 IEEE
Transactions on Editorial Board
Associate Editors: Til
Aach, Aachen University, til.aach@lfb.rwth-aachen.de
Scott T. Acton, University of Virginia, acton@virginia.edu Magdy Bayoumi, University of Louisiana at Lafayette, mbayoumi@cacs.louisiana.edu Mark R. Bell, mrb@ecn.purdue.edu Bruno Carpentieri, Universita' degli Studi di Salerno, bc@dia.unisa.it Vincent Caselles, Universitat Pompeu Fabra, vicent.caselles@upf.edu Gaudenz Danuser, The Scripps Research Institute, gdanuser@scripps.edu Ricardo L. de Queiroz, Universidade de Brasilia, queiroz@ieee.org Thomas S. Denney Jr., Auburn University, tdenney@eng.auburn.edu Sohail Dianat, Rochester Institute of Technology, sadeee@rit.edu Minh N. Do, University of Illinois at Urbana-Champaign, minhdo@uiuc.edu Peter Doeschuck, Cornell University, pd83@cornell.edu Pier Luigi Dragotti, Imperial College London, p.dragotti@imperial.ac.uk Michael Elad, The Technion - Israel Institute of Technology, elad@cs.technion.ac.il Reiner Eschbach, Xerox Webster Research Center, Reiner.Eschbach@xeroxlabs.com Brian L. Evans, The Unversity of Texas at Austin, bevans@ece.utexas.edu Zhigang (Zeke) Fan, Xerox Webster Research Center, Zhigang.Fan@xeroxlabs.com Mario A. T. Figueiredo, Instituto Superior Técnico, mario.figueiredo@lx.it.pt Hassan Foroosh, University of Central Florida, foroosh@cs.ucf.edu Onur G. Guleryuz, Polytechnic University, onur@danbala.poly.edu Lina J. Karam, Arizona State University, karam@asu.edu Zoltan Kato, University of Szeged, kato@inf.u-szeged.hu John Kerekes, Rochester Institute of Technology, kerekes@cis.rit.edu Anil Kokaram, Trinity College, akokaram@tcd.ie Eric Kolaczyk, Boston University, kolaczyk@math.bu.edu Ercan Kuruoglu, ISTI-CNR, kuruoglu@isti.cnr.it Xuelong Li, University of London, xuelong_li@ieee.org Luca Lucchese, Oregon State University, luca@eecs.orst.edu Kai-Kuang Ma, Nanyang Technological University, ekkma@ntu.edu.sg Gabriel Marcu, Apple Computer, marcu@apple.com Peyman Milanfar, University of California, Santa Cruz, milanfar@ee.ucsc.edu Aria Nosratinia, University of Texas at Dallas, aria@utdallas.edu Antonio Ortega, University of Southern California, ortega@sipi.usc.edu Sharathchandra Pankanti, IBM Watson Research, sharat@us.ibm.com Giovanni Poggi, Università Federico II di Napoli, poggi@cds.unina.it Stan J. Reeves, Auburn University, sjreeves@Eng.Auburn.edu Amy Reibman, AT&T Labs - Research, amy@research.att.com Eli Saber, Rochester Institute of Technology, esseee@rit.edu Philippe Salembier, UPC, philippe@gps.tsc.upc.edu Dan Schonfeld, University of Illinois at Chicago, dans@uic.edu Gaurav Sharma, University of Rochester, gsharma@ece.rochester.edu Ljubisa Stankovic, University of Montenegro, l.stankovic@ieee.org Srdjan Stankovic, University of Montenegro, srdjan@cg.ac.yu Sabine Susstrunk, Swiss Federal Institute of Technology (EPFL), sabine.susstrunk@epfl.ch Tamas Sziranyi, MTA SZTAKI Budapest, sziranyi@sztaki.hu Dimitri Van De Ville, EPFL, Dimitri.VanDeVille@epfl.ch Ying Wu, Northwestern University, yingwu@ece.northwestern.edu Yongyi Yang, Ilinois Institute of Technology, yy@ece.iit.edu Birsen Yazici, Rensselaer Polytechnic Institute, yazici@ecse.rpi.edu Laurent Younes, The Johns Hopkins University, laurent.younes@jhu.edu Miles Wernick, Illinois Institute of Technology, mwernick@ece.iit.edu Copyright (c) 2007 Institute of Electrical and Electronics Engineers, Inc. |