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Newsletter October/November 2002

Dear Madams, dear Sirs,

this time the emphasis of this newsletter lies on information about Conferences and Events with their various Call for Papers.

Preliminary information:

But first of all there are several attachments included. The three .pdf-files are

1.) about the a new MEMS Science and Development Center, build by the University of South Florida (PDF Article);

2.) about R&D scientists who are developing bio-field-effect transistors and electrostatic generators that fit on a person's ring finger and power biological sensors implanted throughout the body via a wireless connection (PDF Article) and

3.) an article from Spencer Chin - "MEMS attempt to move into mainstream" about the future of MEMS (PDF Article).

4.) A short summary / overview on the topics being addressed on the 2000 IMAPS MEMS Workshop in Denver, Colorado, which took place on September Sept 6-8 2002 (TXT File).

Upcoming Conferences / Events and Call for Paper:

Conference	Date	Venue	Call open until	Contact	URL
AMAA 2003			Nov. 30^th, 2002	abstracts@amaa.de	http://www.amaa.de/call.html
DTIP 2003		Mandelieu-La Napoule	Nov 1^st, 2002	- call closed -	http://tima.imag.fr/conferences/dtip/DTIP2003/Cfp.html
2003 European Systems Packaging Workshop	Jan 25^th-31^st, 2003	Cork, Ireland	Nov 15^th, 2002	- call closed -	http://www.ewh.ieee.org/soc/cpmt/tc14/
2003 Photonics West, Symposium on MicroFabrication	Jan 25^th-31^st, 2003	San José, USA	____	- call closed -	http://spie.org/Conferences/Programs/03/pw/mf/
2003 Microtechnology Conference	Feb 23^rd-27^th, 2003	San Francisco, USA	____	- call closed -	http://www.nanotech2003.com/microtech2003.html
2003 Design Test Interconnect and Packaging (DTIP) of Microsystems	May 5^th-7^th, 2003	Cote d´Azur, France	____	- call closed -	http://tima.imag.fr/conferences/dtip/DTIP2003/Cfp.html
2003 AMAA	May 22^nd-23^rd, 2003	Berlin, Germany	____	- call closed -	http://www.amaa.de/
2003 Interpack	July 06^th-11^th, 2003	Maui, USA	____	- call closed -	http://www.asmeconferences.org/interpack03/
2003 ICMENS	July 20^th-23^rd, 2003	Banff, Canada	____	- call closed -	http://www.icmens.org/

	AMAA 2003 This announcement addresses representatives from industry as well as from academia to submit papers for the conference. If you are interested in presenting a paper, please send a one page abstract in English by November 30, 2002 to the AMAA conference office. The abstract should clearly describe the scope, key points and significance of the paper. Abstracts should be submitted by e-mail to abstracts@amaa.de. The preferred format is PDF or Microsoft Word. Selection of papers by our Steering Committee will be made until January 17, 2002. The complete call for papers is available for download in PDF-Format (304 kB). AMAA 2003 Call for Paper: http://www.amaa.de/call.html
	DTIP (Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS) 2003 You can look up the Call for Paper at: http://tima.imag.fr/conferences/dtip/DTIP2003/Cfp.html This Symposium will be a follow-up to the very successful issues held in 1999 and 2000 in PARIS and in 2001 and 2002 in Mandelieu-La Napoule. This series of Symposia is a unique single-meeting event expressly planned to bring together participants interested in manufacturing microstructures and participants interested in design tools to facilitate the conception of these microstructures. Again, a special emphasis will be put on the very crucial needs of MEMS/MOEMS in terms of packaging solutions. The goal of the Symposium is to provide a forum for in-depth investigations and interdisciplinary discussions involving design, modeling, testing, micromachining, microfabrication, integration and packaging of structures, devices, and systems. DTIP 2002 was a great success, with 50% more submissions than in 2001. DTIP 2003 is expected to be again very attractive. We look forward to welcoming you to Mandelieu-La Napoule and encourage you to participate by submitting an abstract for one of the two Conferences. Submission of abstracts: 1 November 2002 (but just try!) Notification of acceptance: 31 December 2002
	2003 European Systems Packaging Workshop, Jan. 20-23, 2003 Call open till Nov. 15th http://www.ewh.ieee.org/soc/cpmt/tc14/ Cork, Ireland
	2003 Photonics West, Symposium on MicroFabrication, Jan. 25-31, 2003 Call closed http://spie.org/Conferences/Programs/03/pw/mf/ San Jose, USA
	2003 Microtechnology Conference, Feb. 23-27, 2003 Call closed http://www.nanotech2003.com/microtech2003.html San Francisco, USA
	2003 Design Test Interconnect and Packaging (DTIP) of Microsystems, May 5-7, 2003 Call closed Nov 1st, but give it a try! http://tima.imag.fr/conferences/dtip/DTIP2003/Cfp.html Cote d´Azur, France
	2003 AMAA (Advanced Microsystems for Automotive Applications), May 22-23, 2003 Call open till Nov. 30th http://www.amaa.de/ Berlin, Germany
	2003 Interpack, July 6–11, 2003 Call open till Nov. 22nd http://www.asmeconferences.org/interpack03/ Maui, USA
	2003 ICMENS, Jul., 20-23, 2003, Call open till Jan., 25th http://www.icmens.org/ Banff, Canada

