A new technical committee has been established to address Packaging Issues for MEMS, Sensors and Microsystems.
To maximize efforts, this TC is coordinating its efforts with IMAPS and ASME. The key goals of this committee are to increase international awareness of the issues facing MEMS and Microsystems and participate in activites toward solutions through:
· Education, funding and strategy
· Encouragement and support for the development of packaging foundry infrastructure
This committee places an international focus on the development, characterization, and commercial support for packaging, assembly, and test infrastructure for key MEMS applications areas such as:
· Fluidic Systems
· Optical Systems
· Automotive Systems
· Military Systems
· Telecommunications and RF
Associated activities include:
· The Electronic Components and Technology Conference (ECTC)
·
Special Sections in the IEEE
Transactions on Advanced Packaging
(See the Special Section on Mechatronics
& MEMS Packaging)
· Automotive Systems
· Military Systems
· Telecommunications and RF
For more information, to join our TC, or to volunteer for a leadership position in the TC, send an email note or letter to:
Erik
Jung, the TC Chair
Fraunhofer IZM
Germany
Phone: +49.30.46 40 3-230
Anyone can be an participating member of one or more of the CPMT Society's TCs without belonging to the IEEE; most of our TCs have a mailing list, a newsletter, and a networking listing. You can also contact the webmaster who will initiate contacts concerning tc17, takes suggestions concerning this page or add you to the newsletter-mailing list.