Welcome to WMED 2006

 

 

WMED Home

 

 

 

Call for Papers

 

 

 

Paper Submission

 

 

 

Conference Information

 

 

 

Technical Program

 

 

 

Presentation Guidelines

 

 

 

Registration Information

 

 

 

 

 

 

WMED 2006 Technical Program

Technical Program Schedule

The 2006 Workshop on Microelectronics and Electron Devices will be held at The Boise Centre on the Grove on April 14th from 9:00 am – 6:30 pm.

The Technical Program Schedule encompasses talks from industry leaders of high technology companies and institutions.

DOOR REGISTRATION (8:30 AM - 9:00 AM)

 

TUTORIALS (9:15 AM - 11:00 AM)

Christopher L. Henderson

Nozad Karim

President, Semitracks, Inc.

VP, App. Engrg. & Characterization

"Current Reliability and Failure Analysis Issues for High Volume Memory Products” 

Amkor Technology Inc

 

"3D Memory Packaging Technologies & Trends"

 

 

 

 

 

 

LUNCH (11:00 AM - 12:30 PM)

 

 

 

 

 

 

 

 

 

 

 

 

WELCOME/MAIN SESSION (12:30 PM – 4:00 PM)

Keynote

Al Fazio; Director, Memory Technology Development, Intel

"Future Directions of Non-Volatile Memory Technologies"

Invited Talk

Dennis Hess; William W. LaRoche, Jr. Chair, School of Chemical & Biomolecular Engineering, Georgia Tech

"Preserving Low-k Dielectrics During Photoresist and Etch Residue Removal"

Break

Invited Talk

Karl Strauss; Senior Engineer, Flight Avionics Systems, Jet Propulsion Laboratory

"Lest We Never Forget: A Historical Perspective of Space Data Recorders; A Prediction for the Future"

Invited Talk

Neil Goldsman; Professor, Department of Electrical Engineering; Univ. Of Maryland at College Park

"Physics Based Modeling and Design of Chips, Devices, and Nanostructures: Present and Future"

Break

3 PARALLEL SESSIONS (4:15 PM - 5:30 PM))

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

POSTER SESSION & SOCIAL (5:30 PM – 6:00 PM)

 

 

 

 

AWARDS & CONFERENCE CLOSING (6:00 PM - 6:30 PM)

Questions?

Questions concerning the Technical Program can be directed to:  David Hwang (Technical Program Chair):

mailto:dkhwang@micron.com 

  

 

 

This workshop is receiving technical cosponsorship support from the IEEE Electron Devices Society.

©2006 by the IEEE https://www.ieee.org