Links:

TC-17 Home: http://www.ewh.ieee.org/soc/cpmt/tc17/

	AMAA 2003 This announcement addresses representatives from industry as well as from academia to submit papers for the conference. If you are interested in presenting a paper, please send a one page abstract in English by November 30, 2002 to the AMAA conference office. The abstract should clearly describe the scope, key points and significance of the paper. Abstracts should be submitted by e-mail to abstracts@amaa.de. The preferred format is PDF or Microsoft Word. Selection of papers by our Steering Committee will be made until January 17, 2002. The complete call for papers is available for download in PDF-Format (304 kB). AMAA 2003 Call for Paper: http://www.amaa.de/call.html
	DTIP (Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS) 2003 You can look up the Call for Paper at: http://tima.imag.fr/conferences/dtip/DTIP2003/Cfp.html This Symposium will be a follow-up to the very successful issues held in 1999 and 2000 in PARIS and in 2001 and 2002 in Mandelieu-La Napoule. This series of Symposia is a unique single-meeting event expressly planned to bring together participants interested in manufacturing microstructures and participants interested in design tools to facilitate the conception of these microstructures. Again, a special emphasis will be put on the very crucial needs of MEMS/MOEMS in terms of packaging solutions. The goal of the Symposium is to provide a forum for in-depth investigations and interdisciplinary discussions involving design, modeling, testing, micromachining, microfabrication, integration and packaging of structures, devices, and systems. DTIP 2002 was a great success, with 50% more submissions than in 2001. DTIP 2003 is expected to be again very attractive. We look forward to welcoming you to Mandelieu-La Napoule and encourage you to participate by submitting an abstract for one of the two Conferences. Submission of abstracts: 1 November 2002 (but just try!) Notification of acceptance: 31 December 2002
	2003 European Systems Packaging Workshop, Jan. 20-23, 2003 Call open till Nov. 15th http://www.ewh.ieee.org/soc/cpmt/tc14/ Cork, Ireland
	2003 Photonics West, Symposium on MicroFabrication, Jan. 25-31, 2003 Call closed http://spie.org/Conferences/Programs/03/pw/mf/ San Jose, USA
	2003 Microtechnology Conference, Feb. 23-27, 2003 Call closed http://www.nanotech2003.com/microtech2003.html San Francisco, USA
	2003 Design Test Interconnect and Packaging (DTIP) of Microsystems, May 5-7, 2003 Call closed Nov 1st, but give it a try! http://tima.imag.fr/conferences/dtip/DTIP2003/Cfp.html Cote d´Azur, France
	2003 AMAA (Advanced Microsystems for Automotive Applications), May 22-23, 2003 Call open till Nov. 30th http://www.amaa.de/ Berlin, Germany
	2003 Interpack, July 6–11, 2003 Call open till Nov. 22nd http://www.asmeconferences.org/interpack03/ Maui, USA
	2003 ICMENS, Jul., 20-23, 2003, Call open till Jan., 25th http://www.icmens.org/ Banff, Canada

Newsletter October/November 2002

Dear Madams, dear Sirs,

Preliminary information:

Upcoming Conferences / Events and Call for Paper:

AMAA 2003

DTIP (Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS) 2003

2003 European Systems Packaging Workshop, Jan. 20-23, 2003 **Call open till Nov. 15th**

2003 Photonics West, Symposium on MicroFabrication, Jan. 25-31, 2003 **Call closed**

2003 Microtechnology Conference, Feb. 23-27, 2003 **Call closed**

2003 Design Test Interconnect and Packaging (DTIP) of Microsystems, May 5-7, 2003 **Call closed Nov 1st, but give it a try!**

2003 AMAA (Advanced Microsystems for Automotive Applications), May 22-23, 2003

**Call open till Nov. 30th**

2003 Interpack, July 6–11, 2003 **Call open till Nov. 22nd**

2003 ICMENS, Jul., 20-23, 2003, **Call open till Jan., 25th**

Links:

2003 European Systems Packaging Workshop, Jan. 20-23, 2003 Call open till Nov. 15th

2003 Photonics West, Symposium on MicroFabrication, Jan. 25-31, 2003 Call closed

2003 Microtechnology Conference, Feb. 23-27, 2003 Call closed

2003 Design Test Interconnect and Packaging (DTIP) of Microsystems, May 5-7, 2003 Call closed Nov 1st, but give it a try!

Call open till Nov. 30th

2003 Interpack, July 6–11, 2003 Call open till Nov. 22nd

2003 ICMENS, Jul., 20-23, 2003, Call open till Jan., 25th