
Registration in the
hotel lobby: 8:00 to 12:00
Lunch
at 12:00
Start of Afternoon Session is 13:00
Keynote
Presentation
"The History of Electronic Packaging"
Evan Davidson (IBM USA -
Ret.)
Session
1:
Ambient
Intelligence
Session Chairs: Cian Ó Mathúna (Tyndall),
Christine Kallmeyer (Fraunhofer IZM)
Keynote
Presentation
"Ambient Intelligence - Industrial
Research on a Visionary Concept"
Werner Weber (Infineon)
"FCOS: Flip Chip Technology for Smart Card
(contact based) Modules
Peter Stampka (Infineon)
"FP6-IST-IP-SHIFT:
An EC Funded Project on
Smart High-integration Flex Technologies"
Jan
Vanfleteren (IMEC)
Coffee
Break
"System
Integration Technologies for Electronics in Textiles"
Torsten
Linz (Fraunhofer IZM)
"Electronic System Design for a Minimum
Power Wireless Temperature Sensor"
Mr. Rochlitzer (ESYS GmbH)
"Micropower Delivery for Ambient
Intelligence"
Cian Ó Mathúna (Tyndall National Institute, Ireland)
Welcome Reception
followed by Dinner (17:30 - 19:45)
Start of Evening Session
is 20:00
Session
2:
Biotechnology
&
Biomedical Technologies
Session Chair:
Malcolm Wilkinson
"Biochip-compatible Packaging of
Transducer Chips for Point-of-Care"
Thomas Velten (Fraunhofer IBMT)
"Advancing
Point-of-Care Diagnostics Through Micro and Nano-technology"
Peter Laitenberger (Sphere Medical)
"Packaging and Integration of
Non-planar Medical Devices"
R. J. Dickinson (Dept. of Bioengineering, Imperial College)
A. R. Pacey (Advotek Medical Devices, Ltd.)
"Applications of Photonics Technology
to Microfluidics"
Graeme Maxwell (Center for Integrated Photonics)
Tuesday:
February 1, 2005
Breakfast from 7:00 to 7:45
Start of Morning Session is 8:00
Keynote
Presentation
"Current View of Package Technology Opportunities in the 45
nm
Silicon Generation"
Bob Guernsey (IBM USA)
Session
3:
Photonics
& Interconnect Technology
Session Chairs: Elmar Griese (University Siegen),
Padraig Hughes (Tyndall)
"Optical Interconnections on PCBs:
Fundamentals - Technology - Design"
Elmar Griese (University Siegen)
"Direct Write Technology for Photonic
Packaging/Assembly"
Padraig Hughes (Tyndall National
Institute, Ireland)
"Methods for Precision Bonding of
Optoelectronic Components"
Hermann Oppermann, Matthias Hutter, Rafael Jordan
(Fraunhofer IZM)
Coffee
Break
"Optical Interconnections
in the HOLMS
Shared Memory Computing System"
Lukowitz (University for Health Sciences Medical Informatics
& Technology)
"High-end Computing Needs: Optics vs.
Electrical Crossover
(The Packaging Challenges of Integrating Optics into High-end Servers)"
Marc Taubenblatt (IBM USA)
Lunch
Free Afternoon
(An optional tour is being planned.)
Dinner with entertainment at 18:00
Start of Evening Session is 20:00
Session
4: High
Performance Computing
"Power Integrity in High Speed Package Design"
Bill Samaras (Intel)
"System Packaging Technology for the z990 High-end Mainframe"
Hubert Harrer (IBM Germany)
"New Packaging Technology for the Fujitsu High-speed Servers"
Haruhiko Yamamoto (Fujitsu)
"System Packaging Technology for the p570 Mid-range AIX/Linux Server"
Michael Fisher (IBM USA)
"Power and System Design for the SR11000 Computer"
Masakazu Yamamoto (Hitachi)
"Packaging Technology for the IBM BG/L Supercomputer"
Burkhard Steinmacher-Burow (IBM USA)
Wednesday:
February 2, 2005
Breakfast from 7:00 to 7:45
Start of Morning Session
is 8:00
Session
5:
MNT
(Micro & Nano-technology)
Heterogeneous System Integration
Session
Chair:
Rolf Aschenbrenner
Rao Tummala (Georgia Tech, USA)
Klaus Pressel (Infineon Technologies AG)
"Heterogeneous System Integration at the Wafer Level"
Erik Jung (Fraunhofer IZM)
"Wafer-scale Encapsulation for RF MEMS"
Charlotte Gillot (CEA-LETI)
Coffee Break
Keynote Presentation
"Hetero-system Integration Technologies: Challenges & Choices"
Herbert Reichl (Fraunhofer IZM/Technical University of Berlin)
"A System-in-a-Package Integration of
a 60 GHz Radio Transmitter
for Next Generation WLAN Applications"
Chul Soon Park (IT Engineering, The Information &
Communications University, Korea)
"Technology Development for
System-in-Package"
Marc de Samber (Philips CFT)
Closing Remarks (General Chair)
Meeting will end after lunch at 13:00
An optional afternoon tour to the Fraunhofer IZM Labs is scheduled. (A
bus will be provided.)
The tour will end at approximately 16:00.