Technical Scope: This TC facilitates and provides a forum to communicate the technical information on emerging and advanced electronic packaging materials.  The scope also includes the processes, tools, characterization, modeling and simulation techniques used in the under-standing and development of these materials.  

Chair: Rajen Chanchani, MS 1074, Dept. 1726, Sandia National Labs, Albuquerque, NM 87185.  Phone:  505-844-3482 (work), 505-275-1260(Home).  Fax: 505-844-7011.  E-mail: chanchr@sandia.gov

Vice Chair: C. C. Lee, University of California, Irvine, CA 92697. Phone: 949-824-7462, Fax: 949-824-3732.  Email: cclee@uci.edu.  

Please scroll down for the minutes of the meeting

Committee Members: 

Richard Benson – The John Hopkins University. E-mail: richard.benson@jhuapl.edu 
Bill Brown – University of Arkansas, E-mail wob@engr.uark.edu
Sridhar Canumalla – Nokia Mobile Phones.  Email: firstname.lastname@nokia.com
Rajen Chanchani – Sandia National Labs. E-mail: chanchr@sandia.gov
Phil Garrou – Dow.  Email: p.garrou@ieee.org
C. C. Lee, University of California, Irvine, Email: cclee@uci.edu 
Jim Morris – Binghamton University.  E-mail:  j.e.morris@ieee.org
Dave Palmer – Sandia National Labs, E-mail: palmerdw@sandia.gov
Ted Tessier – Microsystems Engineering Inc.  E-mail: tessier@biotronik.com 
Paul Wesling – Tandem Computers.  E-mail: p.wesling@ieee.org

Masazami Amagai – Texas Instruments (Japan). E-mail: amai@ti.com
Rick Bressers, Phillips Semiconductors (Netherlands), E-mail:  H.J.L.Bressers@philips.com
William T. Chen, IMR (Singapore), E-mail: Wt-chen@imre.org.sg
K. S. Chiang, Nanyang Technical University (Singapore) , E-mail: Askschian@ntu.edu.sg
Alex Kader, OSE (UK), E-mail:  Alex.kader@paeurope.com
Charles Lee, Infineon Technologies(Singapore), E-mail: Charles.lee@infineon.com
Johan Liu, Chalmers University of Technology (Sweden),  E-mail: johan.liu@pe.chalmers.se
Kyung W. Paik, KAIST (Korea,) E-mail: Kwpaik@sorak.kaist.ac.kr
John H. L. Pang, Nanyang Technical University(Singapore), E-mail: Mhlpang@ntu.edu.sg
Somnuek Thongprasert, AMD (Thailand), E-mail: Somnuek.thongprasert@amd.com

TC Chair Term: January 1, 2000 – December 31, 2004. 

Communications: 

• A newsletter that covers all the news related to Materials. 

• The Chair, Vice Chair, and Executive Committee members routinely communicate through e-mail and telephone. 

• General membership receives announcements for conferences, workshops and symposia.

• The highlights of the Materials Conference are summarized in the CPMT newsletter.

Meetings: 

·         The Executive Committee meets every year during the ECTC Annual Meeting. 

·         TC-5 has one international meeting per year.  (In 2000, TC-5 meeting was held in Singapore.  In 2001, the international meeting will be held in Korea.) 

·         The committee chair attends the Board of Governor’s meeting every six months to keep BOG members and other TC Chairs informed of new developments. 

·         The TC chair attends special meetings called by the TC Vice President to determine the future roadmap of the society. 

·         On rare occasions, a teleconference call will be conducted when warranted.

Web Assets: http://www.cpmt.org/tc/tc5. The site is primarily used for general announcements, committee newsletters and conference details. Sridhar Canumalla is the webmaster for this web site.

Conferences: 

·         Materials-related sessions during ECTC (TC-5 sponsors).

·          International Materials Conference (IEEE-CPMT (TC-5) co-sponsors) held in March every year in Braselton, GA.  

·         International conferences on specific Materials (from time to time) (TC-5 sponsors) 

·         Electronic Packaging and Technology Conference - 2000, Singapore, (TC-5 to co-sponsor).

·         Polytronic 2001, Potsdam, Germany, October 21-24, 2001 (TC-5 sponsors).

·         International Conference on Electronic Materials and Packaging – 2001, Korea, November 19-22, 2001.

