SCHEDULE
Click on a title to view the abstract.
Click here for a list of 2008 ASTR Workshop Presenters
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Wednesday 10/1/2008 |
Thursday 10/2/2008 |
Friday 10/3/2008 |
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7:00 AM Breakfast |
7:00 AM |
7:00 AM Breakfast |
7:00 AM |
7:00 AM Breakfast |
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8:00 AM Welcome Remarks Committee |
8:00 AM |
8:00 AM Announcements Committee |
8:00 AM |
8:00 AM Announcements Committee |
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8:10 AM Keynote 1 Mostafa Rassaian A Multidisciplinary Electronics Durability Analysis Tool with Unified Damage Model for Simulation of Accelerated Test & Flight Conditions |
8:10 AM |
8:10 AM Keynote 2 Milena Vujosevic Predictive Modeling and Drop/Shock Test for Assessment of Reliability of Lead-Free BGA Structures |
8:10 AM |
8:10 AM Keynote 3 Reza Ghaffarian Acceleration life/reliability/testing of electronic packaging and assemblies |
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9:00 AM Tutorial Joe Fjelstad Printed Circuit Boards: Design, Structures, Manufacturing, Reliability, Testing |
9:00 AM |
9:00 AM Physics of Failure Abhijit Dasgupta Drop Durability of BGA Assemblies |
9:00 AM |
9:00 AM Case Studies Intro Ping Zhao The Application of Accelerated Stress Testing for Active Implantable Medical Devices during Qualification and Product Development |
| 9:30 AM |
9:30 PM Physics of Failure William Roesch Reliability Evaluation of RF Amplifier Flip Chip Bumps |
9:30 AM |
9:30 AM Case Studies Harry W. McLean Estimating Field Failure Rate from the Results of HALT |
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| 10:00 AM |
10:00 AM BREAK 15 Minutes |
10:00 AM |
10:00 BREAK 15 Minutes |
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10:15 AM BREAK 15 Minutes |
10:15 AM |
10:15 AM Reliability Session Intro Charles Cohn Via to Via Isolation versus Quality of Via Formation in Organic Substrates |
10:15 AM |
10:15 PM Case Studies Paul Parker and Mike Silverman To ALT or not to ALT: A Case Study |
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10:30 AM Tutorial Milena Krasich Accelerated Reliability Growth Testing based on the Physics of failure; Methodology for the Test Design and Test Failure Data Analysis |
10:30 AM | 10:30 AM | ||
| 11:00 AM |
11:00 AM Reliability Mike Silverman Linking Leading Indicators with HALT and HASS |
11:00 AM |
11:00 PM Case Studies David Rahe PCBA Sulfur Corrosion Test |
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| 11:30 AM |
11:30 PM Lunch Speaker Roger Hill Wind Turbine Reliability - A Database and Analysis Approach |
11:30 AM |
11:30 AM Case Studies Tom Peters Rolling out a HASS process to off shore contract manufacturers |
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12:00 PM Lunch ASTR 2008 Committee Meeting |
12:00 PM | 12:00 PM |
12:00 PM Lunch |
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1:00 PM Tutorial Vasu S. Vasudevan Pb-free (SAC) Solder Joint Reliability Performances and Challenges Overview |
1:00 PM |
1:00 PM Reliability Sampsa Kuusiluoma Connector Reliability Evaluation Using Salt Spray Testing |
1:00 PM |
1:00 PM Equipment Session Intro Gregg K. Hobbs Elimination of the No Defect Found Problem |
| 1:30 PM |
1:30 PM Reliability Stephen Meschter Tin Whisker Considerations and New Standards for Managing Risks Associated with Lead-Free Solder Technology for Aerospace and Military Industries |
1:30 PM |
1:30 PM Equipment Session Kung-Jung (Kenny) Chung The Development and Verification of Accelerated Life Testing Circuits for Tire Pressure Monitoring System |
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| 2:00 PM |
2:00 PM Reliability Subhash G. Gedam Addressing Effects of Uncertainties in Fault Tree Analysis using Bootstrapped Data |
2:00 PM |
2:00 PM Equipment Session Eung-Ju Kim Accelerated Temperature and Voltage Stress testing System for Multi Layer Ceramic Capacitor Insulation Resistance |
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2:30 PM Physics of Failure Session Intro Abhijit Dasgupta, Yuxun Zhou Vibration Durability Models for Pb-free (Sn3.0Ag0.5Cu) and Pb-based (Sn37Pb) Solders |
2:30 PM |
2:30 PM Equipment Session Intro Gregg K. Hobbs Why Uniformity and Repeatability Are Not Necessary in HALT and HASS |
2:30 PM |
2:30 PM Equipment Session Frank Fan Wang Lead Free Solder Joints Accelerated Stress Comparison Testing |
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3:00 PM BREAK 15 Minutes |
3:00 PM |
3:00 PM BREAK 15 Minutes |
3:00 PM |
3:00 PM Reliability Silvestre Avila Hernández Testing Different Electronic Technologies with Same Test Template |
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3:15 PM Physics of Failure Bob Sykes Correlation of Failure Modes to Loading Speeds: High Speed Solder Ball Shear and Pull Tests Vs Board Level Mechanical Drop Tests |
3:15 PM |
3:15 PM Equipment Session Walter Fenk, John Schneider Manufacturing Stress Test for Desktop Motherboard Products |
3:15 PM | |
| 3:30 PM | 3:30 PM |
3:30 PM Wrap-up, Closing Statements |
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3:50 PM Physics of Failure Dima Smolyanski Understanding Failures in Microelectronic Packages Using Time Domain Reflectrometry Measurements |
3:50 PM |
3:50 PM Equipment Panel |
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4.20 PM Physics of Failure Keith Rogers Accelerated testing of High Density PWBs to Characterize CAF Formation Failures |
4:20 PM | |||
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5:00 PM Reception |
5:00 PM | |||
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6:30 PM Intel Tour |
6:30 PM | |||
| 7:00 PM |
7:00 PM Dinner Cruise |