Publications: 

·         The Proceedings of  Materials Conference (TC-5 co-sponsors) 

·         The Transactions of CPMT (TC-5 contributes the technical papers, reviews potential papers for publication and acts as associate editors) 

·         The Proceedings of International Electronic Packaging Conference.

·         The proceedings of Electronic Materials and Packaging.

Collaborative Efforts: 

·         Actively collaborating with IMAPS, American Ceramic Society, American Society of Metals, Society of Plastic Engineers and Materials Research Society. 

·         Also collaborates with international chapters of these major societies.

Volunteers: TC-5 has approximately 20 volunteers each year, consisting of the Executive Committee, the conference officers, the session chairs, paper reviewers and associate editors.

Awards and Recognition: 

·         An Outstanding Paper Award is presented at the Packaging Materials Conference every year. 

·          Lifetime Achievement Award in Packaging Materials presented during the Atlanta Materials Conference.

Member Database: Working with IEEE-CPMT to screen the current CPMT members who have shown Materials as one of their interests.   A database will be prepared based on this initial list

TC Reviews: No TAB reviews in 2000.

TC-5’s Future Plans for 2001

Material Database: CINDAS database, which is prepared by Purdue University under the sponsorship of SRC, is now available to IEEE-CPMT members at 10% discount

Web Assets: TC-5 website is up and running. 

New International Focus:   TC-5 has reached out to international members by holding the technical committee meeting last year in the far east.  This effort will be continued this year.

Publications: Consideration is being given to co-publishing papers with other societies like Materials Research Society in the Journal of Electronic Materials.  This item is still in early feasibility stage.

Membership and Volunteers: Members from the members database are being recruited for various volunteer activities.

Minutes of the Meeting

Message from the Chair - Rajen Chanchani

Hi Folks

We had good ECTC conference. The attendance at our TC-5 meeting was better than expected in spite of the economic conditions. The minutes of the TC-5 meeting is given below.

1. The meeting was held on May 28, 2003 7:00 to 8:00 AM.

2. The following members attended the meeting:

Richard Benson

William Brown

Eric Perfecto

Rajen Chanchani

Charles Lee

Chris C. Lee

Jim Morris

Kyung K. Paik

Dave Palmer

Paul wesling

3. I presented the status of TC-5 Committee.

4. There was a discussion on the conferences that TC-5 is

co-sponsoring. In the recent past, TC-5 has been sponsoring three conferences every year:

a) Materials Conference in Atlanta

b) Polytronic in Europe

c) Electronic Materials & Packaging (EMAP) Conference in Asia

5. According to Jim Morris, Materials conference traditionally held in Atlanta every year, did not have any compelling reason to be held there. His recommendation was to have this conference rotate every year between a city on east coast and on west coast. This meeting should probably tied to a university with strong packaging program. The committee decided that:

a) Next year (2004) meeting should continue to be held in Atlanta right after nano Workshop organized by Rao at GaTech. The advantage will be that the conference attendance will be favorably affected by this arrangement. Also, there is already a contract in place with the hotel and if it is violated then there could be a severe penalty to IEEE-CPMT. The conflict of interest between the workshop and conference does not arise because both meetings are co-sponsored by the same organizations, namely IEEE-CPMT and Ga Tech. The committee suggestion was to give significant discount in registration fees to the attendees attending both workshop and conference. For example, registration fees will be $300 if meeting is attended or $400 if both are attended. To save cost, the food (lunch) should not be served. Since next year meeting is in uptown Atlanta next to several good restaurants, this should not be a big problem for the attendees. However, whether to serve food or not will depend on the hotel contract that is in place.

b) Materials conference in 2005 should move to Irvine, CA, a west coast city. The conference will be tied to packaging group at U of Cal, Irvine. C. C. lee representing U of Cal, Irvine agreed with the arrangement.

6. Polytronic Conference in 2003 will be held in Montreaux, France. In 2004, it will be held in Portland , OR provided Polytronics Steering Committee approves it.

7. EMAP will be held in Singapore in 2003 without IEEE-CPMT sponsorship.

8. Rajen will renew the dialogue with Purdue to see if they would like to market their CINDAS Materials Database for a low price of around $200 or so.

9. We applaud Sridhar Canumalla's help in keeping the web page up-to-date. Due to recent change in his computer hardware, Sridhar's password to our web page does not work. He will call Paul Wesling (408) 252-9051 to work out the password issues with TC-5 web page. Subsequently, he will update the web page.

Thanks

Rajen